JPWO2009050779A1 - プリント基板ユニットおよび電子機器 - Google Patents
プリント基板ユニットおよび電子機器 Download PDFInfo
- Publication number
- JPWO2009050779A1 JPWO2009050779A1 JP2009537792A JP2009537792A JPWO2009050779A1 JP WO2009050779 A1 JPWO2009050779 A1 JP WO2009050779A1 JP 2009537792 A JP2009537792 A JP 2009537792A JP 2009537792 A JP2009537792 A JP 2009537792A JP WO2009050779 A1 JPWO2009050779 A1 JP WO2009050779A1
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- module substrate
- movable member
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 153
- 230000007246 mechanism Effects 0.000 claims description 56
- 210000000078 claw Anatomy 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 11
- 238000003825 pressing Methods 0.000 description 9
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
Claims (7)
- プリント基板と、プリント基板の表面に実装されて、モジュール基板の一端を支持するソケットと、ソケットから所定の距離で隔てられて、プリント基板の表面に固定される固定部材と、プリント基板の表面に平行に水平移動自在に固定部材に連結されて、モジュール基板の他端を受け止める可動部材と、モジュール基板の貫通孔に受け入れられて可動部材に連結され、プリント基板の表面に平行にモジュール基板の水平移動を規制する第1規制部材と、可動部材に連結されてモジュール基板に覆い被さり、プリント基板の表面に直交する方向にモジュール基板の垂直移動を規制する第2規制部材とを備えることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記第1連結部材は、前記可動部材に区画されるねじ孔にねじ込まれるねじのねじ軸から構成され、前記第2連結部材は、前記ねじのねじ頭から構成されることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記第1連結部材は、前記可動部材に区画されて前記可動部材の表面から立ち上がる突起から構成され、前記第2連結部材は、前記可動部材に連結されて、前記可動部材の表面との間にモジュール基板を配置する爪部材から構成されることを特徴とするプリント基板ユニット。
- 請求項1に記載のプリント基板ユニットにおいて、前記固定部材にねじ込まれて前記可動部材の外縁に受け止められ、前記プリント基板の表面に平行な水平方向に可動部材の位置を調整するねじをさらに備えることを特徴とするプリント基板ユニット。
- 筐体と、筐体に組み込まれるプリント基板と、プリント基板の表面に実装されるソケットと、ソケットから所定の距離で隔てられて、プリント基板の表面に固定される固定部材と、プリント基板の表面に平行に水平移動自在に固定部材に連結される可動部材と、ソケットに一端を支持されて、可動部材に他端を受け止められるモジュール基板と、モジュール基板の表面から裏面に貫通する貫通孔と、モジュール基板の貫通孔に受け入れられて可動部材に連結され、プリント基板の表面に平行にモジュール基板の水平移動を規制する第1規制部材と、可動部材に連結されてモジュール基板に覆い被さり、プリント基板の表面に直交する方向にモジュール基板の垂直移動を規制する第2規制部材とを備えることを特徴とする電子機器。
- プリント基板と、プリント基板の表面に実装されて、モジュール基板の一端を支持するソケットと、ソケットから所定の距離で隔てられてプリント基板の表面に固定され、モジュール基板の他端を支持する固定機構と、ソケットに区画されて、モジュール基板の一端を受け入れるスロットと、ソケット内に区画されて、スロットから受け入れられるモジュール基板の一端との間で所定の間隔を規定する内壁面とを備えることを特徴とするプリント基板ユニット。
- プリント基板と、プリント基板の表面に実装されて、モジュール基板の一端を支持するソケットと、ソケットから所定の距離で隔てられてプリント基板の表面に固定され、モジュール基板の他端を支持する固定機構と、ソケットに区画されて、モジュール基板の一端を受け入れるスロットと、ソケット内に区画されて、スロットから受け入れられるモジュール基板の一端との間で所定の間隔を区画する内壁面とを備えることを特徴とする電子機器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/070109 WO2009050779A1 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009050779A1 true JPWO2009050779A1 (ja) | 2011-02-24 |
JP4985778B2 JP4985778B2 (ja) | 2012-07-25 |
Family
ID=40567073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009537792A Expired - Fee Related JP4985778B2 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100195304A1 (ja) |
JP (1) | JP4985778B2 (ja) |
CN (1) | CN101822129B (ja) |
TW (1) | TWI341167B (ja) |
WO (1) | WO2009050779A1 (ja) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008033173A1 (de) * | 2008-07-15 | 2010-02-04 | Fujitsu Siemens Computers Gmbh | Befestigungsanordnung für ein Sicherheitsmodul und Verwendung einer Schraube zur Befestigung eines Sicherheitsmoduls |
JP5432202B2 (ja) * | 2011-03-31 | 2014-03-05 | セイコープレシジョン株式会社 | プリント基板保持装置 |
JP6378860B2 (ja) * | 2012-09-07 | 2018-08-22 | 富士通株式会社 | 電子機器ユニット及び電子機器 |
DE102012222674A1 (de) * | 2012-12-10 | 2014-06-12 | Robert Bosch Gmbh | Elektronische Anordnung mit Leiterplatte |
JP6064739B2 (ja) * | 2013-03-28 | 2017-01-25 | 山一電機株式会社 | 基板接続用コネクタ、および、それを備える基板接続用コネクタユニット |
CN104812182B (zh) * | 2014-01-23 | 2018-07-13 | 珠海格力电器股份有限公司 | 电器盒及具有该电器盒的空调器 |
JP6329819B2 (ja) * | 2014-06-13 | 2018-05-23 | 株式会社デンソーテン | 位置決め構造 |
CN105992481B (zh) | 2015-02-10 | 2018-12-04 | 纬创资通股份有限公司 | 固定机构及具有电路板快拆功能的电子装置 |
WO2017048287A1 (en) * | 2015-09-18 | 2017-03-23 | Hewlett Packard Enterprise Development Lp | Printed circuit board |
CN107768913B (zh) | 2016-08-15 | 2021-06-22 | 申泰公司 | 用于互连系统的防退出闩扣 |
US11196195B2 (en) * | 2017-04-10 | 2021-12-07 | Samtec, Inc. | Interconnect system having retention features |
CN108874051A (zh) * | 2017-05-10 | 2018-11-23 | 鸿富锦精密工业(武汉)有限公司 | 电脑机箱 |
CN106990575B (zh) * | 2017-06-07 | 2020-02-21 | 京东方科技集团股份有限公司 | 主板固定装置、显示模组和显示装置 |
US10082842B1 (en) * | 2017-08-10 | 2018-09-25 | Super Micro Computer, Inc. | Hot swapping technique for expansion cards |
US10687435B2 (en) | 2017-08-28 | 2020-06-16 | Facebook, Inc. | Apparatus, system, and method for enabling multiple storage-system configurations |
US10349554B2 (en) | 2017-08-29 | 2019-07-09 | Facebook, Inc. | Apparatus, system, and method for directing air in a storage-system chassis |
US10736228B2 (en) | 2017-08-31 | 2020-08-04 | Facebook, Inc. | Removeable drive-plane apparatus, system, and method |
US10372360B2 (en) | 2017-09-01 | 2019-08-06 | Facebook, Inc. | Apparatus, system, and method for reconfigurable media-agnostic storage |
US10537035B2 (en) | 2017-09-06 | 2020-01-14 | Facebook, Inc. | Apparatus, system, and method for securing hard drives in a storage chassis |
US10429911B2 (en) | 2017-09-07 | 2019-10-01 | Facebook, Inc. | Apparatus, system, and method for detecting device types of storage devices |
US10558248B2 (en) | 2017-09-09 | 2020-02-11 | Facebook, Inc. | Apparatus, system, and method for indicating the status of and securing hard drives |
US10588238B2 (en) | 2017-09-18 | 2020-03-10 | Facebook, Inc. | Apparatus, system, and method for partitioning a storage-system chassis |
US10178791B1 (en) * | 2017-09-23 | 2019-01-08 | Facebook, Inc. | Apparatus, system, and method for securing computing components to printed circuit boards |
US10240615B1 (en) | 2017-09-23 | 2019-03-26 | Facebook, Inc. | Apparatus, system, and method for dampening vibrations generated by exhaust fans |
US10757831B2 (en) | 2017-09-26 | 2020-08-25 | Facebook, Inc. | Apparatus, system, and method for reconfiguring air flow through a chassis |
TWM558978U (zh) * | 2017-10-13 | 2018-04-21 | 緯創資通股份有限公司 | 電路板模組及伺服器 |
USD886066S1 (en) | 2017-12-06 | 2020-06-02 | Samtec, Inc. | Securement member of electrical connector |
US10264694B1 (en) * | 2018-05-20 | 2019-04-16 | Super Micro Computer Inc. | Fastening device for stacking expansion cards |
WO2020051183A2 (en) * | 2018-09-04 | 2020-03-12 | Samtec, Inc. | Ultra-dense, low-profile edge card connector |
CN112469233A (zh) * | 2019-09-06 | 2021-03-09 | 英业达科技有限公司 | 电子装置及其支撑件 |
JP7094641B2 (ja) * | 2019-10-16 | 2022-07-04 | 矢崎総業株式会社 | コネクタ |
TWI709849B (zh) * | 2020-01-20 | 2020-11-11 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869672A (en) * | 1989-04-17 | 1989-09-26 | Amp Incorporated | Dual purpose card edge connector |
JP3659335B2 (ja) * | 2001-05-21 | 2005-06-15 | 日本電気株式会社 | プリント基板挿抜治具 |
US6752276B2 (en) * | 2002-08-12 | 2004-06-22 | Sun Microsystems, Inc. | PCI card support |
JP2004087177A (ja) * | 2002-08-23 | 2004-03-18 | Tyco Electronics Amp Kk | カード接続構造及びそれに用いるカードコネクタ |
CN1732723A (zh) * | 2002-12-27 | 2006-02-08 | Fci亚洲技术有限公司 | 板固定装置 |
TWM240699U (en) * | 2003-08-29 | 2004-08-11 | Molex Taiwan Ltd | Card edge connector assembly |
US7134895B1 (en) * | 2005-09-03 | 2006-11-14 | Hon Hai Precision Ind. Co., Ltd. | PC board assembly |
US7491070B2 (en) * | 2006-09-25 | 2009-02-17 | Micro-Star Int'l Co., Ltd. | Fixing structure |
-
2007
- 2007-10-15 JP JP2009537792A patent/JP4985778B2/ja not_active Expired - Fee Related
- 2007-10-15 WO PCT/JP2007/070109 patent/WO2009050779A1/ja active Application Filing
- 2007-10-15 CN CN2007801010916A patent/CN101822129B/zh not_active Expired - Fee Related
- 2007-10-15 TW TW096138464A patent/TWI341167B/zh not_active IP Right Cessation
-
2010
- 2010-04-13 US US12/759,240 patent/US20100195304A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20100195304A1 (en) | 2010-08-05 |
TW200917938A (en) | 2009-04-16 |
CN101822129A (zh) | 2010-09-01 |
JP4985778B2 (ja) | 2012-07-25 |
CN101822129B (zh) | 2012-06-20 |
WO2009050779A1 (ja) | 2009-04-23 |
TWI341167B (en) | 2011-04-21 |
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