JPWO2019003042A1 - 半導体装置、および半導体装置の作製方法 - Google Patents
半導体装置、および半導体装置の作製方法 Download PDFInfo
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- JPWO2019003042A1 JPWO2019003042A1 JP2019526389A JP2019526389A JPWO2019003042A1 JP WO2019003042 A1 JPWO2019003042 A1 JP WO2019003042A1 JP 2019526389 A JP2019526389 A JP 2019526389A JP 2019526389 A JP2019526389 A JP 2019526389A JP WO2019003042 A1 JPWO2019003042 A1 JP WO2019003042A1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910002076 stabilized zirconia Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
Description
本実施の形態では、本発明の一態様に係るメモリストリング112を有する半導体装置の構成、および作製方法について、図1乃至図24を参照して説明する。
はじめに、本発明の一態様に係るメモリストリング112を有する半導体装置の構成について、図1を参照して説明する。図1(A)は、メモリストリング112を有する半導体装置の上面図である。また、図1(B)は、図1(A)にA1−A2の一点鎖線で示す部位の断面図である。また、図1(C)は、図1(A)にA3−A4の一点鎖線で示す部位の断面図である。なお、以下においては、図1に示すように、x軸、y軸、z軸からなる直交座標系を便宜上設定して説明する。ここで、x軸およびy軸は、メモリストリング112を設ける基体720の上面に平行な軸とし、z軸は基体720の上面に垂直な軸とする。
以下では、本発明に係る酸化物704に適用可能な金属酸化物について説明する。
以下では、本発明の一態様で開示されるトランジスタに用いることができるCAC(Cloud−Aligned Composite)−OSの構成について説明する。
酸化物半導体(金属酸化物)は、単結晶酸化物半導体と、それ以外の非単結晶酸化物半導体と、に分けられる。非単結晶酸化物半導体としては、例えば、CAAC−OS(c−axis aligned crystalline oxide semiconductor)、多結晶酸化物半導体、nc−OS(nanocrystalline oxide semiconductor)、擬似非晶質酸化物半導体(a−like OS:amorphous−like oxide semiconductor)、非晶質酸化物半導体などがある。
続いて、上記金属酸化物をトランジスタのチャネル形成領域に用いる場合について説明する。
ここで、金属酸化物中における各不純物の影響について説明する。
次に、本発明の一態様の半導体装置の作製方法の一態様を図2乃至図24を用いて説明する。なお、図2乃至図24の各図において、(A)は、z軸方向から見た上面図である。また、(B)は、(A)にA1−A2の一点鎖線で示す部位の断面図である。また、(C)は、(A)にA3−A4の一点鎖線で示す部位の断面図である。
本実施の形態では、開示する発明の一態様に係る記憶装置の回路構成および動作について、図25乃至図28を参照して説明する。
図25(A)に、3次元構造のNAND型不揮発性記憶装置(3D NAND)の構成例を示す。図25(A)に示す記憶装置100は、制御回路105、メモリセルアレイ110、および周辺回路を有する。
次に、メモリセル114へのデータの書き込みと読み出し動作について、図27、および図28を用いて説明する。
図28に示す期間t1の開始から期間t4の終了までの期間は、選択メモリセル114[1,1,1]にデータ“1”の書き込みを行っている。期間t1は、非選択のメモリセル114に誤った書き換えが行われるのを防止する期間である。期間t2は、選択メモリセル114[1,1,1]にデータ“1”を書き込む期間である。期間t3は、期間t1でプリチャージした電位を元に戻す期間である。期間t4は、各配線の電位を0に戻す期間である。
図28に示す期間t5の開始から期間t9の終了までの期間は、メモリセル114[1,1,1]にデータ“0”の書き込みを行っている。期間t5は、非選択のメモリセル114に誤った書き換えが行われるのを防止する期間である。期間t6は、期間t5で選択メモリストリング112[1,1]のみプリチャージした電位を0に戻す期間である。期間t7は、選択メモリセル114[1,1,1]にデータ“0”の書き込みを行う期間である。期間t8は、期間t5でプリチャージした電位を元に戻す期間である。期間t9は、各配線の電位を0に戻す期間である。
図28に示す期間t10の開始から期間t11の終了までの期間は、選択メモリセル114[1,1,1]に書き込まれているデータの読み出しを行っている。期間t10は、選択メモリセル114[1,1,1]に書き込まれているデータの読み出しを行う期間である。期間t11は、各配線の電位を0に戻す期間である。
図1に示す半導体装置が有するメモリストリング112では、メモリセル114aと、メモリセル114bと、が、導電体706を介して、電気的に接続されているが、これに限らない。例えば、メモリセル114aと、メモリセル114bとの間に、トランジスタを設けてもよい。本実施の形態では、メモリセル114aと、メモリセル114bとの間に、トランジスタが設けられたメモリストリング112を有する半導体装置の構成、回路構成、および動作について、図29乃至図33を参照して説明する。
本発明の一態様に係るメモリストリング112を有する半導体装置の構成について、図29を参照して説明する。図29(A)は、メモリストリング112を有する半導体装置の上面図である。また、図29(B)は、図29(A)にA1−A2の一点鎖線で示す部位の断面図である。また、図29(C)は、図29(A)にA3−A4の一点鎖線で示す部位の断面図である。なお、以下においては、図29に示すように、x軸、y軸、z軸からなる直交座標系を便宜上設定して説明する。ここで、x軸およびy軸は、メモリストリング112を設ける基体720の上面に平行にとり、z軸は基体720の上面に垂直にとる。
