JPH11239017A - Laminated opening plane antenna and multilayer circuit board equipped with it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laminated opening plane antenna which is small and thin and is easily produced by a general lamination technology for a multilayer circuit board and a multilayer circuit board including it. SOLUTION: This laminated opening plane antenna forms a space resonator by space 8 which is encircled by an upper main conductor layer 3 that is adhered to and formed on a dielectric substrate 2 on which plural dielectric layers 1 are laminated, antenna conductor walls comprising a plurality of through conductors 5 formed around an opening part 4 in the lamination direction of the layers 1 and plural sub conductor layers 6 which electrically connect the plural conductors 5 and a lower main conductor layer 7 which is adhered to and formed at a position facing the part 4 under the antenna conductor walls. Also, this multilayer circuit board includes the laminated opening plane antenna, a feeding line and a high frequency circuit in the substrate 2. A high frequency antenna which is small/thin and is easily produced and a multilayer circuit board including an antenna are obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layered aperture antenna suitable for communication using high frequencies such as microwaves and millimeter waves, and a multilayer wiring board provided with the multi-layered aperture antenna.

[0002]

2. Description of the Related Art In recent years, in the field of communication technology, research on mobile communication or inter-vehicle radar using high frequencies such as microwaves and millimeter waves has been actively pursued. Normal,
The input and output of high-frequency signals between devices in these communications,
Eventually, it is done by the antenna. Various antennas have been studied for such high frequencies, and typical ones are, for example, waveguide slot antennas, microstrip antennas, and the like.
An aperture antenna and the like are known.

[0003] These high-frequency antennas are used by being connected to high-frequency electric circuits. The feed lines connecting these electric circuits and the antennas are, for example, those of aperture antennas and waveguide slot antennas. In general, a waveguide is used, and for a microstrip antenna, a triplate line is mainly used.

Japanese Patent Application Laid-Open No. 62-222702 discloses a planar array antenna in which a plurality of radiating elements each having an inner surface formed by a metallized hole are arranged and connected by a waveguide having a cavity. Has also been proposed.

Further, recently, from the viewpoint of reducing the size of communication system equipment including a high-frequency antenna, it has been desired to integrate the antenna with a package containing a high-frequency circuit or a high-frequency element.

[0006]

In order to use the above high-frequency antenna for mobile communication, inter-vehicle radar, and the like, the antenna itself must be light, thin, and small.

[0007] Among the above high-frequency antennas, the waveguide slot antenna has the advantages that it is highly efficient and can be formed thin, but it is heavy and expensive because it is manufactured by processing a metal plate. There is a problem that there is. Microstrip antennas, on the other hand, are made by applying a metal film to a dielectric sheet and forming it.
Further, it has the advantage of being inexpensive because it can be formed thinly and can be easily manufactured, but has the problem of low efficiency.

[0008] On the other hand, an aperture antenna, for example, a horn antenna has extremely excellent performance as an antenna characteristic, but is itself large in size because it is fabricated by three-dimensional processing using a metal member. Therefore, there is a problem that it is difficult to mount on a communication terminal, and it is also difficult to reduce the weight.

Further, according to the planar array antenna disclosed in Japanese Patent Application Laid-Open No. 62-222702, there is an advantage that it is light because plastic is used as a base material.
Since the waveguide is used for the power supply line, the power supply section becomes thick, and there is a problem that it is difficult to reduce the size and thickness.

Further, in any of the above-mentioned high frequency antennas, if the applied high frequency is in the millimeter wave region, the characteristics of the entire antenna system become important. In other words, even if the individual characteristics of the high-frequency antenna, the feed line, the high-frequency circuit, etc. are very excellent, they are ultimately connected together to form the entire system. The cost and the like also affect the entire antenna system. For example, assuming that these connection parts are composed of waveguides, high-frequency antennas and
An antenna system can be configured without substantially impairing the performance of a feed circuit, a high-frequency circuit, and the like. But,
When connected by a waveguide, a three-dimensional structure is often formed, and since mechanical connection is performed by screwing or the like, there is a problem that reliability is reduced and cost is increased.

In this respect, the planar array antenna as disclosed in Japanese Patent Application Laid-Open No. 62-222702 is one in which the antenna section and the feed line are integrally formed. There is a problem that the connection with other components is poor and it is difficult to integrate them.

