JPWO2011010692A1 - 電極の接続方法およびそれに使用される接続組成物 - Google Patents
電極の接続方法およびそれに使用される接続組成物 Download PDFInfo
- Publication number
- JPWO2011010692A1 JPWO2011010692A1 JP2011523683A JP2011523683A JPWO2011010692A1 JP WO2011010692 A1 JPWO2011010692 A1 JP WO2011010692A1 JP 2011523683 A JP2011523683 A JP 2011523683A JP 2011523683 A JP2011523683 A JP 2011523683A JP WO2011010692 A1 JPWO2011010692 A1 JP WO2011010692A1
- Authority
- JP
- Japan
- Prior art keywords
- connection
- electrode
- light irradiation
- composition
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000001723 curing Methods 0.000 claims abstract description 31
- 230000003111 delayed effect Effects 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 238000000016 photochemical curing Methods 0.000 claims abstract description 8
- 230000000977 initiatory effect Effects 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 41
- 239000003822 epoxy resin Substances 0.000 claims description 40
- 239000003999 initiator Substances 0.000 claims description 11
- 238000003825 pressing Methods 0.000 abstract description 2
- 229920005862 polyol Polymers 0.000 description 21
- 150000003077 polyols Chemical class 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 14
- 239000011521 glass Substances 0.000 description 13
- -1 polyethylene terephthalate Polymers 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 8
- 229920005906 polyester polyol Polymers 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 5
- 239000003085 diluting agent Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229910017008 AsF 6 Inorganic materials 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 229910018286 SbF 6 Inorganic materials 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000012644 addition polymerization Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical group C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 150000003839 salts Chemical group 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- 150000003553 thiiranes Chemical group 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- HIYIGPVBMDKPCR-UHFFFAOYSA-N 1,1-bis(ethenoxymethyl)cyclohexane Chemical compound C=COCC1(COC=C)CCCCC1 HIYIGPVBMDKPCR-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- WNISWKAEAPQCJQ-UHFFFAOYSA-N 2-[(2-nonylphenoxy)methyl]oxirane Chemical compound CCCCCCCCCC1=CC=CC=C1OCC1OC1 WNISWKAEAPQCJQ-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical group C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical group C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
前記第1の接続部および前記第2の接続部の少なくとも一方に、(a)硬化性樹脂成分および(b)光硬化開始成分を含有し且つ光照射により遅延硬化性を有する接続組成物を塗布する工程と、
塗布された前記接続組成物に光照射する第1の光照射工程と、
前記接続組成物が硬化する前に、前記第1の電極と前記第2の電極の位置を合わせて前記第1の接続部と前記第2の接続部を互いに押し付けて、前記第1の接続部と前記第2の接続部が押し付けられた状態を保持しながら光照射する第2の光照射工程と
を有することを特徴とする電極の接続方法。
(a)エポキシ樹脂成分、
(b)光カチオン開始成分、
を含有し、第1の光照射工程後、30秒以上の遅延硬化性を有し、第2の光照射工程により硬化することを特徴とする接続組成物。
次に本発明の方法に使用される接続組成物を説明する。この組成物は、
(a)硬化性樹脂成分、
(b)光硬化開始成分
を含有する。
接続樹脂組成物は、遅延硬化が可能な系で、好ましくは光照射条件を変更することにより、遅延硬化と即硬化の両方が達成できる系である。特に、光カチオン重合系が好ましい。
divinyl ether)、ヒドロキシブチルビニルエーテル (hydorxybutyl vinyl ether)等のモノまたは多官能ビニールエーテル類を挙げることができる。
Ar1−I+−Ar2
で表されるように、I+に結合している基Ar1およびAr2が独立して2つとも芳香族基が好ましく、特に置換基を有していてもよいフェニル基が好ましい。
表1に示す成分を攪拌混合し、真空脱泡して接続組成物を得た。
