JPWO2012002378A1 - 配線基板および撮像装置ならびに撮像装置モジュール - Google Patents
配線基板および撮像装置ならびに撮像装置モジュール Download PDFInfo
- Publication number
- JPWO2012002378A1 JPWO2012002378A1 JP2012522638A JP2012522638A JPWO2012002378A1 JP WO2012002378 A1 JPWO2012002378 A1 JP WO2012002378A1 JP 2012522638 A JP2012522638 A JP 2012522638A JP 2012522638 A JP2012522638 A JP 2012522638A JP WO2012002378 A1 JPWO2012002378 A1 JP WO2012002378A1
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating substrate
- imaging device
- region
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 229920005989 resin Polymers 0.000 description 45
- 239000011347 resin Substances 0.000 description 45
- 239000000919 ceramic Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 20
- 239000004020 conductor Substances 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
<第1の実施形態>
本発明の第1の実施形態における撮像モジュールは、図1に示す例のように撮像装置10と撮像装置10上に設けられたレンズ固定部材11とレンズ固定部材11に固定されたレンズ12とを有している。
<第2の実施形態>
本発明の第2の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図4に示す例のように、絶縁基板1aの下面の周囲領域1bが貫通孔2を囲む傾斜領域1cと傾斜領域1cを囲む平坦領域1dとを有しており、複数の接続電極4が、平坦領域1dに設けられている点である。その他の構成については、第1の実施形態と同様である。
<第3の実施形態>
本発明の第3の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図5に示す例のように、絶縁基板1aは下面のうち貫通孔2を囲む縁部分に凹み部を有している点である。その他の構成については、第1の実施形態と同様である。
<第4の実施形態>
本発明の第4の実施形態における撮像装置10において、第1の実施形態と異なる部分は、図6に示す例のように、絶縁基板1aは電子部品13が設けられる凹部14を含む上面を有している点および凹部14は平面視で傾斜領域1cの周囲に位置している点ならびに配線基板1が平板状に形成されている点である。その他の構成については、第1の実施形態と同様である。
1a・・・絶縁基板
1b・・・周囲領域
1c・・・傾斜領域
1d・・・平坦領域
2・・・・貫通孔
3・・・・配線導体
4・・・・接続電極
5・・・・外部端子
6・・・・撮像素子
6a・・・受光部
6b・・・接続端子
7・・・・キャビティ
8a・・・接続部材
8b・・・接合材
9・・・・透光性部材
10・・・・撮像装置
11・・・・レンズ固定部材
12・・・・レンズ
13・・・・電子部品
14・・・・凹部
Claims (8)
- 開口部を有している絶縁基板と、
該絶縁基板の下面のうち前記開口部の周囲領域に設けられており、撮像素子が電気的に接続される複数の接続電極とを備えており、
前記周囲領域が、前記開口部を囲んでおり、前記開口部に向かって下方へ傾斜している傾斜領域を有していることを特徴とする配線基板。 - 前記絶縁基板は、前記下面のうち前記開口部の縁部分に凹み部を有していることを特徴とする請求項1記載の配線基板。
- 前記周囲領域が、前記傾斜領域を囲む平坦領域を有しており、前記複数の接続電極が、前記平坦領域に設けられていることを特徴とする請求項1記載の配線基板。
- 前記絶縁基板は、電子部品が設けられる凹部を含む上面を有していることを特徴とする請求項1記載の配線基板。
- 前記凹部は、平面視で前記傾斜領域の周囲に位置していることを特徴とする請求項4記載の配線基板。
- 前記絶縁基板の上面が、前記開口部に向かって下方へ傾斜している傾斜領域を有していることを特徴とする請求項1記載の配線基板。
- 請求項1乃至請求項6のいずれかに記載された配線基板と、
該配線基板の前記絶縁基板の前記下面に搭載されており、前記複数の接続電極に電気的に接続された撮像素子とを備えていることを特徴とする撮像装置。 - 請求項7に記載された撮像装置と、
該撮像装置の前記開口部の上方に設けられたレンズとを具備することを特徴とする撮像装置モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012522638A JP5491628B2 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010146463 | 2010-06-28 | ||
JP2010146463 | 2010-06-28 | ||
JP2012522638A JP5491628B2 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
PCT/JP2011/064794 WO2012002378A1 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012002378A1 true JPWO2012002378A1 (ja) | 2013-08-29 |
JP5491628B2 JP5491628B2 (ja) | 2014-05-14 |
Family
ID=45402085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012522638A Active JP5491628B2 (ja) | 2010-06-28 | 2011-06-28 | 配線基板および撮像装置ならびに撮像装置モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130128109A1 (ja) |
EP (1) | EP2587793B1 (ja) |
JP (1) | JP5491628B2 (ja) |
KR (1) | KR20130120981A (ja) |
CN (1) | CN102893593B (ja) |
