JPWO2012121196A1 - インクジェット記録用導電性水性インク - Google Patents
インクジェット記録用導電性水性インク Download PDFInfo
- Publication number
- JPWO2012121196A1 JPWO2012121196A1 JP2012537254A JP2012537254A JPWO2012121196A1 JP WO2012121196 A1 JPWO2012121196 A1 JP WO2012121196A1 JP 2012537254 A JP2012537254 A JP 2012537254A JP 2012537254 A JP2012537254 A JP 2012537254A JP WO2012121196 A1 JPWO2012121196 A1 JP WO2012121196A1
- Authority
- JP
- Japan
- Prior art keywords
- ink
- water
- jet recording
- based ink
- polyhydric alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Manufacturing Of Electric Cables (AREA)
- Ink Jet (AREA)
Abstract
Description
・インク外観
目視で沈降の有無を確認した。いずれのインクについても沈降は認められなかった。
・粘度
E型粘度計で、23℃において、回転数100rpmにて測定し、その結果を表1〜2に示した。
・表面張力
室温でWilhelmy法(Ptプレート)を用いて測定し、その結果を表1〜2に示した。
・経時安定性
調製された各種インクジェット記録用導電性水性インクと、それを2週間冷蔵保存したインクにつき、それぞれインクの外観、粘度及び表面張力につき測定を行い、調製直後と相違があるか否かを評価した。2週間冷蔵保存したいずれのインクも、調製直後と同様に、外観変化がなく、粘度及び表面張力も、調製直後に対して変化率10%以下であり、良好であった。
加えて、測定した焼成後塗膜の0.5μm、2.0μm及び3.0μmの3点での体積抵抗率の値のバラツキが大きいものを体積抵抗率の膜厚依存性が「有」と、バラツキの小さいものを同「無」と評価し、これらの結果を表1〜2に示した。
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012537254A JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011050126 | 2011-03-08 | ||
JP2011050126 | 2011-03-08 | ||
JP2012537254A JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
PCT/JP2012/055524 WO2012121196A1 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099780A Division JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5310957B2 JP5310957B2 (ja) | 2013-10-09 |
JPWO2012121196A1 true JPWO2012121196A1 (ja) | 2014-07-17 |
Family
ID=46798158
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537254A Active JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
JP2013099780A Pending JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099780A Pending JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9384868B2 (ja) |
EP (1) | EP2684918B1 (ja) |
JP (2) | JP5310957B2 (ja) |
KR (1) | KR101853695B1 (ja) |
CN (1) | CN103415580A (ja) |
TW (1) | TWI540188B (ja) |
WO (1) | WO2012121196A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2900409B1 (en) * | 2012-09-27 | 2019-05-22 | Rhodia Operations | Process for making silver nanostructures and copolymer useful in such process |
TWI574284B (zh) * | 2014-06-25 | 2017-03-11 | 柯尼卡美能達股份有限公司 | 附導電性圖案基材之製造方法 |
CN108148471A (zh) * | 2016-12-05 | 2018-06-12 | 洛阳尖端技术研究院 | 一种导电油墨及其制备方法 |
JP2018180168A (ja) * | 2017-04-07 | 2018-11-15 | ホヤ レンズ タイランド リミテッドHOYA Lens Thailand Ltd | 処理パターンが形成された光学部材の製造方法 |
JP6530019B2 (ja) * | 2017-08-08 | 2019-06-12 | 田中貴金属工業株式会社 | 金属インク |
JP7019996B2 (ja) * | 2017-08-23 | 2022-02-16 | コニカミノルタ株式会社 | 水系インクおよび画像形成方法 |
JP2021521314A (ja) * | 2018-05-08 | 2021-08-26 | アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ | 導電性インク |
CN115651448B (zh) * | 2021-07-07 | 2024-04-09 | 华南理工大学 | 一种具备n型导电的导电油墨及其制备与应用 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5286415A (en) * | 1992-12-28 | 1994-02-15 | Advanced Products, Inc. | Water-based polymer thick film conductive ink |
