JPWO2016052260A1 - 共振装置 - Google Patents
共振装置 Download PDFInfo
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- JPWO2016052260A1 JPWO2016052260A1 JP2016551940A JP2016551940A JPWO2016052260A1 JP WO2016052260 A1 JPWO2016052260 A1 JP WO2016052260A1 JP 2016551940 A JP2016551940 A JP 2016551940A JP 2016551940 A JP2016551940 A JP 2016551940A JP WO2016052260 A1 JPWO2016052260 A1 JP WO2016052260A1
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- vibrating arms
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- 239000000758 substrate Substances 0.000 claims abstract description 143
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- -1 scandium aluminum Chemical compound 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0603—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a piezoelectric bender, e.g. bimorph
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2468—Tuning fork resonators
- H03H9/2478—Single-Ended Tuning Fork resonators
- H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02244—Details of microelectro-mechanical resonators
- H03H2009/02283—Vibrating means
- H03H2009/02291—Beams
- H03H2009/02299—Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
11 下側基板
12 上側基板
13 共振子
15 基部
16a〜16d 振動腕
19 凹部
20 突起部(下側突起部)
40 突起部(上側突起部)
41 凹部
42 底板
43 側壁
Claims (9)
- 下側基板と、
前記下側基板との間に振動空間を形成する上側基板と、
前記下側基板又は前記上側基板の内面に形成され、前記振動空間に突出する突起部と、
前記振動空間内に配置された共振子であって、基部と、前記基部から並列に前記下側基板又は前記上側基板の内面に沿って延び、前記内面に向かって垂直方向に振動する複数の振動腕と、を有する共振子と、を備える共振装置。 - 前記突起部は、前記複数の振動腕のうちの隣接する2本の前記振動腕同士の間の間隙に対向する、請求項1に記載の共振装置。
- 4本の前記振動腕を備え、前記突起部は、外側2本の前記振動腕同士の間に配置された内側2本の前記振動腕同士の間の間隙に対向する、請求項1又は2に記載の共振装置。
- 内側2本の前記振動腕同士の間の第1間隔は、前記外側の前記振動腕と当該外側の前記振動腕に隣接する内側の前記振動腕との間の第2間隔と同じか、当該第2間隔よりも大きい、請求項3に記載の共振装置。
- 前記下側基板又は前記上側基板は、前記内面を規定する底板と、前記底板から前記垂直方向に立ち上がって前記底板とともに凹部を形成する側壁と、を備える、請求項1〜4のいずれか1項に記載の共振装置。
- 前記突起部は少なくとも一端で前記側壁に接続される、請求項5に記載の共振装置。
- 前記突起部は、前記下側基板の内面に形成された下側突起部と、前記上側基板の内面に形成された上側突起部と、を備え、前記下側突起部は前記上側突起部に接続される、請求項1〜6のいずれか1項に記載の共振装置。
- 前記下側基板の内面に形成された突起部は、少なくとも一端で前記上側基板の内面に接続される、請求項1〜6のいずれか1項に記載の共振装置。
- 前記上側基板の内面に形成された突起部は、少なくとも一端で前記下側基板の内面に接続される、請求項1〜6のいずれか1項に記載の共振装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014199030 | 2014-09-29 | ||
JP2014199030 | 2014-09-29 | ||
PCT/JP2015/076690 WO2016052260A1 (ja) | 2014-09-29 | 2015-09-18 | 共振装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016052260A1 true JPWO2016052260A1 (ja) | 2017-05-25 |
JP6278246B2 JP6278246B2 (ja) | 2018-02-14 |
Family
ID=55630300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016551940A Active JP6278246B2 (ja) | 2014-09-29 | 2015-09-18 | 共振装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10673408B2 (ja) |
JP (1) | JP6278246B2 (ja) |
CN (1) | CN106664073B (ja) |
WO (1) | WO2016052260A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11750173B2 (en) * | 2018-04-27 | 2023-09-05 | Murata Manufacturing Co., Ltd. | Resonator and resonance device |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016043205A1 (ja) * | 2014-09-19 | 2016-03-24 | 株式会社村田製作所 | 共振子及び共振装置 |
WO2017195416A1 (ja) | 2016-05-10 | 2017-11-16 | 株式会社村田製作所 | 共振子及び共振装置 |