WO (1) | WO2012002378A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022097355A (ja) * | 2020-12-18 | 2022-06-30 | 海華科技股▲分▼有限公司 | 携帯電子機器及びそのカスタマイズ画像取得モジュール |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9826641B2 (en) | 2012-05-31 | 2017-11-21 | Kyocera Corporation | Electronic device mounting board and electronic apparatus |
JP6022888B2 (ja) * | 2012-10-19 | 2016-11-09 | 京セラ株式会社 | 電子素子搭載用基板および電子装置 |
JP6150249B2 (ja) * | 2013-02-25 | 2017-06-21 | 京セラ株式会社 | 電子デバイスのガラス封止方法 |
US9608020B2 (en) * | 2013-10-23 | 2017-03-28 | Kyocera Corporation | Imaging element mounting substrate and imaging device |
CN105280630B (zh) * | 2014-06-10 | 2019-01-01 | 意法半导体(格勒诺布尔2)公司 | 包括光学传感器芯片的电子设备 |
KR20160080166A (ko) * | 2014-12-29 | 2016-07-07 | 에스케이하이닉스 주식회사 | 이미지 센서 내장형 패키지 및 그 제조방법 |
CN105472215A (zh) * | 2015-12-01 | 2016-04-06 | 宁波舜宇光电信息有限公司 | 具有电气支架的摄像模组及其组装方法和应用 |
KR20180093962A (ko) | 2015-12-01 | 2018-08-22 | 닝보 써니 오포테크 코., 엘티디. | 촬상 모듈 및 이의 전기적 지지체 |
CN105530413B (zh) * | 2015-12-01 | 2019-08-30 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和线路导通方法 |
JP6574854B2 (ja) * | 2015-12-24 | 2019-09-11 | 京セラ株式会社 | 撮像素子実装用基板および撮像装置 |
JP2017139258A (ja) * | 2016-02-01 | 2017-08-10 | ソニー株式会社 | 撮像素子パッケージ及び撮像装置 |
JP6949515B2 (ja) * | 2017-03-15 | 2021-10-13 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール及びその製造方法、並びに、電子機器 |
EP3703128A4 (en) * | 2017-10-26 | 2021-08-18 | KYOCERA Corporation | IMAGING ELEMENT MOUNTING SUBSTRATE, DEVICE AND IMAGING MODULE |
JP7062688B2 (ja) * | 2017-12-28 | 2022-05-06 | 京セラ株式会社 | 配線基板、電子装置及び電子モジュール |
JP6976201B2 (ja) * | 2018-03-13 | 2021-12-08 | 京セラ株式会社 | 固定構造、電子機器、撮像装置、移動体、および固定構造の製造方法 |
TWI677745B (zh) * | 2018-12-05 | 2019-11-21 | 海華科技股份有限公司 | 影像擷取模組及可攜式電子裝置 |
CN111866322A (zh) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | 摄像模组及其感光组件、电子设备和制备方法 |
CN216162757U (zh) * | 2021-05-25 | 2022-04-01 | 三赢科技(深圳)有限公司 | 镜头模组及电子装置 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140156A (ja) * | 1982-02-16 | 1983-08-19 | Canon Inc | 固体撮像装置 |
JP4004705B2 (ja) * | 2000-02-29 | 2007-11-07 | 松下電器産業株式会社 | 撮像装置と撮像装置組立方法 |
JP2001358997A (ja) * | 2000-06-12 | 2001-12-26 | Mitsubishi Electric Corp | 半導体装置 |
JP2002134763A (ja) * | 2000-10-27 | 2002-05-10 | Kyocera Corp | 半導体受光素子収納用容器 |
JP2002305261A (ja) * | 2001-01-10 | 2002-10-18 | Canon Inc | 電子部品及びその製造方法 |
US20050051859A1 (en) * | 2001-10-25 | 2005-03-10 | Amkor Technology, Inc. | Look down image sensor package |
JP5030360B2 (ja) * | 2002-12-25 | 2012-09-19 | オリンパス株式会社 | 固体撮像装置の製造方法 |
JP3768972B2 (ja) * | 2003-04-28 | 2006-04-19 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
JP2004341201A (ja) * | 2003-05-15 | 2004-12-02 | Konica Minolta Opto Inc | 撮像装置 |
JP4303610B2 (ja) * | 2003-05-19 | 2009-07-29 | 富士フイルム株式会社 | 多層配線基板、部品実装方法、及び、撮像装置 |
JP4411893B2 (ja) * | 2003-07-28 | 2010-02-10 | パナソニック電工株式会社 | 立体回路板及び撮像装置 |
CN101175155A (zh) * | 2003-09-30 | 2008-05-07 | 富士通株式会社 | 相机模块 |
JP4170968B2 (ja) * | 2004-02-02 | 2008-10-22 | 松下電器産業株式会社 | 光学デバイス |
KR100609012B1 (ko) * | 2004-02-11 | 2006-08-03 | 삼성전자주식회사 | 배선기판 및 이를 이용한 고체 촬상용 반도체 장치 |
US20060016973A1 (en) * | 2004-07-21 | 2006-01-26 | Advanced Semiconductor Engineering, Inc. | Multi-chip image sensor package module |
WO2006011200A1 (ja) * | 2004-07-28 | 2006-02-02 | Fujitsu Limited | 撮像装置 |
