TW200925619A - Electric connection structure Terminal device, socket, device for testing electronic component, and method of manufacturing socket - Google Patents

Abstract

An electric connection structure has electrically conductive plates (30, 40) to which electric cables (11, 12) are respectively electrically connected, a first insulation plate (51) layered between the electrically conductive plates (30, 40), and contact pins (60) making electrical contact with input/output terminals (6) of an IC device (5). The contact pins (60) penetrate the plates (30, 40, 50). Depending on the size of through holes (32, 43) in the electrically conductive plates (30, 40) into which the contact pins (60) are inserted, the contact pins (60) make contact with either of the electrically conductive plates (30, 40) or do not make contact with the plates (30, 40).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test electronic component test apparatus for, for example, performing various electronic components (hereinafter also referred to as IC components) of a semiconductor integrated circuit element, for example, for example. An electrical connection structure, a terminal device, a socket, and an electronic component testing device that are in contact with a contact terminal (referred to as a conductive member or a terminal as a conductive member) and a cable (hereinafter also referred to as a conductive body) Production method.

先前Previous technique] In the process of 1C component, the performance or function of 1C component is tested using an electronic component tester. In the electronic component testing device, the IC component is pressed against the socket of the test head, and the electronic component test device body (hereinafter also referred to as a tester) is used in an electrical contact state between the input and output terminals of the Ic component and the contact terminal of the socket. The IC component is tested by inputting a test signal to the Ic component. The socket is disposed on a circuit board called a socket board that is disposed at an upper portion of the test head via which the socket board and the test head are electrically connected. Under the socket plate, assemble the connector to which the plug of the cable is fitted. This cable is connected to the terminal electronics card in the test head. A circuit pattern for electrically connecting the connector and the socket is formed in the interior of the socket board. Each of the contact terminals of the socket is selectively connected to each of a plurality of cables for signal transmission, power supply, or grounding via the circuit pattern. · 2247-9923-PF 5 200925619 When using a socket board composed of such a circuit board, there are the following disadvantages. That is, since the circuit pattern in the socket board is finely wired, it is difficult to use a coaxial structure in the socket board. Further, since the wiring for power supply or grounding is also constituted by a thin circuit pattern in the socket board, there is a limit in the reinforcement of these. [Problem to be Solved by the Invention] The problem to be solved by the present invention is to provide an electrical connection structure, a terminal device, a socket, an electronic component testing device, and a method of manufacturing the socket, and the electrical connection structure does not use a circuit board, and The conductive member (terminal) and the conductor (cable) can be selectively connected. [Means for Solving the Problem] U) In order to achieve the object, according to the first aspect of the present invention, an electrical connection structure is provided (refer to the first item of the patent application scope), including: a dance piece conductive plate ’ Each of the electrical conductors is electrically connected; an insulating plate is laminated between the plurality of conductive plates; and a plurality of conductive members are passed through the conductive plate and the insulating plate; and the conductive member is inserted into the conductive plate The through-hole is sized to contact the at least one of the plurality of conductive guides or the conductive plate. In the invention, although the invention is not particularly limited, the conductive plate having the inner diameter of the through hole having the inner diameter of the conductive path and the outer conductive outer member of the conductive outer member are not in contact with the conductive member. Good (refer to item 2 of the patent application scope). Electrical structure 2247-9923-PF 6 200925619 Although the invention is not particularly limited, the conductive member which is not in contact with the conductive plate is the third item of the patent range. Further, the second conductor is included, and the pair is electrically connected. (The application is not particularly limited in the invention, and the first and second conductors are preferably included in the cable (see the fourth item of the patent application scope). In order to achieve the object, according to the second aspect of the present invention, a terminal device (refer to the fifth item of the patent scope of the towel) is provided, and the pair is connected.