CN101036199A (zh) * | 2004-10-08 | 2007-09-12 | 三井金属矿业株式会社 | 导电性油墨 |
JP4799881B2 (ja) * | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
JP2007146117A (ja) * | 2005-11-04 | 2007-06-14 | Mitsui Mining & Smelting Co Ltd | ニッケルインク及びそのニッケルインクで形成した導体膜 |
WO2008013198A1 (en) * | 2006-07-28 | 2008-01-31 | The Furukawa Electric Co., Ltd. | Method for producing fine particle dispersion and fine particle dispersion |
DE102007037079A1 (de) * | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
JP2008184567A (ja) * | 2007-01-31 | 2008-08-14 | Ricoh Co Ltd | 記録用インク、並びにインクカートリッジ、インクジェット記録方法、及びインクジェット記録装置 |
KR20080088712A (ko) * | 2007-03-30 | 2008-10-06 | 삼성전자주식회사 | 전도성 잉크 조성물 및 이를 이용한 전도성 패턴의 형성방법 |
CN101678460B (zh) | 2007-05-16 | 2012-07-04 | Dic株式会社 | 含银纳米结构体的制造方法和含银纳米结构体 |
JP2009091383A (ja) | 2007-10-03 | 2009-04-30 | Seiko Epson Corp | 導体パターン形成用インク、導体パターンおよび配線基板 |
JP4867905B2 (ja) * | 2007-12-11 | 2012-02-01 | セイコーエプソン株式会社 | 導体パターン形成用インク、導体パターン、および配線基板 |
CN101519552B (zh) * | 2008-02-29 | 2011-08-24 | 中国科学院化学研究所 | 含贵金属纳米颗粒的喷墨水溶性墨水的制备方法 |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
JP5117420B2 (ja) * | 2008-03-27 | 2013-01-16 | 古河電気工業株式会社 | 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法 |
JP2010047807A (ja) * | 2008-08-22 | 2010-03-04 | Seiko Epson Corp | 複合化金属薄膜粒子、複合化金属薄膜粒子分散液、導電回路製造用インク、導電回路の製造方法および導電回路 |
JP5201407B2 (ja) | 2008-09-24 | 2013-06-05 | Dic株式会社 | 導電性インクジェットインク |
JP5661273B2 (ja) * | 2008-11-26 | 2015-01-28 | 三ツ星ベルト株式会社 | 金属コロイド粒子及びそのペースト並びにその製造方法 |
JP5399100B2 (ja) * | 2009-03-04 | 2014-01-29 | 三ツ星ベルト株式会社 | 金属コロイド粒子凝集体及びその製造方法 |
CN101805538B (zh) * | 2010-04-08 | 2014-05-07 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
-
2012
- 2012-03-05 EP EP12754756.0A patent/EP2684918B1/en not_active Not-in-force
- 2012-03-05 WO PCT/JP2012/055524 patent/WO2012121196A1/ja active Application Filing
- 2012-03-05 CN CN2012800120159A patent/CN103415580A/zh active Pending
- 2012-03-05 KR KR1020137021716A patent/KR101853695B1/ko active IP Right Grant
- 2012-03-05 JP JP2012537254A patent/JP5310957B2/ja active Active
- 2012-03-05 US US14/003,520 patent/US9384868B2/en not_active Expired - Fee Related
- 2012-03-08 TW TW101107809A patent/TWI540188B/zh not_active IP Right Cessation
-
2013
- 2013-05-10 JP JP2013099780A patent/JP2013225515A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2684918B1 (en) | 2018-09-12 |
EP2684918A1 (en) | 2014-01-15 |
CN103415580A (zh) | 2013-11-27 |
EP2684918A4 (en) | 2015-04-29 |
KR101853695B1 (ko) | 2018-05-02 |
US20140134327A1 (en) | 2014-05-15 |
KR20140015331A (ko) | 2014-02-06 |
TW201245348A (en) | 2012-11-16 |
WO2012121196A1 (ja) | 2012-09-13 |
US9384868B2 (en) | 2016-07-05 |
TWI540188B (zh) | 2016-07-01 |
JP2013225515A (ja) | 2013-10-31 |
JP5310957B2 (ja) | 2013-10-09 |
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