WO2009050779A1 - プリント基板ユニットおよび電子機器 - Google Patents
プリント基板ユニットおよび電子機器 Download PDFInfo
- Publication number
- WO2009050779A1 WO2009050779A1 PCT/JP2007/070109 JP2007070109W WO2009050779A1 WO 2009050779 A1 WO2009050779 A1 WO 2009050779A1 JP 2007070109 W JP2007070109 W JP 2007070109W WO 2009050779 A1 WO2009050779 A1 WO 2009050779A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- module substrate
- printed board
- movable member
- socket
- certainly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007801010916A CN101822129B (zh) | 2007-10-15 | 2007-10-15 | 印刷电路板单元和电子设备 |
PCT/JP2007/070109 WO2009050779A1 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
JP2009537792A JP4985778B2 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
TW096138464A TWI341167B (en) | 2007-10-15 | 2007-10-15 | Printed circuit board unit and electronic apparatus |
US12/759,240 US20100195304A1 (en) | 2007-10-15 | 2010-04-13 | Printed circuit board unit and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/070109 WO2009050779A1 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/759,240 Continuation US20100195304A1 (en) | 2007-10-15 | 2010-04-13 | Printed circuit board unit and electronic apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009050779A1 true WO2009050779A1 (ja) | 2009-04-23 |
Family
ID=40567073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/070109 WO2009050779A1 (ja) | 2007-10-15 | 2007-10-15 | プリント基板ユニットおよび電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100195304A1 (ja) |
JP (1) | JP4985778B2 (ja) |
CN (1) | CN101822129B (ja) |
TW (1) | TWI341167B (ja) |
WO (1) | WO2009050779A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2146558A3 (de) * | 2008-07-15 | 2010-03-31 | Sinitec Vertriebsgesellschaft mbH | Befestigungsanordnung für ein Sicherheitsmodul und Verwendung einer Schraube zur Befestigung eines Sicherheitsmoduls |
WO2014157614A1 (ja) * | 2013-03-28 | 2014-10-02 | 山一電機株式会社 | 基板接続用コネクタ、および、それを備える基板接続用コネクタユニット |
JP2020517083A (ja) * | 2017-04-10 | 2020-06-11 | サムテック インコーポレイテッドSamtec,Inc. | 保持特徴部を有する相互接続システム |
USD960107S1 (en) | 2017-12-06 | 2022-08-09 | Samtec, Inc. | Electrical connector |
US11735844B2 (en) | 2016-08-15 | 2023-08-22 | Samtec, Inc. | Anti-backout latch for interconnect system |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5432202B2 (ja) * | 2011-03-31 | 2014-03-05 | セイコープレシジョン株式会社 | プリント基板保持装置 |
JP6378860B2 (ja) * | 2012-09-07 | 2018-08-22 | 富士通株式会社 | 電子機器ユニット及び電子機器 |
DE102012222674A1 (de) * | 2012-12-10 | 2014-06-12 | Robert Bosch Gmbh | Elektronische Anordnung mit Leiterplatte |
CN104812182B (zh) * | 2014-01-23 | 2018-07-13 | 珠海格力电器股份有限公司 | 电器盒及具有该电器盒的空调器 |
JP6329819B2 (ja) * | 2014-06-13 | 2018-05-23 | 株式会社デンソーテン | 位置決め構造 |
CN105992481B (zh) | 2015-02-10 | 2018-12-04 | 纬创资通股份有限公司 | 固定机构及具有电路板快拆功能的电子装置 |
WO2017048287A1 (en) * | 2015-09-18 | 2017-03-23 | Hewlett Packard Enterprise Development Lp | Printed circuit board |
CN108874051A (zh) * | 2017-05-10 | 2018-11-23 | 鸿富锦精密工业(武汉)有限公司 | 电脑机箱 |
CN106990575B (zh) * | 2017-06-07 | 2020-02-21 | 京东方科技集团股份有限公司 | 主板固定装置、显示模组和显示装置 |
US10082842B1 (en) * | 2017-08-10 | 2018-09-25 | Super Micro Computer, Inc. | Hot swapping technique for expansion cards |
US10687435B2 (en) | 2017-08-28 | 2020-06-16 | Facebook, Inc. | Apparatus, system, and method for enabling multiple storage-system configurations |
US10349554B2 (en) | 2017-08-29 | 2019-07-09 | Facebook, Inc. | Apparatus, system, and method for directing air in a storage-system chassis |
US10736228B2 (en) | 2017-08-31 | 2020-08-04 | Facebook, Inc. | Removeable drive-plane apparatus, system, and method |
US10372360B2 (en) | 2017-09-01 | 2019-08-06 | Facebook, Inc. | Apparatus, system, and method for reconfigurable media-agnostic storage |
US10537035B2 (en) | 2017-09-06 | 2020-01-14 | Facebook, Inc. | Apparatus, system, and method for securing hard drives in a storage chassis |
US10429911B2 (en) | 2017-09-07 | 2019-10-01 | Facebook, Inc. | Apparatus, system, and method for detecting device types of storage devices |