本発明の一態様に係る3D NANDの構成例の詳細は、図25(A)に示す3D NANDの構成例の説明を参酌することができる。
次に、メモリセル114へのデータの書き込みと読み出し動作について、図33を用いて説明する。なお、図29に示す選択トランジスタ116a、選択トランジスタ116b、メモリセル114(メモリセル114a、およびメモリセル114b)のIds−Vgs特性の説明は、図27に示すIds−Vgs特性を参酌することができる。
図33に示す期間t1の開始から期間t4の終了までの期間は、選択メモリセル114b[1,1,1]にデータ“1”の書き込みを行っている。期間t1は、非選択のメモリセル114に誤った書き換えが行われるのを防止する期間である。期間t2は、選択メモリセル114b[1,1,1]にデータ“1”を書き込む期間である。期間t3は、期間t1でプリチャージした電位を元に戻す期間である。期間t4は、各配線の電位を0に戻す期間である。
図33に示す期間t5の開始から期間t9の終了までの期間は、メモリセル114b[1,1,1]にデータ“0”の書き込みを行っている。期間t5は、非選択のメモリセル114に誤った書き換えが行われるのを防止する期間である。期間t6は、期間t5で選択メモリストリング112[1,1]のみプリチャージした電位を0に戻す期間である。期間t7は、選択メモリセル114b[1,1,1]にデータ“0”の書き込みを行う期間である。期間t8は、期間t5でプリチャージした電位を元に戻す期間である。期間t9は、各配線の電位を0に戻す期間である。
図33に示す期間t10の開始から期間t11の終了までの期間は、選択メモリセル114b[1,1,1]に書き込まれているデータの読み出しを行っている。期間t10は、選択メモリセル114b[1,1,1]に書き込まれているデータの読み出しを行う期間である。期間t11は、各配線の電位を0に戻す期間である。
本実施の形態では、先の実施の形態に示す半導体装置を用いた記憶装置の応用例について説明する。先の実施の形態に示す半導体装置は、例えば、各種電子機器(例えば、情報端末、コンピュータ、スマートフォン、電子書籍端末、デジタルカメラ(ビデオカメラも含む)、録画再生装置、ナビゲーションシステムなど)の記憶装置に適用できる。なお、ここで、コンピュータとは、タブレット型のコンピュータや、ノート型のコンピュータや、デスクトップ型のコンピュータの他、サーバシステムのような大型のコンピュータを含むものである。または、先の実施の形態に示す半導体装置は、メモリカード(例えば、SDカード)、USBメモリ、SSD(ソリッド・ステート・ドライブ)等の各種のリムーバブル記憶装置に適用される。図34にリムーバブル記憶装置の幾つかの構成例を模式的に示す。例えば、先の実施の形態に示す半導体装置は、パッケージングされたメモリチップに加工され、様々なストレージ装置、リムーバブルメモリに用いられる。
本実施の形態では、図35を用いて、上記実施の形態に示す半導体装置を適用した、AIシステムについて説明を行う。
<AIシステムの応用例>
本実施の形態では、上記実施の形態に示すAIシステムの応用例について図36を用いて説明を行う。
本実施の形態では、上記実施の形態に示すAIシステムが組み込まれたICの一例を示す。
<電子機器>
本発明の一態様に係る半導体装置は、様々な電子機器に用いることができる。図38および図39に、本発明の一態様に係る半導体装置を用いた電子機器の具体例を示す。
Claims (8)
- メモリストリングを有する半導体装置であって、
前記メモリストリングは、
メモリセルと、トランジスタと、
を有し、
前記メモリセルは、
第1の開口を有する第1の導電体と、
前記第1の開口の内側に設けられた第1の絶縁体と、
前記第1の絶縁体の内側に設けられた第2の絶縁体と、
前記第2の絶縁体の内側に設けられた第3の絶縁体と、
前記第3の絶縁体の内側に設けられた第1の酸化物と、
前記第1の酸化物の内側に設けられた第4の絶縁体と、
を有し、
前記トランジスタは、
第2の開口を有する第2の導電体と、
前記第2の開口の内側に設けられた前記第1の絶縁体と、
前記第1の絶縁体の内側に設けられた前記第3の絶縁体と、
前記第3の絶縁体の内側に設けられた前記第1の酸化物と、
前記第1の酸化物の内側に設けられた第5の絶縁体と、
前記第5の絶縁体の内側に設けられた第3の導電体と、
を有し、
前記第2の導電体は、前記第1の絶縁体を介して、前記第1の酸化物と重なる領域を有し、
前記第3の導電体は、前記第5の絶縁体を介して、前記第1の酸化物と重なる領域を有する、
ことを特徴とする半導体装置。 - 請求項1において、
前記第2の導電体は、第1のゲートとして機能し、
前記第3の導電体は、第2のゲートとして機能する、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記第1の酸化物は、Inと、元素M(MはAl、Ga、Y、またはSn)と、Znと、を有する、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記第4の絶縁体は、
積層構造を有する、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記半導体装置は、さらに基体を有し、
前記半導体装置は、前記基体上に、前記メモリセルを複数有し、
複数の前記メモリセルと、前記トランジスタと、は、
前記基体が有する一の面に対して垂直な方向に積層して設けられている、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記第2の絶縁体は、
前記基体が有する一の面に対して垂直な方向に、前記第3の導電体の上方または下方に形成されている、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記第1の絶縁体は、シリコン、アルミニウム、およびハフニウムのいずれか一を含む酸化物である、
ことを特徴とする半導体装置。 - 請求項1または請求項2において、
前記第3の絶縁体は、シリコン、アルミニウム、およびハフニウムのいずれか一を含む酸化物である、
ことを特徴とする半導体装置。
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