JP5310957B2 - インクジェット記録用導電性水性インク - Google Patents
インクジェット記録用導電性水性インク Download PDFInfo
- Publication number
- JP5310957B2 JP5310957B2 JP2012537254A JP2012537254A JP5310957B2 JP 5310957 B2 JP5310957 B2 JP 5310957B2 JP 2012537254 A JP2012537254 A JP 2012537254A JP 2012537254 A JP2012537254 A JP 2012537254A JP 5310957 B2 JP5310957 B2 JP 5310957B2
- Authority
- JP
- Japan
- Prior art keywords
- ink
- water
- based ink
- jet recording
- nitrogen atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 49
- 239000002082 metal nanoparticle Substances 0.000 claims description 35
- 150000005846 sugar alcohols Polymers 0.000 claims description 24
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 18
- 229910052757 nitrogen Inorganic materials 0.000 claims description 17
- 150000002894 organic compounds Chemical class 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 13
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 63
- 239000006185 dispersion Substances 0.000 description 32
- 239000000758 substrate Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000002609 medium Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 238000007639 printing Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920002873 Polyethylenimine Polymers 0.000 description 5
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 229940058015 1,3-butylene glycol Drugs 0.000 description 2
- XPFCZYUVICHKDS-UHFFFAOYSA-N 3-methylbutane-1,3-diol Chemical compound CC(C)(O)CCO XPFCZYUVICHKDS-UHFFFAOYSA-N 0.000 description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- OZFIGURLAJSLIR-UHFFFAOYSA-N 1-ethenyl-2h-pyridine Chemical compound C=CN1CC=CC=C1 OZFIGURLAJSLIR-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- 125000003006 2-dimethylaminoethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- -1 silver ions Chemical class 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 238000005199 ultracentrifugation Methods 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Manufacturing Of Electric Cables (AREA)
- Ink Jet (AREA)
Description
・インク外観
目視で沈降の有無を確認した。いずれのインクについても沈降は認められなかった。
・粘度
E型粘度計で、23℃において、回転数100rpmにて測定し、その結果を表1〜2に示した。
・表面張力
室温でWilhelmy法(Ptプレート)を用いて測定し、その結果を表1〜2に示した。
・経時安定性
調製された各種インクジェット記録用導電性水性インクと、それを2週間冷蔵保存したインクにつき、それぞれインクの外観、粘度及び表面張力につき測定を行い、調製直後と相違があるか否かを評価した。2週間冷蔵保存したいずれのインクも、調製直後と同様に、外観変化がなく、粘度及び表面張力も、調製直後に対して変化率10%以下であり、良好であった。
加えて、測定した焼成後塗膜の0.5μm、2.0μm及び3.0μmの3点での体積抵抗率の値のバラツキが大きいものを体積抵抗率の膜厚依存性が「有」と、バラツキの小さいものを同「無」と評価し、これらの結果を表1〜2に示した。
Claims (4)
- 塩基性窒素原子を含有する高分子有機化合物が、平均分子量10,000〜30,000の塩基性窒素原子を含有する高分子有機化合物である請求項1記載のインクジェット記録用導電性水性インク。
- 質量換算で金属ナノ粒子(X)100部当たり、塩基性窒素原子を含有する高分子有機化合物1〜7部を含有する請求項1または2記載のインクジェット記録用導電性水性インク。
- 更に、シリコーン系界面活性剤を含有する請求項1〜3のいずれか一項記載のインクジェット記録用導電性水性インク。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012537254A JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011050126 | 2011-03-08 | ||
JP2011050126 | 2011-03-08 | ||
PCT/JP2012/055524 WO2012121196A1 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
JP2012537254A JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099780A Division JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5310957B2 true JP5310957B2 (ja) | 2013-10-09 |
JPWO2012121196A1 JPWO2012121196A1 (ja) | 2014-07-17 |
Family
ID=46798158
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012537254A Active JP5310957B2 (ja) | 2011-03-08 | 2012-03-05 | インクジェット記録用導電性水性インク |
JP2013099780A Pending JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099780A Pending JP2013225515A (ja) | 2011-03-08 | 2013-05-10 | 電気電子部品の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9384868B2 (ja) |
