JPWO2014050389A1 - パワー半導体モジュール - Google Patents
パワー半導体モジュール Download PDFInfo
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- JPWO2014050389A1 JPWO2014050389A1 JP2014538290A JP2014538290A JPWO2014050389A1 JP WO2014050389 A1 JPWO2014050389 A1 JP WO2014050389A1 JP 2014538290 A JP2014538290 A JP 2014538290A JP 2014538290 A JP2014538290 A JP 2014538290A JP WO2014050389 A1 JPWO2014050389 A1 JP WO2014050389A1
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- semiconductor element
- terminal
- heat
- power semiconductor
- semiconductor module
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 134
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000012795 verification Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 229910017401 Au—Ge Inorganic materials 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
- H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
- セラミック基板と、
前記セラミック基板の一方の主面側に配置される半導体素子と、
前記半導体素子に接続される端子と、
前記セラミック基板の他方の主面側に配置される第1の放熱部材と、
前記セラミック基板の前記一方の主面側において、前記半導体素子から間隔をあけて配置される第2の放熱部材と、を備え、
前記端子は、前記第2の放熱部材と接続されることを特徴とするパワー半導体モジュール。 - 前記端子は、前記半導体素子を制御する制御端子であることを特徴とする請求項1に記載のパワー半導体モジュール。
- 前記半導体素子と前記端子とは、金属板を介して接続されており、
前記端子は、前記金属板より熱伝導率の低い材料で形成されることを特徴とする請求項1に記載のパワー半導体モジュール。 - 前記半導体素子は、ワイドバンドギャップ半導体材料を使用した半導体素子であることを特徴とする請求項1に記載のパワー半導体モジュール。
- 前記第2の放熱部材は、絶縁性を有し、
前記半導体素子は、前記第2の放熱部材と接続する複数の端子を介して複数の外部配線と接続されることを特徴とする請求項1から請求項4のいずれかに記載のパワー半導体モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012213620 | 2012-09-27 | ||
JP2012213620 | 2012-09-27 | ||
PCT/JP2013/072596 WO2014050389A1 (ja) | 2012-09-27 | 2013-08-23 | パワー半導体モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5925328B2 JP5925328B2 (ja) | 2016-05-25 |
JPWO2014050389A1 true JPWO2014050389A1 (ja) | 2016-08-22 |
Family
ID=50387798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014538290A Active JP5925328B2 (ja) | 2012-09-27 | 2013-08-23 | パワー半導体モジュール |
Country Status (2)
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JP (1) | JP5925328B2 (ja) |
WO (1) | WO2014050389A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7095632B2 (ja) * | 2019-03-11 | 2022-07-05 | 株式会社デンソー | 半導体装置 |
JP7270576B2 (ja) * | 2020-04-20 | 2023-05-10 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08236664A (ja) * | 1995-02-23 | 1996-09-13 | Toshiba Corp | 半導体の冷却装置 |
JP3120826B2 (ja) * | 1995-08-09 | 2000-12-25 | 三菱マテリアル株式会社 | パワーモジュール用基板の端子構造 |
JP3903681B2 (ja) * | 1999-03-11 | 2007-04-11 | 三菱マテリアル株式会社 | 半導体装置 |
JP2004363295A (ja) * | 2003-06-04 | 2004-12-24 | Mitsubishi Electric Corp | 半導体装置 |
JP4404726B2 (ja) * | 2004-08-31 | 2010-01-27 | 三菱電機株式会社 | 車載用電力変換装置 |
JP2007189133A (ja) * | 2006-01-16 | 2007-07-26 | Yaskawa Electric Corp | パワーモジュール |
JP5028947B2 (ja) * | 2006-10-19 | 2012-09-19 | 三菱マテリアル株式会社 | パワーモジュールの積層構造体 |
JP2009105389A (ja) * | 2007-10-02 | 2009-05-14 | Rohm Co Ltd | パワーモジュール |
JP2009231685A (ja) * | 2008-03-25 | 2009-10-08 | Mitsubishi Electric Corp | パワー半導体装置 |
JP5369798B2 (ja) * | 2009-03-18 | 2013-12-18 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JP5463845B2 (ja) * | 2009-10-15 | 2014-04-09 | 三菱電機株式会社 | 電力半導体装置とその製造方法 |
EP2624294B1 (en) * | 2011-10-12 | 2017-12-06 | NGK Insulators, Ltd. | Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board |
WO2013084417A1 (ja) * | 2011-12-09 | 2013-06-13 | 富士電機株式会社 | 電力変換装置 |
WO2013172183A1 (ja) * | 2012-05-18 | 2013-11-21 | 三菱電機株式会社 | パワーモジュール |
-
2013
- 2013-08-23 WO PCT/JP2013/072596 patent/WO2014050389A1/ja active Application Filing
- 2013-08-23 JP JP2014538290A patent/JP5925328B2/ja active Active
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JP5925328B2 (ja) | 2016-05-25 |
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