JPWO2013187104A1 - 蓋開閉装置 - Google Patents
蓋開閉装置 Download PDFInfo
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- JPWO2013187104A1 JPWO2013187104A1 JP2014520978A JP2014520978A JPWO2013187104A1 JP WO2013187104 A1 JPWO2013187104 A1 JP WO2013187104A1 JP 2014520978 A JP2014520978 A JP 2014520978A JP 2014520978 A JP2014520978 A JP 2014520978A JP WO2013187104 A1 JPWO2013187104 A1 JP WO2013187104A1
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- Prior art keywords
- lid
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- closing device
- locking
- pod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D51/00—Closures not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Closures For Containers (AREA)
Abstract
Description
[ストッカの構成]
[蓋開閉装置の構成]
[蓋開閉装置の錠開閉機構の構成]
Claims (5)
- 被収納物を収納する容器本体と、前記容器本体に対して開閉可能な底部を成し、前記被収納物が載置される蓋部と、前記容器本体に対する前記蓋部の開錠及び施錠を行う錠機構と、を備える収納容器について、前記容器本体に対する前記蓋部の開閉を行う蓋開閉装置であって、
前記収納容器が載置される装置本体と、
前記装置本体に前記収納容器が載置されたときに前記錠機構に係合する係合部を有し、前記係合部を移動させることで、前記錠機構に前記開錠を行わせるための開錠動作、及び前記錠機構に前記施錠を行わせるための施錠動作を行う複数の移動部と、
前記錠機構に前記開錠を行わせる場合には、複数の前記移動部を連動させて複数の前記移動部に前記開錠動作を行わせ、前記錠機構に前記施錠を行わせる場合には、複数の前記移動部を連動させて複数の前記移動部に前記施錠動作を行わせる連動部と、
前記移動部及び前記連動部に対して一つ設けられ、前記移動部及び前記連動部を一斉に駆動させるアクチュエータと、を備える、蓋開閉装置。 - 前記移動部のそれぞれは、前記装置本体に回動可能に支持されて前記係合部を移動させる第1回動部材を更に有し、
前記連動部は、少なくとも一対の前記第1回動部材を連結して当該第1回動部材を回動させる第1連結部材を有する、請求項1記載の蓋開閉装置。 - 前記第1連結部材によって連結された一対の前記第1回動部材は、前記装置本体に前記収納容器が載置されたときに前記蓋部に対して一方の側及び他方の側のそれぞれに位置するように複数対配置されており、
前記連動部は、前記装置本体に回動可能に支持されて前記第1連結部材のそれぞれが接続された一対の第2回動部材と、一対の前記第2回動部材を連結して当該第2回動部材を回動させる第2連結部材と、を更に有する、請求項2記載の蓋開閉装置。 - 前記装置本体は、前記移動部、前記連動部及び前記アクチュエータが配置された凹部と、前記凹部を覆っており、前記収納容器が載置される載置面を成す天板部と、を有し、
前記係合部は、前記第1回動部材に立設された係合ピンであり、
前記天板部には、前記係合ピンを前記載置面から突出させて前記開錠動作の位置と前記施錠動作の位置との間で移動可能とする長穴状の開口が設けられている、請求項2又は3記載の蓋開閉装置。 - 前記アクチュエータは、前記装置本体に取り付けられたシリンダ部と、基端部が前記シリンダ部内に挿入され且つ先端部が前記第2連結部材に取り付けられたロッド部と、を有し、前記シリンダ部内に対するガスの導出入によって前記ロッド部がスライドするエアシリンダである、請求項3記載の蓋開閉装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014520978A JP5854136B2 (ja) | 2012-06-14 | 2013-03-26 | 蓋開閉装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012134830 | 2012-06-14 | ||
JP2012134830 | 2012-06-14 | ||
PCT/JP2013/058840 WO2013187104A1 (ja) | 2012-06-14 | 2013-03-26 | 蓋開閉装置 |
JP2014520978A JP5854136B2 (ja) | 2012-06-14 | 2013-03-26 | 蓋開閉装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013187104A1 true JPWO2013187104A1 (ja) | 2016-02-04 |
JP5854136B2 JP5854136B2 (ja) | 2016-02-09 |
Family
ID=49757943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014520978A Active JP5854136B2 (ja) | 2012-06-14 | 2013-03-26 | 蓋開閉装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9517868B2 (ja) |
EP (1) | EP2863423B1 (ja) |
JP (1) | JP5854136B2 (ja) |
KR (1) | KR101650530B1 (ja) |
CN (1) | CN104285289B (ja) |
SG (1) | SG11201408295UA (ja) |
TW (1) | TWI616386B (ja) |