In response to these problems, one of the present inventors proposed a horn antenna type laminated aperture antenna in Japanese Patent Application No. 9-200484. This proposal is characterized in that a conventional horn antenna type aperture antenna has a structure that can be easily manufactured by a general lamination technique for a multilayer wiring board.

However, in this structure, in order to connect the feeding waveguide portion and the radiation space with the characteristic impedance as smooth as possible, the distance between the feeding portion and the opening surface, that is, the dielectric tape forming the portion, is required. It is necessary to increase the thickness of the laminate, and it is difficult to reduce the thickness of the laminate.

The present invention has been devised in view of the above circumstances, and an object of the present invention is to provide a laminated aperture antenna which can be reduced in size and thickness and can be easily manufactured by a general lamination technique. To provide. Another object of the present invention is to provide a multi-layer wiring board in which a high-frequency circuit can be formed, and a feeder line and the laminated aperture antenna are integrally formed.

[0015]

Means for Solving the Problems As a result of studying the above problems, the present inventors have found that an antenna conductor wall constituting an antenna is formed within a dielectric substrate on which dielectric layers are laminated. A plurality of via-hole conductors disposed at intervals and a plurality of conductor layers disposed between dielectric layers of a dielectric substrate so as to electrically connect the plurality of via-hole conductors, and electrically connect with these. A single-sided short-circuited, single-sided open quarter-wavelength resonance space is formed by a dielectric space surrounded by a lower conductor layer to be electrically connected and an opening of the upper conductor layer corresponding to the antenna conductor wall, and this is used as an antenna. It has been found that by using a spatial resonator as a part, it can be thinly and easily manufactured by the conventional lamination technology, and can be easily integrated with a feeder line and a high-frequency circuit.

That is, the laminated aperture antenna according to the present invention is an upper main conductor layer having an opening of a predetermined size and formed on the upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers. And a plurality of through conductors formed in the dielectric substrate around the opening of the upper main conductor layer at predetermined intervals in the stacking direction of the dielectric layers, and the plurality of through conductors are electrically connected. An antenna conductor wall formed of a plurality of sub-conductor layers formed between the dielectric layers, and the antenna conductor formed at a position facing the opening below the antenna conductor wall of the dielectric substrate. A space resonator is formed by a space surrounded by a lower main conductor layer electrically connected to a wall, wherein the space is a single-sided short-circuited and single-sided open quarter-wavelength spatial resonator. It is what becomes.

Further, the laminated aperture antenna according to the present invention comprises:
In the above configuration, the opening is rectangular, and the space is a rectangular parallelepiped, or the opening is circular, and the space is cylindrical. is there.

Furthermore, in the laminated aperture antenna of the present invention, in addition to the above-mentioned constitution, a slot for feeding power is formed in a portion of the lower main conductor layer facing the space, or A feed line composed of a microstrip line or a coplanar line is connected to a side surface of the resonator.

Still further, the laminated aperture antenna according to the present invention is characterized in that, in addition to the above-described respective configurations, a plurality of the spatial resonators are arranged in an array.

According to the laminated aperture antenna of the present invention,
An antenna is formed by a combination of a through conductor such as a via-hole conductor formed in a dielectric substrate formed by laminating dielectric layers in multiple layers based on a lamination technology for a multilayer wiring substrate, and a conductor layer disposed between the dielectric layers. Since the conductor wall is formed, the aperture antenna can be easily and inexpensively manufactured. The space surrounded by the antenna conductor wall, the opening of the upper main conductor layer corresponding to the antenna conductor wall, and the lower main conductor layer is a single-sided short-circuited, single-sided open quarter-wavelength resonance space (space resonator). Since the electromagnetic wave is radiated from the substrate, the radiation frequency can be controlled by the size of the aperture surface and the thickness of the spatial resonator, that is, the thickness of the dielectric substrate. This gives a degree of freedom to the design.For example, if the size of the aperture surface is increased, the thickness of the space for forming the aperture antenna can be reduced, so that the number of stacked dielectric layers can be reduced. And as a result, it can be manufactured at lower cost.

Further, since the laminated aperture antenna of the present invention can be formed by a conventional lamination technique, it can be integrally formed in a normal multilayer wiring board, and at the same time, a feed line to the antenna and A high-frequency circuit can be formed at the same time.

A multilayer wiring board according to the present invention comprises a dielectric substrate formed by laminating a plurality of dielectric layers, and includes a laminated aperture antenna having the above-described configuration and a power supply for supplying power to the laminated aperture antenna. A power supply line and a high-frequency circuit connected to the power supply line are provided.
Further, a semiconductor element mounting portion for mounting a semiconductor element is formed on a part of the dielectric substrate.

According to the multilayer wiring board of the present invention, the laminated aperture antenna of the present invention having each of the above-described structures is formed on a part of a dielectric substrate formed by laminating dielectric layers. Forming a power supply line for supplying power to the power supply line and a high-frequency circuit connected to the power supply line, and further forming a semiconductor element mounting portion such as a cavity shape for mounting a semiconductor element on a part of the substrate. However, by mounting the high-frequency semiconductor element on the semiconductor element mounting part and storing it by an appropriate means, connection between the multilayer aperture antenna and the high-frequency circuit becomes easy, and energy loss at the connection part is also reduced. Can be reduced. In addition, since the antenna, the feed line, the high-frequency circuit, and the high-frequency semiconductor element can be integrally formed on the multilayer wiring board, the whole system can be downsized. In addition, since it can be manufactured in a series of steps using the conventional multilayering technology, a highly reliable and low-cost multilayer wiring board can be manufactured as a multilayer wiring board having a laminated aperture antenna.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to FIGS. 1 to 8 showing various embodiments.

FIG. 1 is a partially transparent perspective view showing an embodiment of the laminated aperture antenna according to the present invention. In FIG. 1, 1 is a dielectric layer, 2 is a dielectric substrate, 3 is an upper main conductor layer, 4 is an opening, 5 is a through conductor, 6 is a sub-conductor layer, 7 is a lower main conductor layer, and 8 is a space ( Spatial resonator). FIG. 1 shows a state in which a part of the dielectric substrate 2 is seen through the dielectric layer 1.

According to the example shown in FIG. 1, the laminated aperture antenna of the present invention is based on a dielectric substrate 2 in which a plurality of dielectric layers 1 each having a predetermined thickness are laminated. The upper main conductor layer 3 is formed on the upper surface of the dielectric substrate 2, and the lower main conductor layer 7 is formed on the rear surface.

The upper main conductor layer 3 is formed with a rectangular opening 4 having a size of a × b, for example, which serves as a radiating portion of the antenna. A plurality of through conductors 5 such as via-hole conductors and through-hole conductors are formed on the dielectric substrate 2 around the opening 4 of the upper main conductor layer 3 at predetermined intervals in the laminating direction of the dielectric layer 1. Further, the plurality of through conductors 5 have an opening dimension a between the dielectric layers 1.
A plurality of xb band-shaped sub-conductor layers 6 are formed, and the sub-conductor layers 6 and the plurality of through conductors 5 are electrically connected. As a result, the zx plane and the y-plane shown in FIG. An antenna conductor wall parallel to the z-plane is formed.

A position where the lower main conductor layer 7 electrically connected to the antenna conductor wall faces the opening 4 below the dielectric substrate 2, for example, on the back surface of the dielectric substrate 2 or between the dielectric layers 1. In addition, it is formed so as to cover at least a region larger than the opening 4 having the dimension a × b. As a result, the dimensions are a × surrounded by the upper main conductor layer 3 having the opening 4, the antenna conductor wall formed by the plurality of through conductors 5 and the plurality of sub-conductor layers 6, and the lower main conductor layer 7. A spatial resonator composed of a b × c space 8 is formed, thereby forming a dielectric waveguide antenna as a laminated aperture antenna.

Since it is necessary to prevent the electromagnetic wave from leaking from the antenna conductor wall, the interval between the sub-conductor layers 6 and the interval between the through conductors 5 are at least less than 1/2 of the signal wavelength. Spacing, preferably 1 / signal wavelength
It is necessary to arrange at intervals of 4 or less.

This antenna has one-sided short-circuit and one-sided open 1 /
Since the principle of the four-wavelength resonator is applied, the characteristics of electromagnetic waves radiated from the aperture surface differ depending on the resonance mode.
Thus, There are various applications according to the purpose (for example, not radiated to the antenna frontal direction by using the rectangular parallelepiped TE ₁₁₁ mode, is radiated at an angle ± theta direction)
However, generally, a hexahedral TE ₁₀₁ mode is desirable. At this time, the frequency of the electromagnetic wave radiated from the antenna can be approximately calculated by the following equation (1).

[0031]

(Equation 1)

Here, it is sufficient that the width b of the opening 4 is not more than a. However, if the width b is too small, the loss of energy due to the conductor increases, so care must be taken.

In the above example, the case where the spatial resonator is a rectangular parallelepiped has been described, but the same applies when the resonant space is a cylinder. However, in this case, the cylindrical TE ₁₁₁ mode is desirable. Further, at this time, the frequency of the electromagnetic wave radiated from the antenna can be approximately calculated by the following equation (2).

[0034]

(Equation 2)

In order to actually use such a laminated aperture antenna, a structure for feeding power to the antenna section is usually required.

FIG. 2 is a partially transparent perspective view similar to FIG. 1, showing an example in which a feed structure using slots is formed as another example of the embodiment of the laminated aperture antenna of the present invention. In FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals. In this example, a slot 9 for feeding power is formed in a portion of the lower main conductor layer 7 facing the space 8. Through the electromagnetic coupling by the slot 9, power can be supplied by, for example, a waveguide, a laminated waveguide, a microstrip line, or the like.

By forming the slots 9 in the lower main conductor layer 7 in this manner, power can be supplied by various types of high-frequency lines as described above, and the output can be adjusted by changing the size of the slots 9. it can.

FIG. 3 is a partially transparent perspective view similar to FIGS. 1 and 2 showing another embodiment of the laminated aperture antenna according to the present invention. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

In the example shown in FIG. 3, a feed line 10 is inserted through a hole in a part of an antenna conductor wall composed of a plurality of through conductors 5 and a plurality of sub-conductor layers 6 so as to supply power to a spatial resonator. It was done. Feeding line in the region outside the spatial resonator
As 10, for example, a microstrip line, a coplanar line, or the like can be considered.

As described above, the feed line 10 composed of a microstrip line or a coplanar line is provided on the side surface of the spatial resonator.
Is connected, there is no need to separately provide a feed circuit layer, and the antenna becomes thin as a whole.

FIG. 4 is a plan view showing another embodiment of the laminated aperture antenna according to the present invention. The example shown in FIG. 4 is an array antenna in which the laminated aperture antenna of the present invention is arranged in an array on a dielectric substrate. In FIG. 4, 3 is an upper main conductor layer formed on the upper surface of the dielectric substrate, 11 is a laminated aperture antenna of the present invention having a columnar spatial resonator, 12 is a signal input section, and K is It is a power supply circuit.
According to the array antenna of FIG. 4, a signal input from the signal input unit 12 passes through the feed circuit K, and repeats three T-branches three times.
It reaches 11 and is radiated. Here, when a laminated waveguide is used for the feeding circuit K, each opening antenna 11 needs a feeding structure such as the slot 9 shown in FIG. When a coplanar line or a microstrip line is used for the feed circuit K, power can be fed directly from the side surface of each of the aperture antennas 11 by the structure shown in FIG.

As a characteristic of the electromagnetic wave radiated from the laminated aperture antenna 11, the polarization characteristic is also important. The examples of the embodiments described so far mainly show structures in the case of radiating linearly polarized waves. However, by changing the arrangement of the feed line K, it is possible to easily generate circularly polarized waves. It becomes possible.

For example, as shown in a plan view in FIG. 5, a laminated aperture antenna of the present invention shown by an opening 4 and a through conductor 5 (the figure shows a case where the spatial resonator is cylindrical). ,
Power supply circuit K to T
Two branched feed lines K1 and K2 are connected to an aperture antenna from two orthogonal directions to perform power feeding, and furthermore, by shifting the phase of electromagnetic waves fed from each feed line K1 and K2 by 90 °, circular polarization is achieved. Can be generated. At this time, shifting the phase by 90 ° can be realized by setting the difference in length from the T branch point of the feed lines K1 and K2 to the antenna to １ ／ of the propagation wavelength.

Further, as in the example shown in the plan view of FIG. 6, a circularly polarized wave can be generated by the feeder circuit K composed of one feeder line. FIG. 6 shows a case where the opening 4 has a rectangular shape having an opening dimension a × b.
The same applies to an elliptical shape having a major axis of a × b. In this manner, circular polarization can be generated by adjusting the lengths of two sides of the rectangular opening 4 in the same manner as the principle of generating circular polarization by feeding a single point to the patch antenna. That is, the length of one side of the rectangle is slightly longer than １ ／ of the wavelength λ corresponding to the operating frequency f _{0 so} that the phase of the current at f ₀ is −45 °, and the length of the other side is To λ
/ 2 so that the phase of the current at f ₀ is + 45 °. As a result, a phase difference of 90 ° is generated, and a circularly polarized wave can be generated. When the opening 4 is elliptical, a circularly polarized wave can be similarly generated by adjusting the length of the major axis and the minor axis.

When power is supplied through the slots 9 as shown in FIG. 2, as in the example shown in the same plan view in FIG. 7, two or more slots 9 orthogonal to the lower main conductor layer 7 are provided.
By forming 9, a circularly polarized wave can be generated.

Next, the multilayer wiring board of the present invention will be described. FIG. 8 is a cross-sectional view for explaining an example of the embodiment. In this example, the multilayer aperture antenna of the present invention having the structure shown in FIG. In FIG. 8, the same parts as those in FIGS. 1 to 7 are denoted by the same reference numerals.

The multilayer wiring board 20 includes a dielectric substrate 2 in which a plurality of dielectric layers 1 are laminated, an upper main conductor layer 3 having an opening 4, a plurality of through conductors 5, and a plurality of sub conductor layers. 6
(Space resonator) formed by and the lower main conductor layer 7
2 and a feed line K for feeding power to the antenna portion with the connection structure by the slot 9 shown in FIG. 2 are formed. A high-frequency circuit 21 including a high-frequency semiconductor element 22 mounted on the semiconductor element mounting portion and a microstrip line is formed on the surface opposite to the upper surface where the opening 4 is formed. This high frequency circuit
21 may be a coplanar line, a grounded coplanar line, or a dielectric waveguide line, in addition to the microstrip line.

The high-frequency circuit 21 is provided with a signal input section 23. The signal input section 23 is directly connected to the high-frequency circuit 21 or, as shown, a high-frequency semiconductor element 22 having a function of an amplifier or the like. By connecting via
Signals can be transmitted from the high frequency circuit 21 to the antenna unit.

According to the multilayer wiring board 20 of the present invention, a cavity for accommodating the high-frequency semiconductor element 22 together with the high-frequency circuit 21 is provided as a semiconductor element mounting portion, and a cover made of, for example, metal (shown in FIG. ), The high-frequency semiconductor element 22 can be hermetically sealed. Alternatively, the cap may be hermetically sealed by attaching a cap-like lid provided with a space inside the flat semiconductor element mounting portion. Thus, a high-frequency package integrally including the semiconductor element, the high-frequency circuit, and the stacked aperture antenna can be provided.

The dielectric substrate in the antenna portion and the feed line forming portion is preferably made of a dielectric material having a dielectric constant as low as possible in consideration of transmission loss and required manufacturing accuracy. However, when the high-frequency circuit 21 is a microstrip line or a coplanar line, the relative permittivity of the formed dielectric layer may be about 10 to 15 in consideration of the size of the high-frequency circuit 21 and the gap with the ground. desirable.

The dielectric layer in each of the above embodiments may be a dielectric material that can be formed into a sheet of an appropriate thickness, metallizable, can form a through conductor such as a via-hole conductor, and can be closely laminated. For example, ceramics, glass ceramics, resin, or a mixture of resin and ceramic powder may be used. In order to reduce the transmission loss of a high-frequency signal as much as possible, the dielectric loss tangent of the dielectric material is preferably small, and it is desirable that the dielectric loss tangent be 0.001 or less. Further, the metallization to be formed on the dielectric layer to become the upper main conductor layer, the sub conductor layer, the lower main conductor layer, and the like is desirably formed of a low-resistance conductor. Specifically, at least gold, silver, copper It is good to make any one of the above as a main component.

[0052]

Next, the results of analyzing the characteristics of the laminated aperture antenna of the present invention will be described with reference to FIGS. 9 and 10. FIG.

FIG. 2 shows a laminated aperture antenna according to the present invention.
The example shown in FIG. Here, the feed line is formed by using a laminated waveguide to feed power by a slot provided in the lower main conductor layer, and the antenna shape, that is, the space (spatial resonator)
Is a rectangular parallelepiped shape of a = 3.4 mm.b = 1.3 mm.c = 0.5 mm, with a center frequency of 77 GHz. A low-temperature sintered glass ceramic having a relative dielectric constant ε = 5 and a dielectric loss tan δ = 0.008 was used as a dielectric material of the dielectric layer, and copper was used as a metallization. The shape of the slot was 0.8 mm long × 0.1 mm wide.

FIG. 9 is a diagram showing a simulation result of a radiation pattern by the laminated aperture antenna of the present invention. In FIG. 9, the radial direction indicates the radiant energy intensity, and the circumferential direction indicates the angle (0 ° is the front direction of the antenna). A is a radiation pattern on the H plane, C is an E plane, and B is a radiation pattern on a plane intermediate the H plane and the E plane. From this result, it can be seen that the directivity gain is 8 dBi. Compared to the fact that the characteristics of a patch antenna using a dielectric substance having a relative dielectric constant of 5 are about 6 dBi, the laminated aperture antenna of the present invention has:
It can be said that the antenna has a somewhat high gain.

FIG. 10 is a diagram showing simulation results of frequency characteristics of reflection in the laminated aperture antenna of the present invention. The horizontal axis represents frequency (GHz), and the vertical axis represents high-frequency power supplied to the antenna. The amount of reflection for the signal (d
B), the dotted line indicates the frequency characteristic curve of reflection. Figure
From FIG. 10, if the region where the VSWR (voltage standing wave ratio) is 2 or less is defined as the frequency band of the antenna, in this case, 5.7 GHz
(7.3% with respect to the center frequency of 77 GHz), which is slightly wider than that of the patch antenna.

FIG. 11 shows the reflection frequency characteristics of the prototype laminated aperture antenna. In FIG. 11, the horizontal axis represents frequency (GHz), and the vertical axis represents reflection (dB).
The curve D shows the frequency characteristics of reflection in the stacked aperture antenna of the present invention. For reference, the characteristic in the case where the opening of the antenna is closed with a metal is shown by a curve E. From FIG. 11, it can be seen from the curve E that the reflection is greater around the center frequency of 77 GHz than the curve D,
According to the laminated aperture antenna of the present invention, it can be seen that electromagnetic waves are satisfactorily radiated from the openings.

Similar evaluations were also performed on the laminated aperture antenna of the present invention in which the spatial resonator had a cylindrical shape and a feed line was connected to the side surface of the spatial resonator. It was confirmed that the antenna had good antenna characteristics.

It should be noted that the present invention is not limited to the above-described embodiments, and that various changes and improvements can be made without departing from the scope of the present invention.
For example, the resonance space may be shaped like a triangular prism.

[0059]

As described above in detail, according to the laminated aperture antenna of the present invention, the laminated aperture antenna has a predetermined size opening formed in the dielectric substrate formed by laminating a plurality of dielectric layers. A spatial resonator is formed by the space surrounded by the upper main conductor layer, the antenna conductor wall composed of multiple through conductors and multiple sub-conductor layers, and the lower main conductor layer. It is possible to provide an inexpensive high-frequency antenna which can be manufactured in a small size, can be reduced in size and thickness, has good antenna characteristics, and is inexpensive. In addition, a space surrounded by the antenna conductor wall, the opening of the upper main conductor layer, and the lower main conductor layer is used as a quarter-wave resonance space (space resonator) in which one side is short-circuited and one side is open, and an electromagnetic wave is radiated from the opening. Therefore, since the radiation frequency can be controlled by the size of the aperture surface and the thickness of the spatial resonator, that is, the thickness of the dielectric substrate, there is an advantage that the degree of freedom in design is increased.
Furthermore, since it can be formed by a lamination technique for a conventional multilayer wiring board, it can be integrally formed in a normal multilayer wiring board, and at the same time, a feed line to an antenna and a high frequency circuit can be formed at the same time. it can.

According to the laminated aperture antenna of the present invention, the opening is rectangular and the spatial resonator is a rectangular parallelepiped, or the opening is circular and the spatial resonator is cylindrical. Accordingly, it is possible to correspond to specifications of various antenna characteristics.

Further, according to the laminated aperture antenna of the present invention, when a slot for feeding power is formed in a portion of the lower main conductor layer facing the spatial resonator, feeding by various types of high-frequency lines is possible. And the output can be adjusted by changing the size of the slot.If a feed line consisting of a microstrip line or a coplanar line is connected to the side of the spatial resonator, the feed circuit layer is There is no need to provide a separate antenna, and the antenna becomes thin as a whole.

Further, according to the laminated aperture antenna of the present invention, by arranging a plurality of spatial resonators in an array, it is possible to cope with various specifications such as linearly polarized light and circularly polarized light, thereby achieving a wide band. Thus, a high-gain planar array antenna can be provided.

