JPWO2008090614A1 - プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 - Google Patents
プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 Download PDFInfo
- Publication number
- JPWO2008090614A1 JPWO2008090614A1 JP2008554938A JP2008554938A JPWO2008090614A1 JP WO2008090614 A1 JPWO2008090614 A1 JP WO2008090614A1 JP 2008554938 A JP2008554938 A JP 2008554938A JP 2008554938 A JP2008554938 A JP 2008554938A JP WO2008090614 A1 JPWO2008090614 A1 JP WO2008090614A1
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- prepreg
- printed wiring
- inorganic filler
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Abstract
Description
(式(1)及び式(2)中、R1はアルキレン基、又は−SO2−を示し、R2の5〜99モル%が直鎖状もしくは環状の炭素数1〜20のカルボニル基または芳香族カルボニル基で、1〜95モル%が水素原子を示し、R3は水素原子、または、メチル基を示す。)
はじめに本実施例で用いた原材料を以下にまとめて示す。
・FX289ZA:東都化成(株)製のリン変性エポキシ樹脂、エポキシ当量331g/eq,リン原子含有割合3.0質量%
・YDF170:東都化成(株)製のビスフェノールF型エポキシ樹脂、エポキシ当量170g/eq
・YX4000H:ジャパンエポキシレジン(株)製のビフェニル型エポキシ樹脂、エポキシ当量185g/eq
(硬化剤(B))
・VH4170:大日本インキ(株)製のビスフェノールAノボラック樹脂、水酸基当量118g/eq、樹脂軟化点105℃、2官能ビスフェノールAを25質量%含有する。
・XL−225L:三井化学(株)製のフェノールアラルキル樹脂、水酸基当量171〜179g/eq、軟化点75〜80℃
・HF−1:明和化成(株)製のフェノールノボラック樹脂、水酸基当量106g/eq、軟化点84℃
(硬化促進剤(C))
・2エチル4メチルイミダゾール(2E4MZ−CN)
(フェノキシ樹脂(D))
・ERF−001:東都化成(株)製のリン変性フェノキシ樹脂
・RX200:一般式(1)及び/又は一般式(2)で示される骨格を含有するフェノキシ樹脂(D2)、太陽インキ製造(株)製
(無機充填材)
・平均粒子径4μmの水酸化アルミニウム:住友化学(株)製、CL303M
・平均粒子径3μmの水酸化アルミニウム:昭和電工(株)製のHP360
・平均粒子径1μmの水酸化アルミニウム:昭和電工(株)製のH42I
・平均粒子径0.8μmの水酸化アルミニウム:昭和電工(株)製のH43
(溶媒)
・メチルエチルケトン:メトキシプロパノール:シクロヘキサノン=45:10:45の混合溶媒
樹脂ワニスは以下のようにして調製した。
表1及び表2に示すような各配合組成によりエポキシ樹脂成分及び硬化剤成分を配合し、得られた配合物100質量部を前記溶媒80質量部に投入した。そしてディスパーで1時間攪拌して均一化した。そして、更に、表1及び表2に示すような配合組成により硬化促進剤及び無機充填材を前記溶媒に投入した。そして、さらにディスパーで1時間攪拌して、樹脂ワニスを得た。
調製した樹脂ワニスをガラスクロス(日東紡績(株)製「1035タイプクロス、30μm厚」)に室温にて含浸させた。そして、約130〜170℃で加熱することにより、ワニス中の溶媒を乾燥除去し、樹脂組成物を半硬化させてプリプレグ11を作製した。プリプレグはガラスクロス30質量%、樹脂組成物70質量%になるように調整した。
得られたプリプレグ11を用いて、以下のようにして多層プリント回路基板を作製した。
正極と負極が25μmの回路間間隔を維持するように形成した線幅25μmのくし型回路パターンの正極と負極との間の抵抗値を超絶縁抵抗計にて測定した。20ボード測定したうち、抵抗値が1.0×1010以上のものを合格として、合格品の割合を測定した。
線幅10mmの回路を形成し、その回路のピール強度を引張試験機を用いて測定した。測定は5本の回路のピール強度を測定し、その平均値を算出した。
JIS C6481に基づいて、得られた多層プリント配線板について、DMA法(Dynamic mechanical analysis)によりガラス転移温度(Tg)を測定した。
1MHzの誘電率及び誘電正接はJIS C 6481に準じたブリッジ法により測定した。また、1GHzの誘電率及び誘電正接は(株)関東電子応用開発の空洞共振器摂動法誘電率測定装置を用いて測定した。
Claims (11)
- (A)エポキシ樹脂、(B)硬化剤、(C)硬化促進剤、(D)フェノキシ樹脂、及び(E)無機充填材を含有するエポキシ樹脂組成物を基材に含浸し、半硬化させて得られるプリプレグであって、
前記無機充填材(E)の平均粒子径が3μm以下であることを特徴とするプリプレグ。 - 前記無機充填材(E)が水酸化アルミニウムを含有する請求項1に記載のプリプレグ。
- 前記エポキシ樹脂(A)がリン変性エポキシ樹脂(A1)を含有する請求項1または2に記載のプリプレグ。
- 前記フェノキシ樹脂(D)がリン変性フェノキシ樹脂(D1)を含有する請求項1〜3のいずれか1項に記載のプリプレグ。
- 前記エポキシ樹脂組成物から無機充填材(E)を除いた残部に対する、前記フェノキシ樹脂(D)の含有割合が5〜15質量%である請求項1〜5のいずれか1項に記載のプリプレグ。
- 前記エポキシ樹脂組成物から無機充填材(E)を除いた残部に対する、リン原子の含有割合が0.6〜2質量%である請求項1〜6のいずれか1項に記載のプリプレグ。
- 前記エポキシ樹脂組成物全量に対する、無機充填材(E)の含有割合が5〜80質量%である請求項1〜7のいずれか1項に記載のプリプレグ。
- 請求項1〜8のいずれか1項に記載のプリプレグと内層回路基板とを積層成形して得られる多層回路基板。
- 請求項1〜8のいずれか1項に記載のプリプレグを絶縁層として用いたプリント配線板。
- 請求項1〜8のいずれか1項に記載のプリプレグが最外層に露出するように少なくとも1層の内層回路基板と複数層のプリプレグとを積層した後、加熱加圧することにより積層体を形成する工程、前記積層体の表面を粗化する粗化工程、前記粗化された表面に無電解メッキによりメッキ層を形成するメッキ工程とを備えることを特徴とするプリント配線板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/051166 WO2008090614A1 (ja) | 2007-01-25 | 2007-01-25 | プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008090614A1 true JPWO2008090614A1 (ja) | 2010-05-13 |
JP5554500B2 JP5554500B2 (ja) | 2014-07-23 |
Family
ID=39644196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008554938A Active JP5554500B2 (ja) | 2007-01-25 | 2007-01-25 | プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8409704B2 (ja) |
JP (1) | JP5554500B2 (ja) |
KR (1) | KR101077435B1 (ja) |
TW (1) | TW200838928A (ja) |
WO (1) | WO2008090614A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5547386B2 (ja) * | 2008-09-25 | 2014-07-09 | パナソニック株式会社 | プリプレグ用エポキシ樹脂組成物、プリプレグ、および多層プリント配線板 |
US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
TWI471368B (zh) | 2009-02-13 | 2015-02-01 | Sumitomo Chemical Co | Fine particles of aluminum hydroxide powder for filling resin and a method for producing the same |
WO2010103745A1 (ja) * | 2009-03-11 | 2010-09-16 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
CN102598883A (zh) | 2009-10-30 | 2012-07-18 | 松下电器产业株式会社 | 电路板以及在电路板上安装有元件的半导体装置 |
JP5171798B2 (ja) * | 2009-12-07 | 2013-03-27 | 三菱電機株式会社 | 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール |
EP3048132A1 (en) * | 2011-02-16 | 2016-07-27 | Mitsubishi Rayon Co., Ltd. | Prepreg and fiber-reinforced composite material |
DE102011051411A1 (de) | 2011-06-28 | 2013-01-03 | Schweizer Electronic Ag | Prepreg, Verfahren zum Herstellen eines Prepregs, Verfahren zum Herstellen eines Leiterplattenelements sowie Leiterplattenelement |
EP2623561A1 (en) * | 2012-02-06 | 2013-08-07 | Momentive Specialty Chemicals Research Belgium S.A. | Epoxy resin formulations for textiles, mats and other fibrous reinforcements for composite applications |
ES2954067T3 (es) | 2012-02-06 | 2023-11-20 | Westlake Epoxy Inc | Formulaciones de resinas epoxi para tejidos, esteras y otros refuerzos fibrosos para aplicaciones de compuestos |
KR20140127803A (ko) * | 2012-02-28 | 2014-11-04 | 스미토모 베이클리트 컴퍼니 리미티드 | 프리프레그 및 프리프레그 제조 방법 |
JP6130693B2 (ja) * | 2012-03-30 | 2017-05-17 | 太陽インキ製造株式会社 | 積層構造体、ドライフィルムおよび積層構造体の製造方法 |
CN105348740A (zh) * | 2015-11-27 | 2016-02-24 | 广东生益科技股份有限公司 | 一种树脂组合物及其制作的覆铜板和pcb板 |
JP7029226B2 (ja) * | 2017-02-14 | 2022-03-03 | 味の素株式会社 | 回路基板 |
JP7211744B2 (ja) * | 2018-09-19 | 2023-01-24 | 日鉄ケミカル&マテリアル株式会社 | エポキシ樹脂組成物およびその硬化物 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4751146A (en) * | 1985-07-09 | 1988-06-14 | Showa Denko Kabushiki Kaisha | Printed circuit boards |
JPH03119025A (ja) * | 1989-09-30 | 1991-05-21 | Tonen Corp | エポキシ樹脂組成物 |
CN1036402C (zh) * | 1991-01-11 | 1997-11-12 | 旭化成工业株式会社 | 可固化的聚苯氧树脂组合物及由它制成的薄膜 |
JP3193106B2 (ja) * | 1992-03-05 | 2001-07-30 | 日東電工株式会社 | エポキシ樹脂組成物の硬化方法および硬化物 |
EP0745640B1 (en) * | 1994-12-02 | 2003-04-02 | Toray Industries, Inc. | Prepreg and fiber-reinforced composite material |
US5670250A (en) * | 1995-02-24 | 1997-09-23 | Polyclad Laminates, Inc. | Circuit board prepreg with reduced dielectric constant |
JP3190251B2 (ja) * | 1995-06-06 | 2001-07-23 | 太陽インキ製造株式会社 | アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物 |
TW389780B (en) * | 1995-09-13 | 2000-05-11 | Hitachi Chemical Co Ltd | Prepreg for printed circuit board |