EP (1) | EP2684918B1 (ja) |
JP (2) | JP5310957B2 (ja) |
KR (1) | KR101853695B1 (ja) |
CN (1) | CN103415580A (ja) |
TW (1) | TWI540188B (ja) |
WO (1) | WO2012121196A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104797363B (zh) * | 2012-09-27 | 2018-09-07 | 罗地亚经营管理公司 | 制造银纳米结构的方法和可用于此方法的共聚物 |
TWI574284B (zh) * | 2014-06-25 | 2017-03-11 | 柯尼卡美能達股份有限公司 | 附導電性圖案基材之製造方法 |
CN108148471A (zh) * | 2016-12-05 | 2018-06-12 | 洛阳尖端技术研究院 | 一种导电油墨及其制备方法 |
JP2018180168A (ja) * | 2017-04-07 | 2018-11-15 | ホヤ レンズ タイランド リミテッドHOYA Lens Thailand Ltd | 処理パターンが形成された光学部材の製造方法 |
JP6530019B2 (ja) * | 2017-08-08 | 2019-06-12 | 田中貴金属工業株式会社 | 金属インク |
JP7019996B2 (ja) * | 2017-08-23 | 2022-02-16 | コニカミノルタ株式会社 | 水系インクおよび画像形成方法 |
JP2021521314A (ja) * | 2018-05-08 | 2021-08-26 | アグフア−ゲヴエルト,ナームローゼ・フエンノートシヤツプ | 導電性インク |
CN115651448B (zh) * | 2021-07-07 | 2024-04-09 | 华南理工大学 | 一种具备n型导电的导电油墨及其制备与应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008184567A (ja) * | 2007-01-31 | 2008-08-14 | Ricoh Co Ltd | 記録用インク、並びにインクカートリッジ、インクジェット記録方法、及びインクジェット記録装置 |
JP2009091383A (ja) * | 2007-10-03 | 2009-04-30 | Seiko Epson Corp | 導体パターン形成用インク、導体パターンおよび配線基板 |
JP2010080095A (ja) * | 2008-09-24 | 2010-04-08 | Dic Corp | 導電性インクジェットインク |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5286415A (en) * | 1992-12-28 | 1994-02-15 | Advanced Products, Inc. | Water-based polymer thick film conductive ink |
CN101036199A (zh) * | 2004-10-08 | 2007-09-12 | 三井金属矿业株式会社 | 导电性油墨 |
JP4799881B2 (ja) * | 2004-12-27 | 2011-10-26 | 三井金属鉱業株式会社 | 導電性インク |
JP2007146117A (ja) * | 2005-11-04 | 2007-06-14 | Mitsui Mining & Smelting Co Ltd | ニッケルインク及びそのニッケルインクで形成した導体膜 |
WO2008013198A1 (en) * | 2006-07-28 | 2008-01-31 | The Furukawa Electric Co., Ltd. | Method for producing fine particle dispersion and fine particle dispersion |
DE102007037079A1 (de) * | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
KR20080088712A (ko) * | 2007-03-30 | 2008-10-06 | 삼성전자주식회사 | 전도성 잉크 조성물 및 이를 이용한 전도성 패턴의 형성방법 |
CN101678460B (zh) | 2007-05-16 | 2012-07-04 | Dic株式会社 | 含银纳米结构体的制造方法和含银纳米结构体 |
JP4867905B2 (ja) * | 2007-12-11 | 2012-02-01 | セイコーエプソン株式会社 | 導体パターン形成用インク、導体パターン、および配線基板 |
CN101519552B (zh) * | 2008-02-29 | 2011-08-24 | 中国科学院化学研究所 | 含贵金属纳米颗粒的喷墨水溶性墨水的制备方法 |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
JP5117420B2 (ja) * | 2008-03-27 | 2013-01-16 | 古河電気工業株式会社 | 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法 |
JP2010047807A (ja) * | 2008-08-22 | 2010-03-04 | Seiko Epson Corp | 複合化金属薄膜粒子、複合化金属薄膜粒子分散液、導電回路製造用インク、導電回路の製造方法および導電回路 |
JP5661273B2 (ja) * | 2008-11-26 | 2015-01-28 | 三ツ星ベルト株式会社 | 金属コロイド粒子及びそのペースト並びにその製造方法 |
JP5399100B2 (ja) * | 2009-03-04 | 2014-01-29 | 三ツ星ベルト株式会社 | 金属コロイド粒子凝集体及びその製造方法 |
CN101805538B (zh) * | 2010-04-08 | 2014-05-07 | 中国科学院宁波材料技术与工程研究所 | 可低温烧结的导电墨水 |
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JP2009091383A (ja) * | 2007-10-03 | 2009-04-30 | Seiko Epson Corp | 導体パターン形成用インク、導体パターンおよび配線基板 |
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WO2012121196A1 (ja) | 2012-09-13 |
JP2013225515A (ja) | 2013-10-31 |
KR101853695B1 (ko) | 2018-05-02 |
EP2684918B1 (en) | 2018-09-12 |
EP2684918A4 (en) | 2015-04-29 |
JPWO2012121196A1 (ja) | 2014-07-17 |
KR20140015331A (ko) | 2014-02-06 |
TWI540188B (zh) | 2016-07-01 |
US20140134327A1 (en) | 2014-05-15 |
CN103415580A (zh) | 2013-11-27 |
EP2684918A1 (en) | 2014-01-15 |
TW201245348A (en) | 2012-11-16 |
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