The body is electrically connected, and the terminal device comprises a plurality of conductive plates which are electrically connected by the first electric thinner; the first insulating plate is laminated between the plurality of conductive plates '· and a plurality of terminals Connecting the plurality of terminals through the plurality of conductive plates and the i-th insulating plate; the terminal and the corresponding hole of the conductive plate inserted into the terminal At least one of the plurality of conductive plates is in contact or not in contact with the conductive plate. The present invention is not particularly limited, and the ith electrical environment includes a power supply power supply for supplying power to the connected body, and a grounding cable for connecting the connected body and the reference potential point. Refer to Section 6 of the Patent Application. The invention is not particularly limited, and the conductive plate having a through hole having an inner diameter equal to or smaller than the outer diameter of the terminal is in contact with the terminal; and the material sheet having a through hole having an inner diameter larger than the outer diameter of the terminal and the material It is better not to contact (refer to item 7 of the patent application scope). The invention is not particularly limited, and includes a second electric thinner, which is preferably electrically connected to the terminal that is not in contact with the conductive plate (refer to the patent application 2247-9923-PF 7 Ο φ 200925619 circumference 8 item). In the invention, although the electrical signal is not specifically transmitted by the connector, the second cable contains useful information for item 9 of the scope. ...L transmission is better. (Refer to the application for the invention, although it is not for the sake of the invention, and the special limitation includes: the 2nd and the Descartes are laminated on the plurality of sheets and the third insulation board, And a plurality of conductive plates and the ith insulating plate are fixed to the conductive plate and the fixing means, and the plurality of terminals are penetrated through the first item). 3 Insulation board is preferable (refer to the patent application specification, although the invention is not particularly limited, it is preferable to extend from the end portion of the 溢1 溢 溢 4 咖 咖 咖 咖 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( Although the invention does not particularly have the end material of the conductive plate = (refer to claim 12 of the patent application). Although the invention is not particularly limited, it also includes a circuit board that assembles electrons: to and with at least two of the conductive plates. Electrical connection; preferably between the ends of the board insertion board (refer to the patent application scope, although the invention is not particularly limited, and includes an electronic component, which is electrically connected to at least two of the conductive plates; It is preferable that the ends of the at least two conductive plates are provided (refer to claim 14 of the patent application). (3) In order to achieve the object, according to the third aspect of the present invention, a socket is provided (refer to the patent application scope) Item 15) is electrically connected to the electronic component to be tested when testing the 7L of the tested electronic component, and the socket includes the aforementioned terminal device; the connected body includes the electronic component to be tested 2247-9923-PF 8 200925619 Loss In order to achieve the object, 'in accordance with the fourth aspect of the present invention, an electronic component testing device (refer to the patent application scope) is used for testing the electronic component to be tested, the electronic component The test socket includes the aforementioned socket; and the test head is attached to the socket. (5) In order to achieve the object, according to the fifth aspect of the present invention, a method for manufacturing the socket is provided (refer to the 17th article of the patent application scope) And the socket is electrically connected to the electronic component to be tested when testing the electronic component to be tested. The manufacturing method includes: selecting a step of selecting a first conductive plate from the plurality of first conductive plates; In the second selection step, one 帛2 conductive plate is selected from the plurality of second conductive plates; in the laminating step, the first and second conductive plates are layered via the insulating plate; and the step is passed through the step The present invention penetrates the conductive plate, the insulating plate, and the second conductive plate. [Effect of the Invention] In the present invention, the conductive member and the conductive plate are brought into contact with or not in contact with each other in accordance with the size of the through hole, whereby the circuit board is not used. The conductive member (terminal) and the conductor (cable) can be selectively connected. Further, by forming the terminal device (socket) without using a circuit board, to the connected body (tested electronic component) In the vicinity, it is easy to use a coaxial structure. In addition, a conductive plate is used instead of a thin circuit pattern, whereby wiring for power supply or grounding can be greatly enhanced. [Embodiment] 2247-9923-PF 9 200925619 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an electronic component test 2 according to a first embodiment of the present invention, and Figs. 2 and 3 are a view showing a Jth embodiment of the present invention. FIG. 4 is an enlarged cross-sectional view of a portion jv of FIG. 2, FIG. 5 is a schematic cross-sectional view of a portion V of FIG. 2, and FIG. 6 is a second embodiment of the present invention. A schematic plan view of the socket. The electronic component testing apparatus according to the embodiment of the present invention is not transmitted by the test head 10 for processing, for example, the processor 1 to be tested, the IC component to be tested, and the test head 1 to the test head 1 The tester 2 that tests the nickname and performs the test of the IC component constitutes the "electronic component test device system" which tests (checks) whether the IC component is properly operated by applying a high-temperature or low-temperature thermal stress to the 1C component. And classify 1C components according to the test results. As shown in Fig. 1, on the upper portion of the test head 10, a socket 2 is provided which is electrically connected to the Ic element during the test of the 1C element. As shown in Fig. 1, the socket ❹ 20 faces the inside of the processor 1 via the opening la formed in the processor 1, and presses the Ic element carried in the processor i to the socket 20.

