JPWO2009031394A1 - 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法 - Google Patents

電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法 Download PDF

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Publication number
JPWO2009031394A1
JPWO2009031394A1 JP2009531174A JP2009531174A JPWO2009031394A1 JP WO2009031394 A1 JPWO2009031394 A1 JP WO2009031394A1 JP 2009531174 A JP2009531174 A JP 2009531174A JP 2009531174 A JP2009531174 A JP 2009531174A JP WO2009031394 A1 JPWO2009031394 A1 JP WO2009031394A1
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JP
Japan
Prior art keywords
conductive
plate
plates
socket
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2009531174A
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English (en)
Japanese (ja)
Inventor
村山　茂
茂 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of JPWO2009031394A1 publication Critical patent/JPWO2009031394A1/ja
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connecting Device With Holders (AREA)
JP2009531174A 2007-09-03 2008-08-13 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法 Ceased JPWO2009031394A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007227837 2007-09-03
JP2007227837 2007-09-03
PCT/JP2008/064543 WO2009031394A1 (ja) 2007-09-03 2008-08-13 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法

Publications (1)

Publication Number Publication Date
JPWO2009031394A1 true JPWO2009031394A1 (ja) 2010-12-09

Family

ID=40428716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009531174A Ceased JPWO2009031394A1 (ja) 2007-09-03 2008-08-13 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法

Country Status (4)

Country Link
JP (1) JPWO2009031394A1 (zh)
KR (1) KR101149748B1 (zh)
TW (1) TWI383161B (zh)
WO (1) WO2009031394A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569377B2 (ja) 2015-08-14 2019-09-04 富士通株式会社 ケーブルコネクタ及び配線基板
JP6484532B2 (ja) * 2015-09-14 2019-03-13 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
JP2016026295A (ja) * 2015-09-14 2016-02-12 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
JP2018021914A (ja) * 2017-08-04 2018-02-08 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃデバイス用ソケット
US20200003802A1 (en) * 2018-07-02 2020-01-02 Powertech Technology Inc. Testing socket and testing apparatus
TWI747582B (zh) * 2020-10-29 2021-11-21 創意電子股份有限公司 檢測裝置
TWI806045B (zh) * 2021-05-04 2023-06-21 博磊科技股份有限公司 半導體積體電路、印刷電路板與測試裝置之連接器總成

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123872A (en) * 1977-04-05 1978-10-28 Oki Yunibatsuku Kk Multilayer circuit board connecting structure
JPH04233179A (ja) * 1990-10-05 1992-08-21 Internatl Business Mach Corp <Ibm> コネクタ・アセンブリ
JPH11352182A (ja) * 1998-06-10 1999-12-24 Fujitsu Ltd 試験用配線基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11239017A (ja) 1998-02-23 1999-08-31 Kyocera Corp 積層型開口面アンテナおよびそれを具備する多層配線基板
JP4493981B2 (ja) * 2003-10-31 2010-06-30 エスペック株式会社 半導体デバイスの実装部材、半導体デバイスの実装構造、および半導体デバイスの駆動装置
JP4535828B2 (ja) * 2004-09-30 2010-09-01 株式会社ヨコオ 検査ユニットの製法
JP2006112891A (ja) * 2004-10-14 2006-04-27 Fujitsu Ltd 半導体試験ボード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53123872A (en) * 1977-04-05 1978-10-28 Oki Yunibatsuku Kk Multilayer circuit board connecting structure
JPH04233179A (ja) * 1990-10-05 1992-08-21 Internatl Business Mach Corp <Ibm> コネクタ・アセンブリ
JPH11352182A (ja) * 1998-06-10 1999-12-24 Fujitsu Ltd 試験用配線基板

Also Published As

Publication number Publication date
KR101149748B1 (ko) 2012-06-01
KR20100052520A (ko) 2010-05-19
WO2009031394A1 (ja) 2009-03-12
TW200925619A (en) 2009-06-16
TWI383161B (zh) 2013-01-21

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