JPWO2009104615A1 - 銅合金材 - Google Patents

銅合金材 Download PDF

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Publication number
JPWO2009104615A1
JPWO2009104615A1 JP2009554332A JP2009554332A JPWO2009104615A1 JP WO2009104615 A1 JPWO2009104615 A1 JP WO2009104615A1 JP 2009554332 A JP2009554332 A JP 2009554332A JP 2009554332 A JP2009554332 A JP 2009554332A JP WO2009104615 A1 JPWO2009104615 A1 JP WO2009104615A1
Authority
JP
Japan
Prior art keywords
mass
copper alloy
alloy material
strength
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009554332A
Other languages
English (en)
Japanese (ja)
Inventor
清慈 廣瀬
清慈 廣瀬
立彦 江口
立彦 江口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Publication of JPWO2009104615A1 publication Critical patent/JPWO2009104615A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
JP2009554332A 2008-02-18 2009-02-17 銅合金材 Pending JPWO2009104615A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008036694 2008-02-18
JP2008036694 2008-02-18
PCT/JP2009/052718 WO2009104615A1 (fr) 2008-02-18 2009-02-17 Matériau d'alliage de cuivre

Publications (1)

Publication Number Publication Date
JPWO2009104615A1 true JPWO2009104615A1 (ja) 2011-06-23

Family

ID=40985494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009554332A Pending JPWO2009104615A1 (ja) 2008-02-18 2009-02-17 銅合金材

Country Status (5)

Country Link
US (2) US20100310413A1 (fr)
EP (1) EP2256219A4 (fr)
JP (1) JPWO2009104615A1 (fr)
CN (1) CN101946014A (fr)
WO (1) WO2009104615A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5654571B2 (ja) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
KR101294508B1 (ko) * 2010-04-07 2013-08-07 후루카와 덴키 고교 가부시키가이샤 구리합금 전신재, 구리합금 부품 및 구리합금 전신재의 제조방법
WO2012004868A1 (fr) * 2010-07-07 2012-01-12 三菱伸銅株式会社 Plaque d'alliage de cuivre cu-ni-si avec d'excellentes caractéristiques d'emboutissage profond et son procédé de fabrication
JP5773929B2 (ja) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
CN102703754B (zh) * 2012-06-05 2014-03-26 太原理工大学 一种Cu-Ni-Si基合金及其制备方法
WO2013191022A1 (fr) * 2012-06-19 2013-12-27 株式会社村田製作所 Elément de jonction
CN102925746B (zh) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 高性能Cu-Ni-Si系铜合金及其制备和加工方法
CN104797724B (zh) * 2013-03-29 2017-12-05 古河电器工业株式会社 铝合金导体、铝合金绞线、被覆电线、线束以及铝合金导体的制造方法
CN103740975A (zh) * 2013-12-23 2014-04-23 烟台万隆真空冶金股份有限公司 一种铜-镍-硅合金及其制备方法
CN103695704A (zh) * 2013-12-26 2014-04-02 青岛友铭辰生物技术有限公司 一种电气电子设备用耐疲劳铜合金材料及其制备方法
CN103757479B (zh) * 2014-01-10 2016-01-20 滁州学院 一种无铅环保锌白铜合金材料及其制备方法
JP6210563B2 (ja) * 2015-04-10 2017-10-11 古河電気工業株式会社 ばね用銅合金線材、該ばね用銅合金線材の製造方法、並びにばね、該ばねの製造方法
CN105695797A (zh) * 2016-04-20 2016-06-22 苏州市相城区明达复合材料厂 一种铸造加工零部件用青铜合金
CN106282657A (zh) * 2016-08-31 2017-01-04 裴秀琴 一种铜合金新材料
CN107012357B (zh) * 2017-03-22 2018-11-06 合肥达户电线电缆科技有限公司 一种铜合金线材及其制备方法
RU2691823C1 (ru) * 2018-05-14 2019-06-18 Федеральное государственное бюджетное образовательное учреждение высшего образования Балтийский государственный технический университет "ВОЕНМЕХ" им. Д.Ф. Устинова (БГТУ "ВОЕНМЕХ") Способ термической обработки заготовки или изделия (пружин) из бронзы БрНХК 2,5-0,7-0,6
JP6629401B1 (ja) * 2018-08-30 2020-01-15 Ｊｘ金属株式会社 時効処理前のチタン銅板、プレス加工品およびプレス加工品の製造方法
JP2021098887A (ja) * 2019-12-20 2021-07-01 Ｊｘ金属株式会社 積層造形用金属粉末及び該金属粉末を用いて作製した積層造形物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002266042A (ja) * 2001-03-09 2002-09-18 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
JP2006009137A (ja) * 2004-05-27 2006-01-12 Furukawa Electric Co Ltd:The 銅合金
JP2006233314A (ja) * 2005-02-28 2006-09-07 Dowa Mining Co Ltd 高強度銅合金
JP2008024999A (ja) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd 耐力および曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板材
JP2008075172A (ja) * 2006-09-25 2008-04-03 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ系合金

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520034B2 (ja) 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
JP4679040B2 (ja) * 2003-05-30 2011-04-27 日鉱金属株式会社 電子材料用銅合金
JP4255330B2 (ja) 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
WO2006093140A1 (fr) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. Alliage de cuivre
JP2007169764A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002266042A (ja) * 2001-03-09 2002-09-18 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
JP2006009137A (ja) * 2004-05-27 2006-01-12 Furukawa Electric Co Ltd:The 銅合金
JP2006233314A (ja) * 2005-02-28 2006-09-07 Dowa Mining Co Ltd 高強度銅合金
JP2008024999A (ja) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd 耐力および曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板材
JP2008075172A (ja) * 2006-09-25 2008-04-03 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ系合金

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPN6009022565; 渡邊千尋他: 'Ｃｕ-４．０ｍａｓｓ％Ｎｉ-０．９５ｍａｓｓ％Ｓｉ-０．０２ｍａｓｓ％Ｐ合金の機械的特性の改善' 銅と銅合金 第４５巻, 20060801, 第１６頁-第２２頁 *

Also Published As

Publication number Publication date
CN101946014A (zh) 2011-01-12
US20100310413A1 (en) 2010-12-09
WO2009104615A1 (fr) 2009-08-27
EP2256219A4 (fr) 2012-06-27
US20110259480A1 (en) 2011-10-27
EP2256219A1 (fr) 2010-12-01

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