US10558248B2 (en) | 2017-09-09 | 2020-02-11 | Facebook, Inc. | Apparatus, system, and method for indicating the status of and securing hard drives |
US10588238B2 (en) | 2017-09-18 | 2020-03-10 | Facebook, Inc. | Apparatus, system, and method for partitioning a storage-system chassis |
US10240615B1 (en) | 2017-09-23 | 2019-03-26 | Facebook, Inc. | Apparatus, system, and method for dampening vibrations generated by exhaust fans |
US10178791B1 (en) * | 2017-09-23 | 2019-01-08 | Facebook, Inc. | Apparatus, system, and method for securing computing components to printed circuit boards |
US10757831B2 (en) | 2017-09-26 | 2020-08-25 | Facebook, Inc. | Apparatus, system, and method for reconfiguring air flow through a chassis |
TWM558978U (zh) * | 2017-10-13 | 2018-04-21 | 緯創資通股份有限公司 | 電路板模組及伺服器 |
US10264694B1 (en) * | 2018-05-20 | 2019-04-16 | Super Micro Computer Inc. | Fastening device for stacking expansion cards |
CN110875533B (zh) * | 2018-09-04 | 2022-05-31 | 申泰公司 | 超高密度的低矮型边缘卡连接器 |
CN112469233A (zh) * | 2019-09-06 | 2021-03-09 | 英业达科技有限公司 | 电子装置及其支撑件 |
JP7094641B2 (ja) * | 2019-10-16 | 2022-07-04 | 矢崎総業株式会社 | コネクタ |
TWI709849B (zh) * | 2020-01-20 | 2020-11-11 | 技嘉科技股份有限公司 | 散熱組件及主機板模組 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002344173A (ja) * | 2001-05-21 | 2002-11-29 | Nec Corp | プリント基板挿抜治具 |
JP2004087177A (ja) * | 2002-08-23 | 2004-03-18 | Tyco Electronics Amp Kk | カード接続構造及びそれに用いるカードコネクタ |
WO2004062328A1 (ja) * | 2002-12-27 | 2004-07-22 | Fci Asia Technology Pte Ltd. | 基板固定装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869672A (en) * | 1989-04-17 | 1989-09-26 | Amp Incorporated | Dual purpose card edge connector |
US6752276B2 (en) * | 2002-08-12 | 2004-06-22 | Sun Microsystems, Inc. | PCI card support |
TWM240699U (en) * | 2003-08-29 | 2004-08-11 | Molex Taiwan Ltd | Card edge connector assembly |
US7134895B1 (en) * | 2005-09-03 | 2006-11-14 | Hon Hai Precision Ind. Co., Ltd. | PC board assembly |
US7491070B2 (en) * | 2006-09-25 | 2009-02-17 | Micro-Star Int'l Co., Ltd. | Fixing structure |
-
2007
- 2007-10-15 TW TW096138464A patent/TWI341167B/zh not_active IP Right Cessation
- 2007-10-15 CN CN2007801010916A patent/CN101822129B/zh not_active Expired - Fee Related
- 2007-10-15 JP JP2009537792A patent/JP4985778B2/ja not_active Expired - Fee Related
- 2007-10-15 WO PCT/JP2007/070109 patent/WO2009050779A1/ja active Application Filing
-
2010
- 2010-04-13 US US12/759,240 patent/US20100195304A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002344173A (ja) * | 2001-05-21 | 2002-11-29 | Nec Corp | プリント基板挿抜治具 |
JP2004087177A (ja) * | 2002-08-23 | 2004-03-18 | Tyco Electronics Amp Kk | カード接続構造及びそれに用いるカードコネクタ |
WO2004062328A1 (ja) * | 2002-12-27 | 2004-07-22 | Fci Asia Technology Pte Ltd. | 基板固定装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2146558A3 (de) * | 2008-07-15 | 2010-03-31 | Sinitec Vertriebsgesellschaft mbH | Befestigungsanordnung für ein Sicherheitsmodul und Verwendung einer Schraube zur Befestigung eines Sicherheitsmoduls |
WO2014157614A1 (ja) * | 2013-03-28 | 2014-10-02 | 山一電機株式会社 | 基板接続用コネクタ、および、それを備える基板接続用コネクタユニット |
JP2014192134A (ja) * | 2013-03-28 | 2014-10-06 | Yamaichi Electronics Co Ltd | 基板接続用コネクタ、および、それを備える基板接続用コネクタユニット |
US11735844B2 (en) | 2016-08-15 | 2023-08-22 | Samtec, Inc. | Anti-backout latch for interconnect system |
JP2020517083A (ja) * | 2017-04-10 | 2020-06-11 | サムテック インコーポレイテッドSamtec,Inc. | 保持特徴部を有する相互接続システム |
JP7179824B2 (ja) | 2017-04-10 | 2022-11-29 | サムテック インコーポレイテッド | 保持特徴部を有する相互接続システム |
USD960107S1 (en) | 2017-12-06 | 2022-08-09 | Samtec, Inc. | Electrical connector |
Also Published As
Publication number | Publication date |
---|---|
CN101822129A (zh) | 2010-09-01 |
JPWO2009050779A1 (ja) | 2011-02-24 |
TW200917938A (en) | 2009-04-16 |
TWI341167B (en) | 2011-04-21 |
JP4985778B2 (ja) | 2012-07-25 |
CN101822129B (zh) | 2012-06-20 |
US20100195304A1 (en) | 2010-08-05 |
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