As shown in FIGS. 2 to 4, the socket 20 of the present embodiment includes a GND plate 30, a pps (pr〇grammabie p〇wer gupply) plate, a fourth insulating plate 51 to 54, and a plurality of contact terminals 6A. And the circuit board 7〇 is formed. The GND plate 30 is a plate-like member having a thickness of about 150 to 200 μm and is made of a conductive material such as copper or aluminum. Connected to one end of the GND board 3 ,, connected to the GND circuit 2247-9923-ΡΓ 10 200925619 10 used to connect the I c element 5 and the reference potential point 1 GND cable 11 Connect to the test head (not shown). At about the center of the GND board 30, the sheet is formed to be inserted into the contact terminal + a plurality of (in this example, 35) i-th 60-to-one perforation 32. This *the third word 32 is arranged in the form of "" row. X' corresponding to the terminal 6 of the 1C element 5, and is formed in the four corners of the fl through holes 32 to form a screw 91.

The i-th through holes 32 include inner-in addition, and the plurality of through-holes having a relatively large inner diameter with respect to the contact terminal 6A and a relatively small through-hole. The PPS board 40 is also made of a plate-like member having a thickness of about 15 〇 to 2 〇 Mm, and is made of a conductive material such as copper or aluminum. This coffee board 4 At the end of the square, the power supply 12 for supplying the driving power to the controller C is connected. The power supply electrode 12 is also connected to a terminal electronic card (not shown) housed in the test head 1A. In the center of the PPS board 40, as in the GND board 30, a plurality of (35 in this example) second through holes 42 for inserting the contact terminals 60 are formed. These second through holes 42 are arranged in five rows and seven rows in accordance with the present embodiment in a manner corresponding to 1 (the output terminal 6 of the element 5), and are formed at four corners around the second through holes 42 to form The insertion hole of the screw 91 is inserted. Further, the plurality of second through holes 42 include a through hole having a relatively large inner diameter with respect to the contact terminal 60 and a relatively small through hole.

The first to fourth insulating sheets 51 to 54 are made of a material excellent in electrical insulating properties, heat resistance, and moldability, such as a liquid crystal polymer (Uquid Crystal Pymer). The through holes 51a to 54a are formed in the center of the insulating plates 51 to 54 so as to correspond to the first and second through holes 32 and 42 of the gND 2247-9923-Pf 11 200925619 plate 30 and the PPS plate 40. Further, insertion holes for inserting the screws 91 are formed in the four corners around the through holes 42. Further, the through holes 51a to 54a provided in all of the fourth insulating sheets 5b 54 have an inner diameter larger than the outer diameter of the contact terminals 6A. The above six plates 30, 40, 51 to 5 4 are placed from the top according to the second insulating plate 52, the GND plate 30, the first insulating plate 51, the PPS plate 40, and the third insulating plate.

53 and the fourth insulating sheets 54 are laminated in this order. In particular, since the first insulating sheet 51 is inserted between the GND board 30 and the PPS board 40, (the JND board 30 and the PPS board 40 do not become conductive. Further, in order to fix the contact terminal 6〇, only the fourth insulating board 54' The contact terminals 60 are laminated after being inserted into the other plates 3, 4, 51, and 53. Further, the number of the 'the GND plate 30 and the milk plate 4' is not limited to one piece, and can be made into any number. In addition to the (10) board 30 and the PPS board 4G, the conductive board of the present invention also includes a signal transmission or the like.

The board of his use. Further, it is not necessary to provide the GND board and the PM board 40' over the entire surface. As shown in Fig. 6, for example, two sheets 40A' 40B may be partially provided. According to the procedure shown below, the board 40 is in the present embodiment 5 1 ~54 laminate. For the first time, select one GND board suitable for the Socket 2 from the GND board prepared in advance. In the present embodiment, the chip GND plate is formed in the center of the 224 7-9923-pp·200925619 in the 35 first through holes, but the through hole and the inner diameter are large. The arrangement of the through holes is different from each other, and the first through hole which is connected to the GND cable 11 and inserted into the contact terminal 6 in the 35 first through holes 32 in the selected GND plate 30' has the contact terminal 60. The inner diameter of the outer diameter or less and the other first through holes have an inner diameter larger than the outer diameter of the contact terminal.

Next, from the plurality of PPS sheets prepared in advance, one PPS plate suitable for the socket 20 is selected. In the present embodiment, the plurality of pps plates prepared in advance are formed by collectively forming 35 second through holes 42 in the center. However, the through holes having a large inner diameter and the through holes having a small inner diameter are arranged in phase with each other. In addition, in the selected (four) plate 4, in the second through hole 42, the second through hole which is to be connected to the power supply Wei 12 and inserted into the contact terminal 6 is provided with the contact terminal 6Q. The inner diameter, and the other second through hole has an inner diameter GND plate 30 larger than the outer diameter of the contact material 6 和 and the PPS plate 40 edge plates 52, 53, 54 are laminated, and the first insulating plate is placed. 51 is laminated between the two, and the second, f 3, and fourth are above and below these. Thus, it is easy to cope with various types of 1C elements by selecting and combining the boards from the pre-prepared easy-to-make magnetic cylinder h-plate group. As shown in Fig. 2 and Fig. 3, the use of your whistle 9 _1 _1 _1 层 layer 30, 40, 51~54, each from the second insulation board 52 side in the fourth solution The screw 91, which is inserted into the hole, and the nut 92 on the side of the insulating plate 54 and the screw and the screw are fixed to the screw 92 which is screwed. Further, in the present invention, the screws 30, 4, 51, 5 are fixed, and the fixing method of the #1 i 4 is not limited to being fixed by using, for example, a splint.

2247-9923-PF 13 200925619 Further, the respective through holes 32, 42, 51a to 54a on which the laminated plates 30, 40, 51 to 54 are coaxial are inserted into the contact terminals 6A. As the contact terminal 6G, for example, a hexagonal terminal, a bellows type or a contact terminal of a coaxial structure or the like can be given. The large diameter portion 61 having an increased outer diameter is formed at the end portion after the contact terminal 6A, and the contact terminal 60 is locked to the fourth insulating plate 54 by the large diameter portion 61. In the present embodiment, the inner diameter of the first through hole 32a and the second through hole 32a 42a' shown in the right end of the fourth figure is the outer diameter 'below' of the contact terminal and the inner diameter of the second through hole 42a. It is larger than the contact terminal 6〇. Thus, although the GND board 3 is in contact with the contact terminal 6A, the pps board and the contact terminal 60 are not in contact. Therefore, the contact terminal 60 shown at the right end of Fig. 4 is electrically connected only to the GND cable u via the stencil 3. On the other hand, the second and second through holes 32b are shown in the center of Fig. 4; 42b, the inner diameter of the first through hole 32b is larger than the outer diameter of the contact terminal 6〇, and the inner diameter of the second through hole 42b is equal to or smaller than the outer diameter of the contact terminal 6〇. Therefore, although the plate 3〇 and the contact terminal It is not in contact, but the PPS board 40 is in contact with the contact terminal 6A. Therefore, the contact terminal 60 shown in the center of Fig. 4 is electrically connected only to the power supply cable 12 via the PPS board 4's. Further, regarding the left end of Fig. 4 In the first and second through holes 32c to 42c shown, since the jth and second through holes 32c and 42c each have an inner diameter larger than the outer diameter of the contact terminal 60, the contact terminal 60 and the GND plate 3 and the PPS are provided. Any one of the plates 40. is not in contact. Therefore, the contact terminal 60 of the left end 2247-9923-PF 14 200925619 of FIG. 4 is not connected to any of the GND cable 11 and the power supply cable 12 for transmission to the IC component. The signal transmission cable 13 of the test signal is directly connected by soldering, etc. This signal transmission cable 丨3 It is composed of a coaxial cable for transmitting a high-frequency signal, and is connected to a terminal electronic card (not shown) housed in the test head 1A. As described above, in the present embodiment, the third and the third The size of the through holes 32, 42 is such that the contact terminals 6A and the conductive plates 3, 4b are in contact or not in contact 'by thereby not using the circuit board, but the contact terminals 6A and the cables 11 13 can be selectively connected. In addition, in the present invention, the same contact terminal 60 can be brought into contact with a plurality of conductive plates. Further, by forming the socket 2〇 without using a circuit board, it is easy to adopt a coaxial structure in the vicinity of the κ-shaped member 5, and In addition, the conductive plates 30 and 40 are used instead of the thin circuit pattern, and the wiring for power supply or grounding can be reinforced greatly, so that noise can be reduced. 2, the GND board 30 and the PPS board 40 are each protruded from both ends of the laminated boards 30, 40, and 5b. The GND board 3 has a bent portion bent substantially at right angles at both ends thereof. 31. Also, the pps board 4 is the same, with substantial at both ends The curved portion bent at right angles Ο 4 The curved portion 31 of the rib (10) and the curved portion 41 of the PPS are substantially parallel, and the circuit board 70 is inserted between the curved portions 31, 41. The circuit board 70 is as in the fifth As shown in the figure, there are circuit patterns 71-72 therein. The first circuit pattern 71 electrically connects the gnd board 3A and the GND cable u. Similarly, the 'second circuit pattern 72 sets the PPS board 40 and the power.