HAAKE PK1タイプ粘度計を使用し、25℃での粘度を測定した。
スライドガラス(76x25x1.1mm)の上に実施例および比較例の組成物を塗布し、もう一枚のスライドガラスを90度方向で貼り合わせし、高圧水銀ランプを使用し、照度100mW/cm2の照度で、1秒間照射した。二枚のスライドガラスを手で動かし、容易に動かなくなった時間を可使時間とした。
金属電極を設けたガラス基板の上に、実施例の組成物を塗布し、高圧水銀ランプを使用し、照度100mW/cm2の照度で、1秒間照射した。1分後にポリイミドフィルムを載せ、ガラス基板側よりさらに高圧水銀ランプを使用し、照度100mW/cm2で、30秒間照射した。照射完了後約1時間後、ポリイミドフィルムを引き剥がし、接続の状況と金属電極上の実施例組成物の硬化状態を観察した。実施例1の組成物はガラス基板とポリイミドフィルムに良好な接着性を示し、金属電極の陰においても組成物が完全に硬化していたことを確認した。
12 第2の電極
13 硬化樹脂
14 第2の光照射工程で光が当たらない樹脂
21 透明基板
22 フレキシブル基板
Claims (8)
- 透明基板上に形成された第1の電極を含む第1の接続部と、フレキシブル基板上に形成された第2の電極を含む第2の接続部とを接着すると共に、前記第1の電極と前記第2の電極を電気的に接続する方法であって、
前記第1の接続部および前記第2の接続部の少なくとも一方に、(a)硬化性樹脂成分および(b)光硬化開始成分を含有し且つ光照射により遅延硬化性を有する接続組成物を塗布する工程と、
塗布された前記接続組成物に光照射する第1の光照射工程と、
前記接続組成物が硬化する前に、前記第1の電極と前記第2の電極の位置を合わせて前記第1の接続部と前記第2の接続部を互いに押し付けて、前記第1の接続部と前記第2の接続部が押し付けられた状態を保持しながら光照射する第2の光照射工程と
を有することを特徴とする電極の接続方法。 - 前記硬化性樹脂成分(a)が、エポキシ樹脂を含有することを特徴とする請求項1記載の方法。
- 前記光開始成分(b)が、光カチオン開始剤を含有することを特徴とする請求項1記載の方法。
- 前記第1の光照射工程において、前記接続組成物を少なくとも30秒の遅延時間後に硬化させるのに必要な範囲のエネルギーの光照射を行うことを特徴とする請求項1記載の方法。
- 前記第1の光照射工程において、前記接続組成物を30秒〜120分の間の遅延時間後に硬化させるのに必要な範囲のエネルギーの光照射を行うことを特徴とする請求項1記載の方法。
- 前記第2の光照射工程において、前記接続組成物を直ちに硬化させるのに十分なエネルギーの光照射を行うことを特徴とする請求項1記載の方法。
- 第2の光照射工程後に常温に放置する工程を有することを特徴とする請求項1〜6のいずれかに記載の方法。
- 請求項1〜7のいずれかに記載の方法に使用される接続組成物であって、
(a)エポキシ樹脂成分、
(b)光カチオン開始成分、
を含有し、第1の光照射工程後、30秒以上の遅延硬化性を有し、第2の光照射工程により硬化することを特徴とする接続組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011523683A JP5571083B2 (ja) | 2009-07-24 | 2010-07-22 | 電極の接続方法およびそれに使用される接続組成物 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009173085 | 2009-07-24 | ||
JP2009173085 | 2009-07-24 | ||
PCT/JP2010/062346 WO2011010692A1 (ja) | 2009-07-24 | 2010-07-22 | 電極の接続方法およびそれに使用される接続組成物 |
JP2011523683A JP5571083B2 (ja) | 2009-07-24 | 2010-07-22 | 電極の接続方法およびそれに使用される接続組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011010692A1 true JPWO2011010692A1 (ja) | 2013-01-07 |
JP5571083B2 JP5571083B2 (ja) | 2014-08-13 |
Family
ID=43499164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011523683A Expired - Fee Related JP5571083B2 (ja) | 2009-07-24 | 2010-07-22 | 電極の接続方法およびそれに使用される接続組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5571083B2 (ja) |
KR (1) | KR101393857B1 (ja) |
CN (1) | CN102550135B (ja) |
TW (1) | TWI483658B (ja) |
WO (1) | WO2011010692A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020240968A1 (ja) * | 2019-05-24 | 2021-11-11 | 三菱電機株式会社 | カメラモジュールの製造方法及び製造装置、並びに光学モジュールの製造方法 |
CN110190042A (zh) * | 2019-06-26 | 2019-08-30 | 云谷(固安)科技有限公司 | 绑定结构、绑定方法、显示面板及显示装置 |
JP7302460B2 (ja) | 2019-12-02 | 2023-07-04 | 三浦工業株式会社 | 空気圧縮システム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2978390B2 (ja) * | 1993-12-16 | 1999-11-15 | 松下電器産業株式会社 | フレキシブルプリント基板と配線基板との接続体の製造方法 |
JPH1143661A (ja) * | 1997-07-25 | 1999-02-16 | Nippon Kayaku Co Ltd | 電子部品用接着剤及び電子部品の取付け方法 |
JP2002175446A (ja) * | 2000-12-07 | 2002-06-21 | Nec Corp | 電子商取引システム及び電子商取引方法並びに同方法を実行するプログラムを記録した記憶媒体 |
JP2002275446A (ja) * | 2001-03-21 | 2002-09-25 | Showa Denko Kk | 表面実装用接着剤組成物 |
TWI252066B (en) * | 2002-02-28 | 2006-03-21 | Hitachi Chemical Co Ltd | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrodes-connected structure |
WO2005044470A1 (en) * | 2003-10-27 | 2005-05-19 | Adhesives Research, Inc. | Poly (alkylene oxide) polymer-based pressure sensitive adhesive and tapes formed therefrom |
JP4644469B2 (ja) * | 2004-11-09 | 2011-03-02 | 富士通株式会社 | 半導体チップのフリップチップ実装方法およびその実装装置 |
CN101176033B (zh) * | 2005-05-09 | 2010-05-26 | 积水化学工业株式会社 | 液晶滴加工序用密封剂、上下导通材料及液晶显示元件 |
JP2006173100A (ja) * | 2005-11-18 | 2006-06-29 | Hitachi Chem Co Ltd | 電極の接続方法 |
JP5212678B2 (ja) * | 2006-03-20 | 2013-06-19 | 富士通株式会社 | エポキシ樹脂組成物及びそれを用いた半導体装置の製造方法 |
JP2008059945A (ja) * | 2006-08-31 | 2008-03-13 | Nagase Chemtex Corp | 電子デバイスの製造方法 |
JP2008305580A (ja) * | 2007-06-05 | 2008-12-18 | Sekisui Chem Co Ltd | 光後硬化性組成物、有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
-
2010
- 2010-07-22 WO PCT/JP2010/062346 patent/WO2011010692A1/ja active Application Filing
- 2010-07-22 CN CN201080037908.XA patent/CN102550135B/zh not_active Expired - Fee Related
- 2010-07-22 JP JP2011523683A patent/JP5571083B2/ja not_active Expired - Fee Related
- 2010-07-22 KR KR1020127004682A patent/KR101393857B1/ko not_active IP Right Cessation
- 2010-07-23 TW TW099124410A patent/TWI483658B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101393857B1 (ko) | 2014-05-12 |
TWI483658B (zh) | 2015-05-01 |
TW201127243A (en) | 2011-08-01 |
CN102550135B (zh) | 2015-06-17 |
KR20120034244A (ko) | 2012-04-10 |
JP5571083B2 (ja) | 2014-08-13 |
WO2011010692A1 (ja) | 2011-01-27 |
CN102550135A (zh) | 2012-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6364191B2 (ja) | 導電材料、接続構造体及び接続構造体の製造方法 | |
JP2017508858A (ja) | 光硬化性エポキシ樹脂系 | |
US20050148694A1 (en) | Actinic radiation hardenable resin composition and hardening product thereof | |
JP2010169833A (ja) | 光硬化性樹脂と熱硬化性樹脂を含有する液晶滴下工法用シール剤 | |
WO2013027389A1 (ja) | シート状エポキシ樹脂組成物、及びこれを含む封止用シート | |
KR20010078053A (ko) | 접착제 조성물 | |
WO2016092816A1 (ja) | 有機el素子用の面封止材及びその硬化物 | |
JP6014325B2 (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
JP5479248B2 (ja) | 光学デバイス用封止剤 | |
JP2018095679A (ja) | シート状シール材、表示素子シール材、有機el素子用面封止材、有機elデバイス、および有機elデバイスの製造方法 | |
JP2011219682A (ja) | 硬化性樹脂組成物 | |
JP5571083B2 (ja) | 電極の接続方法およびそれに使用される接続組成物 | |
TW202035638A (zh) | 密封劑、硬化體、有機電致發光顯示裝置、及裝置之製造方法 | |
JP2014005454A (ja) | 接着剤およびそれを用いた透明基板 | |
US7495035B2 (en) | Photo-curable resin composition and sealing agent for flat panel display using the same | |
JP5555614B2 (ja) | 有機エレクトロルミネッセンス表示素子用封止剤 | |
JP6793471B2 (ja) | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 | |
JP2008305580A (ja) | 光後硬化性組成物、有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 | |
JP2013018810A (ja) | 硬化性樹脂組成物 | |
JP6793470B2 (ja) | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 | |
CN109219773B (zh) | 液晶显示元件用密封剂、上下导通材料、液晶显示元件和固化物 | |
JP2012046757A (ja) | 回路接続用接着剤及びこれらを用いた回路接続方法、接続体 | |
JP6817702B2 (ja) | 硬化性組成物、その硬化方法、これにより得られる硬化物および接着剤 | |
JP2016042541A (ja) | 接続構造体の製造方法、及び異方性導電接着フィルム | |
JP7368202B2 (ja) | 封止シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130718 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140114 |
|
A521 | Request for written amendment filed |
Effective date: 20140410 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140527 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140625 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5571083 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |