JPWO2011007732A1 - 接着シートの製造方法及び接着シート - Google Patents
接着シートの製造方法及び接着シート Download PDFInfo
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- 229920002689 polyvinyl acetate Polymers 0.000 description 1
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- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1195—Delaminating from release surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Abstract
Description
(破断強度)〔MPa〕=(破断強さ)〔kg〕/(測定サンプルの断面積)〔mm2〕
(破断強さ)〔kg〕=(破断強度)〔MPa〕×(実際のプリカット時の接着剤層の狭幅部の幅)〔mm〕×(実際にプリカットされる接着剤層の厚み)〔mm〕
長尺の剥離基材(PETフィルム、テイジンデュポンフィルム(株)製、500mm×2000mm)上に、以下の5種類の接着剤層を形成し、シート例1〜5を作製した。
剥離基材上に、破断強度18MPaで厚み5μmの接着剤層を形成し、シート例1を作製した。
剥離基材上に、破断強度18MPaで厚み10μmの接着剤層を形成し、シート例2を作製した。
剥離基材上に、破断強度18MPaで厚み25μmの接着剤層を形成し、シート例3を作製した。
剥離基材上に、破断強度4.5MPaで厚み10μmの接着剤層を形成し、シート例4を作製した。
剥離基材上に、破断強度4.5MPaで厚み25μmの接着剤層を形成し、シート例5を作製した。
実施例1〜12及び比較例1〜3のそれぞれにおいて、シート例1〜5に対して図2(b)及び(c)に示すように接着剤層のプリカットを行い、接着剤層の不要部分の狭幅部の幅を表1に示すように調整した。その後、接着剤層の不要部分を剥離し、接着剤層が破断するかどうかを目視にて評価した。接着剤層が破断しなかった場合を「A」、接着剤層が破断した場合を「B」とした。また、各実施例及び各比較例における接着剤層の狭幅部の破断強さを、上述した破断強さの測定方法により測定した。それらの結果を表1に示す。
Claims (3)
- 長尺の剥離基材と、該剥離基材上に島状に配置された接着剤層と、を備える接着シートの製造方法であって、
前記剥離基材上に長尺の接着剤層を積層した後、該接着剤層の所定の部分が前記剥離基材上に島状に残るように、該接着剤層の不要部分を剥離する剥離工程を有し、
前記剥離工程において、前記接着剤層の不要部分の短尺方向の幅が最も狭い狭幅部における破断強さが200g以上となるように、前記狭幅部の幅を調整する、接着シートの製造方法。 - 前記接着剤層の厚みが0.5μm以上である、請求項1記載の接着シートの製造方法。
- 請求項1又は2記載の接着シートの製造方法により製造された接着シート。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009165709 | 2009-07-14 | ||
JP2009165709 | 2009-07-14 | ||
PCT/JP2010/061709 WO2011007732A1 (ja) | 2009-07-14 | 2010-07-09 | 接着シートの製造方法及び接着シート |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016153848A Division JP2016186093A (ja) | 2009-07-14 | 2016-08-04 | 接着シートの製造方法及び接着シート |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011007732A1 true JPWO2011007732A1 (ja) | 2012-12-27 |
JP6091750B2 JP6091750B2 (ja) | 2017-03-08 |
Family
ID=43449340
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011522796A Active JP6091750B2 (ja) | 2009-07-14 | 2010-07-09 | 接着シートの製造方法 |
JP2016153848A Pending JP2016186093A (ja) | 2009-07-14 | 2016-08-04 | 接着シートの製造方法及び接着シート |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016153848A Pending JP2016186093A (ja) | 2009-07-14 | 2016-08-04 | 接着シートの製造方法及び接着シート |
Country Status (6)
Country | Link |
---|---|
US (1) | US9011624B2 (ja) |
JP (2) | JP6091750B2 (ja) |
KR (1) | KR101382781B1 (ja) |
CN (1) | CN102471648B (ja) |
TW (1) | TWI482710B (ja) |
WO (1) | WO2011007732A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6091750B2 (ja) * | 2009-07-14 | 2017-03-08 | 日立化成株式会社 | 接着シートの製造方法 |
JP5804084B2 (ja) * | 2012-07-03 | 2015-11-04 | 東レ株式会社 | 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法および半導体装置の製造方法 |
ES2533243B1 (es) | 2013-10-03 | 2016-01-14 | Bsh Electrodomésticos España, S.A. | Dispositivo de campo de cocción |
KR102535477B1 (ko) * | 2014-05-23 | 2023-05-23 | 가부시끼가이샤 레조낙 | 다이본드 다이싱 시트 |
DE102017011506B4 (de) * | 2017-12-13 | 2021-01-28 | Lts Lohmann Therapie-Systeme Ag | Trennvorrichtung und Trennverfahren für klebstoffhaltiges Verbundmaterial |
CN111655470A (zh) * | 2018-01-24 | 2020-09-11 | 琳得科株式会社 | 长条层叠片及其卷料 |
JP7281873B2 (ja) | 2018-05-14 | 2023-05-26 | 株式会社ディスコ | ウェーハの加工方法 |
JP7130323B2 (ja) * | 2018-05-14 | 2022-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
CN109372857B (zh) * | 2018-09-28 | 2020-12-04 | 京东方科技集团股份有限公司 | 指纹模组的贴附方法及设备 |
Family Cites Families (16)
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US4282056A (en) * | 1979-01-04 | 1981-08-04 | Tokujiro Okui | Both-surface adhesive tape producing apparatus |
JPS55149971A (en) | 1979-05-11 | 1980-11-21 | Hitachi Maxell | Method and device for making base sheet attached label |
JPS59197077A (ja) | 1983-04-25 | 1984-11-08 | 株式会社田中シ−ル印刷 | 表示体とその製造方法及び製造装置 |
JPS59162671U (ja) * | 1984-03-24 | 1984-10-31 | 富士通株式会社 | 半導体装置用高温試験装置 |
JPH0623920B2 (ja) | 1984-09-18 | 1994-03-30 | 富士ゼロックス株式会社 | 複写機のクリ−ニング装置 |
JPS6173179U (ja) * | 1984-10-20 | 1986-05-17 | ||
JPH01319088A (ja) | 1988-06-17 | 1989-12-25 | Seal Insatsu Osaka Pref Gov Kyodo Kumiai | 粘着ラベルの製造方法 |
JPH0618383Y2 (ja) * | 1988-11-22 | 1994-05-11 | リンテック株式会社 | 半導体製造工程用粘着ラベルシート |
JPH0618383A (ja) | 1992-06-30 | 1994-01-25 | S R L:Kk | 押圧器具 |
JP3348923B2 (ja) | 1993-07-27 | 2002-11-20 | リンテック株式会社 | ウェハ貼着用粘着シート |
JP2001335235A (ja) * | 2000-05-26 | 2001-12-04 | Mach Tex:Kk | かす剥離装置 |
US6786266B2 (en) * | 2000-05-26 | 2004-09-07 | K. K. Mashintex | Waste peeling apparatus |
JP2005162818A (ja) | 2003-12-01 | 2005-06-23 | Hitachi Chem Co Ltd | ダイシングダイボンドシート |
JP2007019151A (ja) * | 2005-07-06 | 2007-01-25 | Furukawa Electric Co Ltd:The | ウエハ加工用テープおよびそれを用いたチップの製造方法 |
JP2009124127A (ja) | 2007-10-22 | 2009-06-04 | Hitachi Chem Co Ltd | 接着シート及びその製造方法並びに半導体装置の製造方法及び半導体装置 |
JP6091750B2 (ja) * | 2009-07-14 | 2017-03-08 | 日立化成株式会社 | 接着シートの製造方法 |
-
2010
- 2010-07-09 JP JP2011522796A patent/JP6091750B2/ja active Active
- 2010-07-09 WO PCT/JP2010/061709 patent/WO2011007732A1/ja active Application Filing
- 2010-07-09 CN CN201080031563.7A patent/CN102471648B/zh active Active
- 2010-07-09 KR KR1020127002523A patent/KR101382781B1/ko active IP Right Grant
- 2010-07-09 US US13/383,755 patent/US9011624B2/en active Active
- 2010-07-14 TW TW099123101A patent/TWI482710B/zh active
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- 2016-08-04 JP JP2016153848A patent/JP2016186093A/ja active Pending
Also Published As
Publication number | Publication date |
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TW201114605A (en) | 2011-05-01 |
CN102471648B (zh) | 2014-02-12 |
US9011624B2 (en) | 2015-04-21 |
CN102471648A (zh) | 2012-05-23 |
JP6091750B2 (ja) | 2017-03-08 |
TWI482710B (zh) | 2015-05-01 |
KR101382781B1 (ko) | 2014-04-08 |
JP2016186093A (ja) | 2016-10-27 |
KR20120034116A (ko) | 2012-04-09 |
US20120171475A1 (en) | 2012-07-05 |
WO2011007732A1 (ja) | 2011-01-20 |
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