JP4428526B2 (ja) * | 2004-10-15 | 2010-03-10 | パナソニック株式会社 | 光学デバイス |
JP4196937B2 (ja) * | 2004-11-22 | 2008-12-17 | パナソニック株式会社 | 光学装置 |
JP2006201427A (ja) * | 2005-01-20 | 2006-08-03 | Kyocera Corp | 撮像素子収納用パッケージ、撮像装置および撮像モジュール |
JP2007027452A (ja) * | 2005-07-19 | 2007-02-01 | Matsushita Electric Ind Co Ltd | 固体撮像素子モジュール及び固体撮像素子モジュールの製造方法 |
TWI308456B (en) * | 2005-12-30 | 2009-04-01 | Advanced Semiconductor Eng | Compact camera module and method for fabricating the same |
JP2007299929A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 光学デバイス装置とそれを用いた光学デバイスモジュール |
KR100790994B1 (ko) * | 2006-08-01 | 2008-01-03 | 삼성전자주식회사 | 이미지 센서 패키지, 그 제조 방법 및 이미지 센서패키지를 포함하는 이미지 센서 모듈 |
US20080136012A1 (en) * | 2006-12-08 | 2008-06-12 | Advanced Chip Engineering Technology Inc. | Imagine sensor package and forming method of the same |
JP2008263550A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2008263552A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
US20090179290A1 (en) * | 2008-01-15 | 2009-07-16 | Huang Shuangwu | Encapsulated imager packaging |
JP2010238995A (ja) * | 2009-03-31 | 2010-10-21 | Sanyo Electric Co Ltd | 半導体モジュールおよびこれを搭載したカメラモジュール |
JP2011101228A (ja) * | 2009-11-06 | 2011-05-19 | Toshiba Corp | セラミックパッケージおよびカメラモジュール |
WO2011065485A1 (ja) * | 2009-11-26 | 2011-06-03 | 京セラ株式会社 | 配線基板および撮像装置ならびに撮像装置モジュール |
-
2011
- 2011-06-28 WO PCT/JP2011/064794 patent/WO2012002378A1/ja active Application Filing
- 2011-06-28 CN CN201180024080.9A patent/CN102893593B/zh active Active
- 2011-06-28 JP JP2012522638A patent/JP5491628B2/ja active Active
- 2011-06-28 KR KR1020127031487A patent/KR20130120981A/ko active Search and Examination
- 2011-06-28 US US13/701,443 patent/US20130128109A1/en not_active Abandoned
- 2011-06-28 EP EP11800842.4A patent/EP2587793B1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022097355A (ja) * | 2020-12-18 | 2022-06-30 | 海華科技股▲分▼有限公司 | 携帯電子機器及びそのカスタマイズ画像取得モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP5491628B2 (ja) | 2014-05-14 |
WO2012002378A1 (ja) | 2012-01-05 |
EP2587793A4 (en) | 2014-04-16 |
EP2587793B1 (en) | 2020-01-08 |
CN102893593A (zh) | 2013-01-23 |
EP2587793A1 (en) | 2013-05-01 |
KR20130120981A (ko) | 2013-11-05 |
US20130128109A1 (en) | 2013-05-23 |
CN102893593B (zh) | 2016-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5491628B2 (ja) | 配線基板および撮像装置ならびに撮像装置モジュール | |
JP5289582B2 (ja) | 撮像装置および撮像装置モジュール | |
JP5324667B2 (ja) | 撮像装置 | |
US9276023B2 (en) | Image pickup element housing package, and image pickup device | |
JP6732932B2 (ja) | 撮像素子実装用基体、撮像装置および撮像モジュール | |
WO2014115766A1 (ja) | 電子素子搭載用パッケージ、電子装置および撮像モジュール | |
JP5595066B2 (ja) | 撮像装置および撮像モジュール | |
JP5988412B2 (ja) | 撮像素子搭載用基板および撮像装置 | |
JP7025819B2 (ja) | 撮像素子実装用基板、撮像装置および撮像モジュール | |
JP2010153763A (ja) | 撮像素子収納用パッケージおよび撮像装置 | |
JP5460356B2 (ja) | 撮像装置 | |
WO2020241775A1 (ja) | 電子素子実装用基板、電子装置、および電子モジュール | |
JP2020088196A (ja) | 配線基板および電子装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131021 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140128 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140227 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5491628 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |