JPWO2014054618A1 - 銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路 - Google Patents

銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路 Download PDF

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Publication number
JPWO2014054618A1
JPWO2014054618A1 JP2014539750A JP2014539750A JPWO2014054618A1 JP WO2014054618 A1 JPWO2014054618 A1 JP WO2014054618A1 JP 2014539750 A JP2014539750 A JP 2014539750A JP 2014539750 A JP2014539750 A JP 2014539750A JP WO2014054618 A1 JPWO2014054618 A1 JP WO2014054618A1
Authority
JP
Japan
Prior art keywords
copper powder
silver
powder
silver fine
average particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014539750A
Other languages
English (en)
Japanese (ja)
Inventor
森井　弘子
弘子 森井
岩崎　敬介
敬介 岩崎
山本　洋介
洋介 山本
峰子 大杉
峰子 大杉
林　一之
一之 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toda Kogyo Corp
Original Assignee
Toda Kogyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toda Kogyo Corp filed Critical Toda Kogyo Corp
Publication of JPWO2014054618A1 publication Critical patent/JPWO2014054618A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0843—Cobalt
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
JP2014539750A 2012-10-03 2013-10-01 銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路 Pending JPWO2014054618A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012221321 2012-10-03
JP2012221321 2012-10-03
PCT/JP2013/076664 WO2014054618A1 (ja) 2012-10-03 2013-10-01 銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路

Publications (1)

Publication Number Publication Date
JPWO2014054618A1 true JPWO2014054618A1 (ja) 2016-08-25

Family

ID=50434944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014539750A Pending JPWO2014054618A1 (ja) 2012-10-03 2013-10-01 銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路

Country Status (5)

Country Link
JP (1) JPWO2014054618A1 (zh)
KR (1) KR20150064054A (zh)
CN (1) CN104797360A (zh)
TW (1) TW201424887A (zh)
WO (1) WO2014054618A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811080B2 (ja) * 2016-02-03 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 銀被覆銅粉およびその製造方法
US10748865B2 (en) * 2016-04-28 2020-08-18 Hitachi Chemical Company, Ltd. Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device
JP6719550B2 (ja) * 2016-05-12 2020-07-08 日本メクトロン株式会社 導電性接着剤およびシールドフィルム
TWI617533B (zh) 2016-12-09 2018-03-11 財團法人工業技術研究院 表面改質陶瓷粉體及其應用
KR102467723B1 (ko) * 2017-02-13 2022-11-16 타츠타 전선 주식회사 그라운드 부재, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
KR102521531B1 (ko) 2017-08-31 2023-04-14 한국광기술원 금속환원성 유기물로 코팅된 은 및 구리 나노입자를 포함하는 전자소자 접착용 조성물 및 이의 제조방법, 이를 적용한 전자기기
WO2019181650A1 (ja) * 2018-03-19 2019-09-26 日本電産株式会社 電気接点用粉末、電気接点材料、電気接点及び電気接点用粉末の製造方法
KR20210105404A (ko) * 2018-12-26 2021-08-26 쇼에이 가가쿠 가부시키가이샤 은 페이스트

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04218602A (ja) * 1990-12-18 1992-08-10 Fukuda Metal Foil & Powder Co Ltd 金属被覆複合粉末の製造方法
JP4779134B2 (ja) * 2001-02-13 2011-09-28 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用の導電フイラーおよびその製法
JP2005015910A (ja) * 2003-06-03 2005-01-20 Hosokawa Funtai Gijutsu Kenkyusho:Kk 複合粒子の製造方法、並びにその方法により製造された複合粒子
US7083859B2 (en) * 2003-07-08 2006-08-01 Hitachi Chemical Co., Ltd. Conductive powder and method for preparing the same
JP4525678B2 (ja) * 2004-06-17 2010-08-18 パナソニック株式会社 自己組織化希土類−鉄系ボンド磁石の製造方法とそれを用いたモータ
JP5080731B2 (ja) * 2005-10-03 2012-11-21 三井金属鉱業株式会社 微粒銀粒子付着銀銅複合粉及びその微粒銀粒子付着銀銅複合粉製造方法
JPWO2008059789A1 (ja) * 2006-11-17 2010-03-04 日鉱金属株式会社 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法
JP2010065265A (ja) * 2008-09-10 2010-03-25 Hitachi Ltd 金属ナノ粒子及びその複合粉末の作製方法

Also Published As

Publication number Publication date
TW201424887A (zh) 2014-07-01
KR20150064054A (ko) 2015-06-10
WO2014054618A1 (ja) 2014-04-10
CN104797360A (zh) 2015-07-22

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