JPWO2009005027A1 - 基板搬送ロボット及びそれを備えた真空処理装置 - Google Patents
基板搬送ロボット及びそれを備えた真空処理装置 Download PDFInfo
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- JPWO2009005027A1 JPWO2009005027A1 JP2009521622A JP2009521622A JPWO2009005027A1 JP WO2009005027 A1 JPWO2009005027 A1 JP WO2009005027A1 JP 2009521622 A JP2009521622 A JP 2009521622A JP 2009521622 A JP2009521622 A JP 2009521622A JP WO2009005027 A1 JPWO2009005027 A1 JP WO2009005027A1
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- Prior art keywords
- substrate
- slip
- protrusion
- transfer robot
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 346
- 230000002265 prevention Effects 0.000 claims description 23
- 229920006169 Perfluoroelastomer Polymers 0.000 claims description 10
- 230000003746 surface roughness Effects 0.000 claims description 6
- 230000008602 contraction Effects 0.000 description 11
- 238000001179 sorption measurement Methods 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 9
- 239000011737 fluorine Substances 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
基板を載置する基板受部と、基板受部の上面に夫々が間隔を置いて設けられた弾性体から成る複数個の基板滑り止め部材と、先端に基板受部が配設された伸縮自在なアーム部とを有し、基板滑り止め部材の上端面に、突起部を設けて成る基板搬送ロボットと、
基板搬送ロボットを配設した基板搬送室と、
基板搬送室の周りに設けられた複数個の基板処理室と
を有することを特徴としている。
その結果、基板を基板搬送ロボットで搬送する際の基板の基板滑り止め部材からの落下、或いは基板の基板搬送ロボットの基板受け部からの落下等を確実に防止することができるようになる。
することを特徴としている。
2:アーム部
3:基板支持面
4:ストッパー部材
5:基板滑り止め部材
6:基板搬送ロボット
7:基板搬送室
8:ゲートバルブ
9:基板処理室
10:基板搬入搬出室
11:円筒状基板滑り止め部材
12:上方外側フランジ
13:下方外側フランジ
14:上端面
15:下端面
16、17:突起部
21:円筒状基板滑り止め部材
22:上方外側フランジ
23:下方外側フランジ
24:凹部
25:円柱状突起部
26:円柱状突起部
31:円筒状基板滑り止め部材
32:上方外側フランジ
33:下方外側フランジ
34:基壁
35:突起部
36:円柱状部
37:頭部
41:円筒状基板滑り止め部材
42:上方外側フランジ
43:下方外側フランジ
44:基壁
45:突起部
46:円柱状部
47:傘型の頭部
51:円筒状基板滑り止め部材
52:上方外側フランジ
53:下方外側フランジ
54:基壁
55:突起部
56:円柱状部
57:円板状頭部
61:円筒状基板滑り止め部材
62:上方外側フランジ
63:下方外側フランジ
64:基壁
65:突起部
66:円柱状部
67:半円球状頭部
71:円筒状基板滑り止め部材
72:下方外側フランジ
73:基壁
74:上方外側フランジ
75:突起部
76:円柱状部
77:円板状頭部
81:円筒状基板滑り止め部材
82:下方外側フランジ
83:基壁
84:上方外側フランジ
85:突起部
Claims (13)
- 基板を載置する基板受部と、前記基板受部の上面にそれぞれ間隔を置いて設けられた弾性体から成る複数個の基板滑り止め部材と、先端に前記基板受部が配設された伸縮自在なアーム部とを有し、前記基板滑り止め部材の上端面には、突起部が設けられていることを特徴とする基板搬送ロボット。
- 前記基板滑り止め部材がパーフロロエラストマーで構成されることを特徴とする請求項1に記載の基板搬送ロボット。
- 前記各基板滑り止め部材の突起部の上面の表面粗さがRa1μm以下であることを特徴とする請求項1又は2に記載の基板搬送ロボット。
- 前記各基板滑り止め部材の突起部の高さが、横方向の一定のせん断応力に対する歪み量に応じて設定されていることを特徴とする請求項1〜3のいずれか一項に記載の基板搬送ロボット。
- 前記基板滑り止め部材は筒状であり、前記基板受部には、前記筒状の基板滑り止め部材を着脱自在に装着する複数個の貫通孔が設けられることを特徴とする請求項1〜4のいずれか一項に記載の基板搬送ロボット。
- 前記各滑り止め部材の下端面に補助突起部が設けられることを特徴とする請求項1〜5のいずれか一項に記載の基板搬送ロボット。
- 前記各基板滑り止め部材の突起部が、その基板滑り止め部材の上端面に周方向に間隔をおいて複数個設けられることを特徴とする請求項1〜6のいずれか一項に記載の基板搬送ロボット。
- 前記各基板滑り止め部材の各突起部が円柱状、切頭円錐状又は半球状であることを特徴とする請求項1〜7のいずれか一項に記載の基板搬送ロボット。
- 前記各基板滑り止め部材が、前記突起部を設ける基壁を備えていることを特徴とする請求項1〜8のいずれか一項に記載の基板搬送ロボット。
- 前記基壁が前記筒状の基板滑り止め部材の内部空間内に形成されることを特徴とする請求項9に記載の基板搬送ロボット。
- 前記基壁が前記筒状の基板滑り止め部材の上端面に形成されることを特徴とする請求項9に記載の基板搬送ロボット。
- 前記基壁に設けられる前記突起部が、円柱状又は縦断面がT字形であることを特徴とする請求項9〜11のいずれか一項に記載の基板搬送ロボット。
- 基板を載置する基板受部と、前記基板受部の上面にそれぞれ間隔を置いて設けられた弾性体から成る複数個の基板滑り止め部材と、先端に前記基板受部が配設された伸縮自在なアーム部とを有し、前記基板滑り止め部材の上端面に、突起部を設けて成る基板搬送ロボットと;
前記基板搬送ロボットを配設した基板搬送室と;
前記基板搬送室の周りに設けられた複数個の基板処理室と;
を有することを特徴とする真空処理装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009521622A JP5061187B2 (ja) | 2007-06-29 | 2008-06-30 | 基板搬送ロボット |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007172871 | 2007-06-29 | ||
JP2007172871 | 2007-06-29 | ||
JP2009521622A JP5061187B2 (ja) | 2007-06-29 | 2008-06-30 | 基板搬送ロボット |
PCT/JP2008/061823 WO2009005027A1 (ja) | 2007-06-29 | 2008-06-30 | 基板搬送ロボット及びそれを備えた真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009005027A1 true JPWO2009005027A1 (ja) | 2010-08-26 |
JP5061187B2 JP5061187B2 (ja) | 2012-10-31 |
Family
ID=40226072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009521622A Active JP5061187B2 (ja) | 2007-06-29 | 2008-06-30 | 基板搬送ロボット |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110014015A1 (ja) |
EP (1) | EP2166567B1 (ja) |
JP (1) | JP5061187B2 (ja) |
KR (1) | KR101323007B1 (ja) |
CN (1) | CN101779282B (ja) |
TW (1) | TWI456683B (ja) |
WO (1) | WO2009005027A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2393030A3 (en) | 2010-06-07 | 2012-02-29 | Samsung SDS Co. Ltd. | Anti-malware system and operating method thereof |
EP2400424B8 (en) | 2010-06-18 | 2016-05-18 | Samsung SDS Co., Ltd. | Anti-malware system and operating method thereof |
JP6186124B2 (ja) * | 2012-12-14 | 2017-08-23 | 東京応化工業株式会社 | 搬送アーム、搬送装置および搬送方法 |
KR101356952B1 (ko) * | 2012-12-26 | 2014-02-03 | 하이디스 테크놀로지 주식회사 | 기판 이송장치용 미끄러짐 방지패드 |
CN103659836A (zh) * | 2013-12-17 | 2014-03-26 | 李健 | 一种机械臂 |
CN106653672A (zh) * | 2015-11-02 | 2017-05-10 | 沈阳芯源微电子设备有限公司 | 一种晶片传递装置 |
JP6799395B2 (ja) * | 2016-06-30 | 2020-12-16 | 株式会社荏原製作所 | 基板ホルダ、電子デバイス製造装置において基板を搬送する搬送システム、および電子デバイス製造装置 |
KR101780976B1 (ko) | 2017-05-11 | 2017-10-23 | 임병찬 | 설치가 용이한 넌슬립 패드 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224281A (ja) * | 1992-01-14 | 1994-08-12 | Toshiba Ceramics Co Ltd | ウエハ移載用治具 |
JP2000003951A (ja) * | 1998-06-16 | 2000-01-07 | Tokyo Electron Ltd | 搬送装置 |
JP2000012655A (ja) * | 1998-06-17 | 2000-01-14 | Tokyo Electron Ltd | 基板の保持装置 |
JP2000260846A (ja) * | 1999-03-12 | 2000-09-22 | Kokusai Electric Co Ltd | 半導体製造装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5669977A (en) * | 1995-12-22 | 1997-09-23 | Lam Research Corporation | Shape memory alloy lift pins for semiconductor processing equipment |
JP2002026108A (ja) | 2000-07-12 | 2002-01-25 | Tokyo Electron Ltd | 被処理体の移載機構、処理システム及び移載機構の使用方法 |
US6634686B2 (en) * | 2001-10-03 | 2003-10-21 | Applied Materials, Inc. | End effector assembly |
US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
US20050167554A1 (en) * | 2003-11-13 | 2005-08-04 | Rice Michael R. | Kinematic pin with shear member and substrate carrier for use therewith |
JP4570037B2 (ja) | 2005-03-17 | 2010-10-27 | 株式会社アルバック | 基板搬送システム |
US7690881B2 (en) * | 2006-08-30 | 2010-04-06 | Asm Japan K.K. | Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus |
-
2008
- 2008-06-26 TW TW097123939A patent/TWI456683B/zh active
- 2008-06-30 US US12/667,149 patent/US20110014015A1/en not_active Abandoned
- 2008-06-30 JP JP2009521622A patent/JP5061187B2/ja active Active
- 2008-06-30 WO PCT/JP2008/061823 patent/WO2009005027A1/ja active Application Filing
- 2008-06-30 EP EP08790736.6A patent/EP2166567B1/en active Active
- 2008-06-30 CN CN2008801013694A patent/CN101779282B/zh active Active
- 2008-06-30 KR KR1020107001790A patent/KR101323007B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224281A (ja) * | 1992-01-14 | 1994-08-12 | Toshiba Ceramics Co Ltd | ウエハ移載用治具 |
JP2000003951A (ja) * | 1998-06-16 | 2000-01-07 | Tokyo Electron Ltd | 搬送装置 |
JP2000012655A (ja) * | 1998-06-17 | 2000-01-14 | Tokyo Electron Ltd | 基板の保持装置 |
JP2000260846A (ja) * | 1999-03-12 | 2000-09-22 | Kokusai Electric Co Ltd | 半導体製造装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2166567A1 (en) | 2010-03-24 |
US20110014015A1 (en) | 2011-01-20 |
TWI456683B (zh) | 2014-10-11 |
KR101323007B1 (ko) | 2013-10-29 |
KR20100049566A (ko) | 2010-05-12 |
TW200913117A (en) | 2009-03-16 |
EP2166567B1 (en) | 2014-04-09 |
CN101779282B (zh) | 2012-04-04 |
WO2009005027A1 (ja) | 2009-01-08 |
CN101779282A (zh) | 2010-07-14 |
EP2166567A4 (en) | 2012-01-11 |
JP5061187B2 (ja) | 2012-10-31 |
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