JPWO2015141305A1 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JPWO2015141305A1 JPWO2015141305A1 JP2016508580A JP2016508580A JPWO2015141305A1 JP WO2015141305 A1 JPWO2015141305 A1 JP WO2015141305A1 JP 2016508580 A JP2016508580 A JP 2016508580A JP 2016508580 A JP2016508580 A JP 2016508580A JP WO2015141305 A1 JPWO2015141305 A1 JP WO2015141305A1
- Authority
- JP
- Japan
- Prior art keywords
- frame
- fin
- conversion device
- power conversion
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Abstract
Description
10 収納本体
20 フレーム
22 側面部
23 側面部
24 被覆部
24a 溝部
24b ガイド部
24c 傾斜面
25a 通風開口
26a 通風開口
30 フィンユニット
31 ベース部
32 フィン
H 半導体素子
Claims (5)
- 高熱伝導性材料から形成され、かつ装置本体の内部に収納された半導体素子を放熱させるヒートシンクが配設されるとともに該ヒートシンクを構成するフィン間に外部の空気を通過させるための開口が形成されたフレームを有する電力変換装置において、
前記フレームは、前記フィンのそれぞれの先端部を自身に形成された溝部に進入させることで各フィンに熱的に接続した状態で前記ヒートシンクを被覆する被覆部を備えたことを特徴とする電力変換装置。 - 前記被覆部は、少なくとも互いに隣接する溝部間において前記フィンの基端部側に向かうに連れて前記溝部の長手方向と直交する方向の幅が漸次小さくなる態様で形成され、かつ該溝部の内壁面に連続する傾斜面を有するガイド部を備えたことを特徴とする請求項1に記載の電力変換装置。
- 前記フィンは、先端面に向けて自身の厚みが漸次小さくなることで形成される傾斜ガイド面を備えたことを特徴とする請求項1に記載の電力変換装置。
- 前記フレームは、表面に凹凸が形成されて成ることを特徴とする請求項1に記載の電力変換装置。
- 前記半導体素子は、炭化ケイ素、窒化ガリウム及びダイアモンドの少なくとも1つを主材料とするワイドバンドギャップ半導体素子であることを特徴とする請求項1〜4のいずれか1つに記載の電力変換装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014055208 | 2014-03-18 | ||
JP2014055208 | 2014-03-18 | ||
PCT/JP2015/052949 WO2015141305A1 (ja) | 2014-03-18 | 2015-02-03 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015141305A1 true JPWO2015141305A1 (ja) | 2017-04-06 |
JP6315081B2 JP6315081B2 (ja) | 2018-04-25 |
Family
ID=54144285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016508580A Active JP6315081B2 (ja) | 2014-03-18 | 2015-02-03 | 電力変換装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3121848A4 (ja) |
JP (1) | JP6315081B2 (ja) |
CN (1) | CN105493273B (ja) |
WO (1) | WO2015141305A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6988118B2 (ja) * | 2017-03-22 | 2022-01-05 | 富士電機株式会社 | インバータ装置 |
JP6988119B2 (ja) * | 2017-03-22 | 2022-01-05 | 富士電機株式会社 | インバータ装置 |
CN108598054A (zh) * | 2018-03-28 | 2018-09-28 | 合肥凯利科技投资有限公司 | 一种电机控制器igbt用风冷散热装置及其控制系统 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129486A (ja) * | 1991-11-06 | 1993-05-25 | Okuma Mach Works Ltd | ヒートシンク及びその製造方法 |
JP2001102503A (ja) * | 1999-10-01 | 2001-04-13 | Mizutani Denki Kogyo Kk | 電子部品の放熱器 |
JP2001110958A (ja) * | 1999-10-13 | 2001-04-20 | Mizutani Denki Kogyo Kk | 電子部品の放熱器 |
JP2005158979A (ja) * | 2003-11-26 | 2005-06-16 | Sony Corp | 放熱装置及び電子機器 |
JP2007165481A (ja) * | 2005-12-12 | 2007-06-28 | Seiko Epson Corp | 熱交換器、光源装置、プロジェクタ、電子機器 |
JP2010135673A (ja) * | 2008-12-08 | 2010-06-17 | Toshiba Schneider Inverter Corp | 半導体機器の放熱器 |
JP2011160594A (ja) * | 2010-02-02 | 2011-08-18 | Yaskawa Electric Corp | 電力変換装置 |
WO2012081434A1 (ja) * | 2010-12-16 | 2012-06-21 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2460631C3 (de) * | 1974-12-20 | 1979-04-05 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kuhlkörper zur Fremdkuhlung von Thyristoren |
DE2502472C2 (de) * | 1975-01-22 | 1982-09-02 | Siemens AG, 1000 Berlin und 8000 München | Kühlkörper für Thyristoren |
DE4314663A1 (de) * | 1993-05-04 | 1994-11-10 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente |
DE29602212U1 (de) * | 1996-02-09 | 1996-05-02 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente o.dgl. Einrichtungen |
US5937517A (en) * | 1997-11-12 | 1999-08-17 | Eastman Kodak Company | Method of manufacturing bonded dual extruded, high fin density heat sinks |
DE10229532B4 (de) * | 2002-07-01 | 2008-06-19 | Alcan Technology & Management Ag | Kühlvorrichtung für Halbleiterbauelemente |
DE10240848B4 (de) * | 2002-09-04 | 2004-07-22 | Seifert Electronic Gmbh & Co. Kg | Kühlkörper aus Leichtmetall in Blockform und Verfahren zu dessen Herstellung |
JP2012004405A (ja) * | 2010-06-18 | 2012-01-05 | Denso Corp | 冷却器およびその製造方法 |
JP5614542B2 (ja) * | 2011-03-28 | 2014-10-29 | 株式会社安川電機 | モータ制御装置 |
-
2015
- 2015-02-03 JP JP2016508580A patent/JP6315081B2/ja active Active
- 2015-02-03 CN CN201580001725.5A patent/CN105493273B/zh active Active
- 2015-02-03 WO PCT/JP2015/052949 patent/WO2015141305A1/ja active Application Filing
- 2015-02-03 EP EP15765813.9A patent/EP3121848A4/en not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05129486A (ja) * | 1991-11-06 | 1993-05-25 | Okuma Mach Works Ltd | ヒートシンク及びその製造方法 |
JP2001102503A (ja) * | 1999-10-01 | 2001-04-13 | Mizutani Denki Kogyo Kk | 電子部品の放熱器 |
JP2001110958A (ja) * | 1999-10-13 | 2001-04-20 | Mizutani Denki Kogyo Kk | 電子部品の放熱器 |
JP2005158979A (ja) * | 2003-11-26 | 2005-06-16 | Sony Corp | 放熱装置及び電子機器 |
JP2007165481A (ja) * | 2005-12-12 | 2007-06-28 | Seiko Epson Corp | 熱交換器、光源装置、プロジェクタ、電子機器 |
JP2010135673A (ja) * | 2008-12-08 | 2010-06-17 | Toshiba Schneider Inverter Corp | 半導体機器の放熱器 |
JP2011160594A (ja) * | 2010-02-02 | 2011-08-18 | Yaskawa Electric Corp | 電力変換装置 |
WO2012081434A1 (ja) * | 2010-12-16 | 2012-06-21 | 三菱電機株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105493273A (zh) | 2016-04-13 |
CN105493273B (zh) | 2019-11-05 |
EP3121848A1 (en) | 2017-01-25 |
WO2015141305A1 (ja) | 2015-09-24 |
JP6315081B2 (ja) | 2018-04-25 |
EP3121848A4 (en) | 2017-12-06 |
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