A multilayer wiring board according to the present invention comprises a laminated substrate having a plurality of dielectric layers laminated thereon, a laminated aperture antenna according to the present invention, and a feed line for supplying power to the laminated aperture antenna. And a high-frequency circuit connected to the feed line, the connection between the laminated aperture antenna and the high-frequency circuit is facilitated, and the energy loss at the connection between them can be reduced. Since the feed line and the high-frequency circuit can be integrally formed on the multilayer wiring board, the whole system can be downsized. Furthermore, since it can be manufactured in a series of steps using a conventional multilayering technique, a highly reliable and low-cost multilayer wiring board with a built-in high-frequency antenna can be manufactured.

Further, a semiconductor element mounting portion is formed on a part of the substrate, and a high frequency semiconductor element is mounted on the semiconductor element mounting portion and housed by an appropriate means, so that a system including the high frequency semiconductor element is included. Can be integrated with the multilayer wiring board, and the entire system can be downsized.

[Brief description of the drawings]

FIG. 1 is a partially transparent perspective view showing an example of an embodiment of a laminated aperture antenna according to the present invention.

FIG. 2 is a partially transparent perspective view showing another embodiment of the laminated aperture antenna according to the present invention.

FIG. 3 is a partially transparent perspective view showing another example of the embodiment of the laminated aperture antenna of the present invention.

FIG. 4 is a plan view showing another example of the embodiment of the laminated aperture antenna of the present invention.

FIG. 5 is a plan view for explaining an example of a configuration for generating circularly polarized waves in the laminated aperture antenna of the present invention.

FIG. 6 is a plan view for explaining another example of a configuration for generating circularly polarized waves in the laminated aperture antenna of the present invention.

FIG. 7 is a plan view for explaining another example of a configuration for generating circularly polarized waves in the laminated aperture antenna of the present invention.

FIG. 8 is a sectional view showing an example of an embodiment of the multilayer wiring board of the present invention.

FIG. 9 is a diagram showing a radiation pattern by the laminated aperture antenna of the present invention.

FIG. 10 is a diagram showing frequency characteristics of reflection in the laminated aperture antenna of the present invention.

FIG. 11 is a diagram illustrating frequency characteristics of reflection in a stacked aperture antenna.

[Explanation of symbols]

 1 ··· Dielectric layer 2 ··· Dielectric substrate 3 ··· Upper main conductor layer 4 ··· Opening 5 ··· Through conductor 6 ··· Sub conductor layer 7 ··· ··· Lower main conductor layer 8 ··· Space (spatial resonator) 9, 33 ··· Slot 10 ··· Feed line 11, 31 ··· Laminated aperture antenna 20 ··· Multilayer wiring board 21 ... High frequency circuit 22 ... Semiconductor element

Claims (8)

[Claims] 1. An upper main conductor layer having an opening of a predetermined size and formed on an upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers, and the opening of the upper main conductor layer. A plurality of through conductors formed in the dielectric substrate around the portion at predetermined intervals in the stacking direction of the dielectric layers, and a plurality of through conductors formed between the dielectric layers so as to electrically connect the plurality of through conductors. An antenna conductor wall made of a sub-conductor layer of the above, and a lower conductor electrically connected to the antenna conductor wall, formed below the antenna conductor wall of the dielectric substrate at a position facing the opening. A laminated aperture antenna in which a spatial resonator is formed by a space surrounded by a body layer. 2. The laminated aperture antenna according to claim 1, wherein the opening is rectangular, and the space is a rectangular parallelepiped. 3. The laminated aperture antenna according to claim 1, wherein the opening is circular, and the space is cylindrical. 4. The laminated aperture antenna according to claim 1, wherein a slot for feeding power is formed in a portion of the lower main conductor layer facing the space. 5. The laminated aperture antenna according to claim 1, wherein a feed line made of a microstrip line or a coplanar line is connected to a side surface of the spatial resonator. 6. The laminated aperture antenna according to claim 1, wherein a plurality of the spatial resonators are arranged in an array. 7. A laminated aperture antenna according to claim 1, comprising a dielectric substrate formed by laminating a plurality of dielectric layers, and a power supply for supplying power to said laminated aperture antenna. A multilayer wiring board, comprising: a line; and a high-frequency circuit connected to the power supply line. 8. The multilayer wiring board according to claim 7, wherein a semiconductor element mounting portion for mounting a semiconductor element is formed on a part of said dielectric substrate.