JPWO2015137009A1 - 冷却器および該冷却器を有する半導体装置 - Google Patents
冷却器および該冷却器を有する半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 121
- 239000003507 refrigerant Substances 0.000 claims abstract description 107
- 238000001816 cooling Methods 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims description 91
- 239000002184 metal Substances 0.000 claims description 91
- 239000000758 substrate Substances 0.000 claims description 40
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000005304 joining Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000013459 approach Methods 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000002826 coolant Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- UAOUIVVJBYDFKD-XKCDOFEDSA-N (1R,9R,10S,11R,12R,15S,18S,21R)-10,11,21-trihydroxy-8,8-dimethyl-14-methylidene-4-(prop-2-enylamino)-20-oxa-5-thia-3-azahexacyclo[9.7.2.112,15.01,9.02,6.012,18]henicosa-2(6),3-dien-13-one Chemical compound C([C@@H]1[C@@H](O)[C@@]23C(C1=C)=O)C[C@H]2[C@]12C(N=C(NCC=C)S4)=C4CC(C)(C)[C@H]1[C@H](O)[C@]3(O)OC2 UAOUIVVJBYDFKD-XKCDOFEDSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
Description
図1には、本発明の冷却器に係る実施形態の一つが示されている。図1(a)は裏面からジャケット21の底板21bを透視した要部平面図、図1(b)はX−X線で切断した要部断面図、図1(c)はY−Y線で切断した要部断面図である。この冷却器100bは半導体モジュール100aなどの冷却に用いられる。半導体モジュール100aは、サーマルコンパウンド28を介して冷却器100bに固定されている。
図3は、この発明に係る第2実施例の半導体装置200の構成図である。図3(a)は冷却器3の底板21bを透視した要部平面図、図3(b)はX−X線で切断した要部側断面図、図3(c)はY−Y線で切断した要部側断面図である。
図4は、この発明に係る第3実施例の半導体装置300の要部断面図である。図3の半導体装置200との違いは、金属ベース1を除いて、絶縁基板4の裏面の金属部4cを冷却器3aの天板20として直接利用した点である。金属ベース1と金属部4cがないため、伝熱速度を向上でき、半導体チップ8に対する冷却効果を大きくできる。また、半導体装置300を小型化できる。尚、この半導体装置300では、中間組立体2は絶縁基板4の裏面の金属部4cに相当する天板20が共通になっている。
2,52 中間組立体
3,3a,100b,500b 冷却器
4,54 回路基板
4a,54a 絶縁基板
4b,54b 回路部
4c,54c 金属部
8,58 半導体チップ
9a,59a 第1外部端子
9b,59b 第2外部端子
22a 先端部
10,60 樹脂部
20,70 天板
21,71 ジャケット
21a,71a 側板
21b,71b 底板
22,72 フィン
23,73 冷媒流入口
24,74 冷媒流出口
25 伝熱ピン
26 バイメタルバルブ
26a 自由端
28,78 サーマルコンパウンド
30 主冷媒路
30a 中心軸
34 阻止板
80 水流
81 個所
100a,200a,500a 半導体モジュール
100,200,300,500 半導体装置
P1,Q1,Q2、T 最小間隔
θ 傾斜角度
L バイメタルバルブの長さ
Claims (11)
- 半導体モジュールを冷却する冷却器において、
天板と、
側板と底板を有し前記側板が前記天板に固着されたジャケットと、
前記天板と前記ジャケットで囲まれる空間へ冷媒を流入させる冷媒流入口と、
前記空間から冷媒を流出させる冷媒流出口と、
前記天板に固着され、前記ジャケット内の主冷媒路の左右にそれぞれ複数離間して配置され、かつ前記主冷媒路の流入側へ傾斜して配置された複数のフィンと、
前記フィンの冷媒流入側の前記天板に配置された伝熱ピンと、
一端が前記伝熱ピンに接続され、他端が自由端である湾曲した板状のバイメタルバルブと、
を備えることを特徴とする冷却器。 - 前記フィンの傾斜角度が、主冷媒路を基準にして30度以上60度以下の範囲であることを特徴とする請求項1に記載の冷却器。
- 前記冷媒が液体であることを特徴とする請求項1または2に記載の冷却器。
- 前記主冷媒路の下流側であって、前記冷媒流出口の前に阻止板を備えたことを特徴とする請求項3に記載の冷却器。
- 隣接する前記伝熱ピンの設置間隔は、隣接するフィン同士の間隔の2倍以上離れていることを特徴とする請求項3に記載の冷却器。
- 前記バイメタルバルブは、冷媒流入方向へ湾曲した第1形状と、前記第1形状時よりも高温になるにつれて直線状に近づく第2形状と、に変形可能であり、
前記第1形状時に、前記バイメタルバルブの前記自由端と、隣接する前記フィンとの距離が、隣接する前記フィン同士の間隔に等しくなることを特徴とする請求項3に記載の冷却器。 - 前記バイメタルバルブは、第1金属片と、前記第1金属片より膨張率の高い第2金属片とを接合したものであり、
前記第1金属片が、鉄とニッケルの合金板であり、
前記第2金属片が、鉄とニッケルの合金板に、マンガン、クロム、銅からなる群から1つまたは複数選択された金属を添加されていることを特徴とする請求項6に記載した冷却器。 - 前記バイメタルバルブの厚さが、0.5mm以上、5mm以下であることを特徴とする請求項7に記載の冷却器。
- 請求項3に記載の冷却器を有する半導体装置において、
絶縁基板、前記絶縁基板の上面の回路部、および前記絶縁基板の下面の金属部を有する回路基板と、
前記回路部に電気的に接続され、前記冷却器で冷却される半導体チップと、
前記半導体チップに接続された第1外部端子と、
前記回路部に接続された第2外部端子と、
前記金属部の前記絶縁基板とは反対側の面、前記第1外部端子の一端、及び前記第2外部端子の一端を除いて、前記回路基板、前記半導体チップ、前記第1外部端子、前記第2外部端子を収容した樹脂部と、を備え、
複数の前記フィンは、前記金属部に熱的に接続され、
前記伝熱ピンが、前記絶縁基板の下方に配置されていることを特徴とする半導体装置。 - 請求項9に記載の半導体装置において、
前記回路基板、前記半導体チップ、前記第1外部端子、および前記第2外部端子を有する中間組立体を複数備え、
複数の前記金属部と前記天板との間に配置された金属ベースと、
複数の前記金属部と前記金属ベースとの間を熱的に接続する第1接続部材と、
前記金属ベースと前記天板との間を熱的に接続する第2接続部材と、
を備えることを特徴とする半導体装置。 - 請求項9に記載の半導体装置において、
前記天板は、前記金属部であることを特徴とする半導体装置。
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