JP7133134B2 (ja) * | 2018-10-24 | 2022-09-08 | 株式会社村田製作所 | 共振装置 |
JP2021117070A (ja) * | 2020-01-24 | 2021-08-10 | セイコーエプソン株式会社 | 振動デバイス、電子機器、及び移動体 |
WO2022010843A1 (en) | 2020-07-08 | 2022-01-13 | Kampanics, L.L.C. | Dual thickness-shear mode resonator structures for frequency control and sensing |
WO2022075259A1 (ja) | 2020-10-07 | 2022-04-14 | 東洋紡株式会社 | 二軸配向ポリエステルフィルム及び積層体 |
CN116438077A (zh) | 2020-10-07 | 2023-07-14 | 东洋纺株式会社 | 双轴取向聚酯膜及层叠体 |
Citations (5)
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---|---|---|---|---|
JP2004274589A (ja) * | 2003-03-11 | 2004-09-30 | River Eletec Kk | 屈曲振動子 |
JP2010136243A (ja) * | 2008-12-08 | 2010-06-17 | Epson Toyocom Corp | 振動子 |
JP2011004213A (ja) * | 2009-06-19 | 2011-01-06 | Seiko Epson Corp | 圧電デバイス |
JP2011087274A (ja) * | 2009-09-16 | 2011-04-28 | Nippon Dempa Kogyo Co Ltd | 表面実装型の圧電デバイス |
JP2011160250A (ja) * | 2010-02-02 | 2011-08-18 | Seiko Epson Corp | 振動体および振動デバイス |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996031754A1 (fr) * | 1995-04-04 | 1996-10-10 | Matsushita Electric Industrial Co., Ltd. | Capteur de vitesse angulaire |
JP3995918B2 (ja) * | 2001-10-29 | 2007-10-24 | セイコーインスツル株式会社 | 表面実装型圧電振動子 |
JP3646258B2 (ja) | 2001-10-31 | 2005-05-11 | 有限会社ピエデック技術研究所 | 水晶ユニットとその製造方法 |
JP2007258917A (ja) * | 2006-03-22 | 2007-10-04 | Epson Toyocom Corp | 圧電デバイス |
JP5226791B2 (ja) * | 2008-08-27 | 2013-07-03 | セイコーインスツル株式会社 | 圧電振動子、発振器、電子機器及び電波時計並びに圧電振動子の製造方法 |
JPWO2010026817A1 (ja) * | 2008-09-02 | 2012-02-02 | 株式会社村田製作所 | 音叉型振動子とその製造方法および角速度センサ |
JP2010118784A (ja) * | 2008-11-11 | 2010-05-27 | Nippon Dempa Kogyo Co Ltd | 圧電振動子の製造方法、圧電振動子及び電子部品 |
JP4864962B2 (ja) * | 2008-12-17 | 2012-02-01 | 日本電波工業株式会社 | 圧電デバイス |
JP2011049665A (ja) * | 2009-08-25 | 2011-03-10 | Seiko Instruments Inc | 圧電振動子、圧電振動子の製造方法、発振器、電子機器および電波時計 |
JP5085682B2 (ja) * | 2010-04-26 | 2012-11-28 | 日本電波工業株式会社 | 圧電デバイス |
-
2015
- 2015-09-18 WO PCT/JP2015/076690 patent/WO2016052260A1/ja active Application Filing
- 2015-09-18 CN CN201580041879.7A patent/CN106664073B/zh active Active
- 2015-09-18 JP JP2016551940A patent/JP6278246B2/ja active Active
-
2017
- 2017-03-06 US US15/450,161 patent/US10673408B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004274589A (ja) * | 2003-03-11 | 2004-09-30 | River Eletec Kk | 屈曲振動子 |
JP2010136243A (ja) * | 2008-12-08 | 2010-06-17 | Epson Toyocom Corp | 振動子 |
JP2011004213A (ja) * | 2009-06-19 | 2011-01-06 | Seiko Epson Corp | 圧電デバイス |
JP2011087274A (ja) * | 2009-09-16 | 2011-04-28 | Nippon Dempa Kogyo Co Ltd | 表面実装型の圧電デバイス |
JP2011160250A (ja) * | 2010-02-02 | 2011-08-18 | Seiko Epson Corp | 振動体および振動デバイス |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11750173B2 (en) * | 2018-04-27 | 2023-09-05 | Murata Manufacturing Co., Ltd. | Resonator and resonance device |
Also Published As
Publication number | Publication date |
---|---|
CN106664073A (zh) | 2017-05-10 |
JP6278246B2 (ja) | 2018-02-14 |
US20170187351A1 (en) | 2017-06-29 |
WO2016052260A1 (ja) | 2016-04-07 |
CN106664073B (zh) | 2019-04-16 |
US10673408B2 (en) | 2020-06-02 |
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