2247-9923-PF 15 200925619 The supply cable 12 is electrically connected. Further, the capacitor 80 is assembled to the circuit board 70. The capacitors 80 are connected to the first and second circuit patterns 71 and 72, respectively. The capacitor 80 is a bypass capacitor for supplying a large current to the 1C element to be tested. In this manner, by assembling the electric hopper 80 to the circuit board 70' inserted between the gnd board 30 and the PPS board 40, the bypass capacitor 80 can be disposed in the vicinity of the IC component to be tested', so that the test accuracy can be improved.

Further, by bending the protruding portions of the GND board 30 and the PPS board 40, the socket 20 can be made small. In particular, in the case where a plurality of sockets 20 are assembled to the upper portion of the test head in order to simultaneously test a plurality of jc elements, the assembly density of the sockets 20 can be improved. Further, in the conventional socket, the connector is assembled to the circuit board, and the circuit pattern must be fanout, which becomes an obstacle to high-density assembly of the socket. On the other hand, in the present embodiment, the connector is not used, and since the GND switch and the power supply cable 12 are directly connected to the GND board 30 and the PPS board 40, the mounting density of the socket 20 can be improved. Further, in Fig. 5, although only one capacitor 80 is illustrated for convenience of explanation, actually, as shown in Fig. 2, a plurality of capacitors 80 are assembled to the circuit board 7A. Further, in the present invention, the electronic component assembled on the circuit board is not limited to the capacitor 8A, and a relay circuit for switching the ON/OFF of the capacitor 81, for example, may be assembled to the circuit board. Fig. 7 is a side view showing the present invention, and Fig. 8 is a side view showing the portion of the invention. As shown in Fig. 7, the end of the socket of the fourth embodiment of the end portion of the socket of the third embodiment can also make the capacitor 80 unpowered.

2247-9923-PF 16 200925619 The board 70 is disposed directly between the bent portions 3i and 4i of the boards 3〇, 4〇, and directly connects the capacitor 80 and the bent portion 31 of the GND board 30, and the bending of the PPS board 4D. The part 41 is directly connected. Alternatively, as shown in Fig. 8, the both ends of the plates 3G and 4G may not be bent, and the capacitor 8 () may be inserted into the ends of the plates 30 and 40.

In addition, the embodiments described above are described in order to facilitate the understanding of the present invention, and are not intended to limit the present invention. Therefore, each of the elements disclosed in the above-described embodiments includes all design changes or equivalents belonging to the technical scope of the present invention. For example, in the above-described embodiment, an example of the conductive member is described as an example. The contact terminal 6Q is shown, and as an example of the electric conductor, the electric 11' 12' is not exemplified, but the electric connection structure of the present invention is not limited to this. Further, in the above-described embodiment, the socket is described as an example of the terminal device. However, the terminal device of the present invention is not particularly limited, and may be applied, for example, to a remote connection between a circuit board or a cable or Connect the board and the electrical connector. BRIEF DESCRIPTION OF THE DRAWINGS 1. Electronic component test of the embodiment 1 Side view of the socket of the embodiment Fig. 1 is a schematic cross-sectional view showing the first device of the present invention. Fig. 2 is a view showing the first embodiment of the present invention, and the socket of the first embodiment of the present invention is not shown.

