JPWO2011148617A1 - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 251
- 210000000746 body region Anatomy 0.000 claims abstract description 62
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 53
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 51
- 239000012535 impurity Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims 1
- 108091006146 Channels Proteins 0.000 description 63
- 239000000758 substrate Substances 0.000 description 19
- 229910004298 SiO 2 Inorganic materials 0.000 description 18
- 230000006870 function Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
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- 238000005121 nitriding Methods 0.000 description 4
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- 230000006378 damage Effects 0.000 description 3
- 230000005524 hole trap Effects 0.000 description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000013213 extrapolation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 1
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- 238000005240 physical vapour deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7838—Field effect transistors with field effect produced by an insulated gate without inversion channel, e.g. buried channel lateral MISFETs, normally-on lateral MISFETs, depletion-mode lateral MISFETs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
- H01L29/7828—Vertical transistors without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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Abstract
Description
Vfb=Φms−(Qf+Qb)/Ci ・・・(式1)
Φmsはゲート電極と半導体ボディ領域との仕事関数差、Qfはゲート絶縁膜に係る固定電荷密度、Qbはチャネル層の空間電荷密度、Ciはゲート絶縁膜容量である。
図1の模式的断面図を参照しながら、本発明の実施形態の一例に係る半導体装置100について説明する。
Qb≧(Φms−Qf/Ci+2Eg)Ci ・・・(式2)
Qb≧1.3Eg×Ci ・・・(式3)
Qb≧Eg×Ci ・・・(式3)
次に、図8を参照しながら、本発明の第2の実施形態に係る半導体装置102について説明する。
11,111 第1の半導体層(ドリフト層)
20,120 ボディ領域(ウェル領域)
22,122 コンタクト領域
24,124,224 ソース領域
26,126 ソース電極
28,128 ドレイン電極
30,230 ドレイン領域
40,140,240 チャネル層(埋込層、チャネルエピ層)
42 チャネル領域
44,144,244 ゲート絶縁膜
46,146,246 ゲート電極
100 半導体装置
101 横型SiC−MISFET
102 半導体装置
1100 半導体装置
Claims (10)
- 半導体ボディ領域、
ゲート絶縁膜、
前記半導体ボディ領域と前記ゲート絶縁膜との間に設けられ、前記半導体ボディ領域とは逆の半導体極性のチャネル層、及び
前記ゲート絶縁膜と接して設けられたゲート電極を有するMIS型の半導体装置であって、
前記半導体ボディ領域のバンド曲がりがゼロとなるゲート電圧をフラットバンド電圧Vfb、前記半導体装置のオフ側の極性のゲートの定格電圧をVgcc-と定義するとき、
前記半導体装置のVfbがVgcc-と同等かそれ以下である、半導体装置。 - 前記半導体ボディ領域のバンドギャップをEg、前記半導体装置のオン側の極性のゲートの定格電圧をVgccと定義するとき、
前記半導体装置のVfbが−Vgcc/2と−2Egのいずれか低い方と同等かそれ以下である、請求項1に記載の半導体装置。 - 前記半導体装置のゲート絶縁膜容量をCiと定義するとき、
前記チャネル層の半導体不純物濃度が1018cm-3より高く5×1019cm-3以下であって、かつ、面積当りの半導体不純物電荷濃度がEg×Ci[C/cm2]と同等かそれ以上である、請求項2に記載の半導体装置。 - 前記半導体装置のゲート絶縁膜容量をCi、前記ゲート絶縁膜に係る固定電荷密度をQfと定義するとき、
前記Qfが1.5Eg×Ci[C/cm2]と同等かそれ以上である、請求項2に記載の半導体装置。 - 前記半導体装置のゲート絶縁膜容量をCi、前記ゲート絶縁膜に係る固定電荷密度をQf、前記半導体ボディ領域と前記ゲート電極との仕事関数差をΦmsと定義するとき、
Qf−Φms×Ciの値が2Eg×Ci[C/cm2]と同等かそれ以上である、請求項2に記載の半導体装置。 - 前記半導体装置のゲート絶縁膜容量をCi、前記チャネル層の面積当りの半導体不純物電荷濃度をQb、前記半導体ボディ領域と前記ゲート電極との仕事関数差をΦmsと定義するとき、
前記チャネル層の半導体不純物濃度が1018cm-3より大きく5×1019cm-3以下であって、かつ、Qb−Φms×Ciの値が2Eg×Ci[C/cm2]と同等かそれ以上である、請求項2に記載の半導体装置。 - 前記半導体ボディ領域及び前記チャネル層が炭化珪素により構成される、請求項1から6のいずれかに記載の半導体装置。
- Vfbが−10ボルト以下である請求項7に記載の半導体装置。
- 半導体ボディ領域、ゲート絶縁膜、前記半導体ボディ領域と前記ゲート絶縁膜との間に設けられ、前記半導体ボディ領域とは逆の半導体極性のチャネル層、及び、前記ゲート絶縁膜と接して設けられたゲート電極を有するMIS型の半導体装置の駆動方法であって、
前記半導体ボディ領域のバンド曲がりがゼロとなるゲート電圧をフラットバンド電圧Vfb、前記半導体装置のオフ側の極性のゲートの定格電圧をVgcc-、前記半導体装置のオン側の極性のゲートの定格電圧をVgcc、前記半導体装置の閾値電圧をVthと定義するとき、
VthとVgcc-との間の大きさの電圧を前記ゲート電極に印加する工程と、
VthとVgccとの間の大きさの電圧を前記ゲート電極に印加する工程と、
を含み、
前記半導体装置のVfbがVgcc-と同等かそれ以下である、半導体装置の駆動方法。 - 前記半導体ボディ領域のバンドギャップをEgと定義するとき、
前記半導体装置のVfbが−Vgcc/2と−2Egのいずれか低い方と同等かそれ以下である、請求項9に記載の半導体装置の駆動方法。
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US9882058B2 (en) * | 2013-05-03 | 2018-01-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TWI626746B (zh) * | 2014-04-03 | 2018-06-11 | 財團法人工業技術研究院 | 半導體結構 |
JP6690198B2 (ja) * | 2015-11-16 | 2020-04-28 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
IT201900007217A1 (it) * | 2019-05-24 | 2020-11-24 | Consiglio Nazionale Ricerche | Dispositivo elettronico basato su sic di tipo migliorato e metodo di fabbricazione dello stesso |
EP4250567A1 (en) * | 2022-03-23 | 2023-09-27 | Mitsubishi Electric R&D Centre Europe B.V. | Actions against gate deterioration of power semiconductors |
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JPH07193234A (ja) | 1993-12-27 | 1995-07-28 | Nec Corp | 半導体装置およびその製造方法 |
JP3240828B2 (ja) | 1994-04-20 | 2001-12-25 | ソニー株式会社 | Mosトランジスタ構造およびこれを用いた電荷転送装置 |
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JP2003309262A (ja) * | 2002-04-17 | 2003-10-31 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
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