WO (1) | WO2013187104A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11430682B2 (en) * | 2019-04-16 | 2022-08-30 | Gudeng Precision Industrial Co., Ltd. | Reticle pod and gripping unit thereof |
Families Citing this family (6)
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JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
EP3471550A4 (en) | 2016-06-16 | 2020-02-26 | Sigma Phase, Corp. | SYSTEM FOR PROVIDING A SINGLE PORTION OF FROZEN CONFECTIONERY |
US11018037B2 (en) | 2017-07-31 | 2021-05-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical reticle load port |
US10503082B2 (en) | 2017-07-31 | 2019-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical reticle load port |
CN109659259B (zh) * | 2018-12-12 | 2020-06-12 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 片盒取放机构及半导体湿法工艺浸泡槽抖动装置 |
CN115108139B (zh) * | 2022-05-30 | 2024-10-01 | 玛瑜科创服务(南京)有限公司 | 一种儿科具有抗震功能的血液储存装置 |
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JPH0746694B2 (ja) * | 1984-07-30 | 1995-05-17 | アシスト テクノロジ−スインコーポレーテッド | 2つの密封環境間のインターフェース装置 |
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WO2010131414A1 (ja) * | 2009-05-12 | 2010-11-18 | 村田機械株式会社 | パージ装置およびパージ方法 |
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-
2013
- 2013-03-26 SG SG11201408295UA patent/SG11201408295UA/en unknown
- 2013-03-26 US US14/407,197 patent/US9517868B2/en active Active
- 2013-03-26 CN CN201380024838.8A patent/CN104285289B/zh active Active
- 2013-03-26 JP JP2014520978A patent/JP5854136B2/ja active Active
- 2013-03-26 EP EP13804749.3A patent/EP2863423B1/en active Active
- 2013-03-26 KR KR1020147032185A patent/KR101650530B1/ko active IP Right Grant
- 2013-03-26 WO PCT/JP2013/058840 patent/WO2013187104A1/ja active Application Filing
- 2013-06-11 TW TW102120701A patent/TWI616386B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0746694B2 (ja) * | 1984-07-30 | 1995-05-17 | アシスト テクノロジ−スインコーポレーテッド | 2つの密封環境間のインターフェース装置 |
JP3635061B2 (ja) * | 1999-07-14 | 2005-03-30 | 東京エレクトロン株式会社 | 被処理体収容ボックスの開閉蓋の開閉装置及び被処理体の処理システム |
WO2010131414A1 (ja) * | 2009-05-12 | 2010-11-18 | 村田機械株式会社 | パージ装置およびパージ方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11430682B2 (en) * | 2019-04-16 | 2022-08-30 | Gudeng Precision Industrial Co., Ltd. | Reticle pod and gripping unit thereof |
Also Published As
Publication number | Publication date |
---|---|
US9517868B2 (en) | 2016-12-13 |
CN104285289B (zh) | 2016-10-26 |
TW201404688A (zh) | 2014-02-01 |
KR101650530B1 (ko) | 2016-08-23 |
EP2863423A4 (en) | 2016-03-02 |
US20150166227A1 (en) | 2015-06-18 |
KR20150006446A (ko) | 2015-01-16 |
JP5854136B2 (ja) | 2016-02-09 |
SG11201408295UA (en) | 2015-01-29 |
TWI616386B (zh) | 2018-03-01 |
WO2013187104A1 (ja) | 2013-12-19 |
EP2863423B1 (en) | 2019-09-11 |
EP2863423A1 (en) | 2015-04-22 |
CN104285289A (zh) | 2015-01-14 |
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