2247-9923-PF 17 200925619 Fig. 4 is an enlarged cross-sectional view of the ιν portion of Fig. 2. Fig. 5 is a schematic cross-sectional view showing a portion v of Fig. 2; Fig. 6 is a schematic plan view showing a socket of a second embodiment of the present invention. Fig. 7 is a side view showing the end portion of the socket of the third embodiment of the present invention. Fig. 8 is a side view showing the end portion of the socket of the fourth embodiment of the present invention. ^ ❹

[Main component symbol description] 1 Processor la Opening 2 Tester 5 IC component 6 Input/output terminal 10 Test head 11 GND cable 12 Power supply cable 13 Signal transmission cable 20 Socket 30 GND board 31 Bending portion 32, 32a to 32c 1 Through hole 40, 40A, 40B PPS board · 2247-9923-PF 18 200925619 41 Curved portion 42, 42a to 42c S 51 to 54 1st to 4th 51a to 54a through hole 60 contact terminal 61 large diameter portion 70 circuit board 71, 72 Circuit Diagram 肆 80 Capacitor 91 Screw 92 Nut: Through Hole Insulation Board 2247-9923-PF 19

Claims (1)

200925619 X. Patent application scope: 1. An electrical connection structure comprising: a plurality of conductive plates, each of which is electrically connected by a first electrical conductor; an insulating plate is laminated between the plurality of conductive plates; a plurality of conductive members extending through the conductive plate and the insulating plate; contacting the conductive member and at least one of the plurality of conductive plates in response to a size of the through hole of the conductive plate into which the conductive member is inserted, or The conductive plates are not in contact. 2. The electrical connection structure of claim 1, wherein the conductive plate having a through hole having an inner diameter below the outer diameter of the conductive member is in contact with the conductive member; and having an inner diameter larger than an outer diameter of the conductive member The conductive plate of the through hole does not contact the conductive member. 3. The electrical connection structure of claim 1 < 2, wherein A second electrical conductor is included that is electrically connected to the electrically conductive member that does not turn over the electrical plate. 4. In the electrical connection structure of claim 3, the middle and second conductors comprise an electron microscope. 5. A terminal device for electrically connecting to a connected body, comprising: a plurality of conductive plates, each of which is electrically connected by a first cable; and a first insulating plate is laminated on the plurality of conductive plates And a plurality of terminals for electrically contacting the connected body; the plurality of terminals of the board are penetrating through the plurality of conductive plates and the first! Insulation 2247-9923-PF 20 200925619 Depending on the size of the through hole of the conductive plate into which the terminal is inserted, the terminal contacts at least one of the plurality of conductive plates or does not contact the conductive plate. 6. The terminal device of claim 5, wherein the first cable includes a power supply cable for supplying power to the connected body, and a ground for connecting the connected body to a reference potential point. Use a cable. 7. The terminal device of claim 5, which has an inner diameter The conductive plate is in contact with the terminal of the through hole below the outer diameter of the terminal; the conductive plate having a through hole having an inner diameter larger than the outer diameter of the terminal does not contact the terminal. 8. The terminal device of claim 5, further comprising a second electron microscope, wherein the terminal not in contact with the conductive plate is connected by helium. 9. The terminal device of claim 8, wherein the second electrical code includes a signal transmission power for transmitting an electrical signal to the connected body 10. The terminal device of claim 5, wherein the second and third insulating sheets are laminated on the plurality of sheets, further comprising: a conductive plate; and a fixing means for fixing the plurality of conductive plates and the In the third, the plurality of terminals extend through the plurality of turns. The conductive plate and the second insulating insulating plate are the first terminal device of the fifth aspect of the patent application, wherein the end portion of the plurality of 2247-9923-PF 200925619 conductive plates is at least from the first 12. The end of the U-th panel of the range is curved. The terminal device further includes a circuit board 'which assembles the electronic component' and is electrically connected to at least two of the conductive plates; the circuit board is inserted between the ends of the at least two conductive plates.端子 Η. The terminal device of the item η, wherein the electronic component is further electrically connected to at least two of the conductive plates; the electronic component is inserted between the ends of the at least two conductive plates. 15. A socket for electrically connecting to an electronic component to be tested when testing an electronic component to be tested, comprising: the terminal device of any one of claims 5 to 14; the connected body comprising the Testing the input and output terminals of the electronic component for performing the tested electronic element The insulation board is protruding. The terminal device, wherein the conductive material is tested according to the patent application scope of the invention, which comprises: a socket of claim 15; and a test head to which the socket is attached. 17. A method of manufacturing a socket, wherein the socket is electrically connected to the electronic component to be tested when testing the electronic component to be tested, the manufacturing method comprising: a first selection step of selecting from a plurality of second conductive plates The first conductive plate of the cymbal sheet; the second selection step is to select the slab 2247-9923-ρρ 22 200925619 2 conductive plate from the plurality of second conductive plates, and the laminating step is performed by the insulating plate. The second conductive plate is laminated; and the step of penetrating the terminal through the first conductive plate, the insulating plate, and the second conductive plate. 2247-9923-PF 23