JP3658649B2 (ja) * | 1997-08-29 | 2005-06-08 | 東都化成株式会社 | エポキシ樹脂組成物 |
TW445276B (en) * | 1998-08-13 | 2001-07-11 | Otsuka Chemical Co Ltd | Crosslinked phenoxyphosphazene compounds, process for the preparation thereof, flame retardants, flame-retardant resin compositions, and moldings of flame-retardant resins |
JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
TWI335347B (en) * | 2003-05-27 | 2011-01-01 | Ajinomoto Kk | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
JP4725704B2 (ja) | 2003-05-27 | 2011-07-13 | 味の素株式会社 | 多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ |
JP3720337B2 (ja) | 2003-06-12 | 2005-11-24 | 京セラケミカル株式会社 | 有機基材プリプレグ、積層板及びプリント配線板 |
TW200602427A (en) * | 2004-03-30 | 2006-01-16 | Taiyo Ink Mfg Co Ltd | Thermosetting resin composition and multilayered printed wiring board comprising the same |
WO2005104638A1 (ja) | 2004-04-23 | 2005-11-03 | Matsushita Electric Works, Ltd. | 配線基板およびその製造方法 |
JP4463005B2 (ja) | 2004-05-31 | 2010-05-12 | 株式会社Adeka | エポキシ樹脂組成物 |
JP2006028274A (ja) * | 2004-07-14 | 2006-02-02 | Tokai Rubber Ind Ltd | エポキシ樹脂組成物およびこれを用いたプリプレグ |
JP4654647B2 (ja) * | 2004-09-30 | 2011-03-23 | 味の素株式会社 | 回路基板用金属付きポリアミドイミドフィルム及びその製造方法 |
-
2007
- 2007-01-25 JP JP2008554938A patent/JP5554500B2/ja active Active
- 2007-01-25 WO PCT/JP2007/051166 patent/WO2008090614A1/ja active Application Filing
- 2007-01-25 US US12/523,775 patent/US8409704B2/en active Active
- 2007-01-25 KR KR1020097017644A patent/KR101077435B1/ko active IP Right Grant
-
2008
- 2008-01-23 TW TW97102456A patent/TW200838928A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TWI373991B (ja) | 2012-10-01 |
KR101077435B1 (ko) | 2011-10-26 |
WO2008090614A1 (ja) | 2008-07-31 |
US8409704B2 (en) | 2013-04-02 |
US20100044087A1 (en) | 2010-02-25 |
TW200838928A (en) | 2008-10-01 |
KR20100004979A (ko) | 2010-01-13 |
JP5554500B2 (ja) | 2014-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5554500B2 (ja) | プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 | |
JP5493853B2 (ja) | エポキシ樹脂組成物、プリプレグ、積層板、多層プリント配線板、半導体装置、絶縁樹脂シート、多層プリント配線板の製造方法 | |
JP5576930B2 (ja) | プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板 | |
JP5650908B2 (ja) | 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔 | |
JP5260400B2 (ja) | 多層プリント配線板を作製するための多層板 | |
JPWO2006059363A1 (ja) | プリプレグ用エポキシ樹脂組成物およびプリプレグ、多層プリント配線板 | |
JPWO2008032383A1 (ja) | プリント配線板用エポキシ樹脂組成物、樹脂組成物ワニス、プリプレグ、金属張積層体、プリント配線板及び多層プリント配線板 | |
JP4830748B2 (ja) | 難燃性エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板 | |
JP4600359B2 (ja) | エポキシ樹脂組成物、樹脂フィルム、プリプレグ及び多層プリント配線板 | |
TWI396717B (zh) | An epoxy resin composition, a resin film, a prepreg, and a multilayer printed wiring | |
JP2009007406A (ja) | プリプレグ、多層回路基板、プリント配線板及びプリント配線板の製造方法 | |
US8748513B2 (en) | Epoxy resin composition, and prepreg and printed circuit board using the same | |
JP4016782B2 (ja) | プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、多層プリント配線板 | |
JP2000349440A (ja) | 内層回路入り多層銅張積層板の製造方法 | |
US8383738B2 (en) | Epoxy resin composition, and prepreg and printed circuit board using the same | |
JP3363388B2 (ja) | エポキシ樹脂組成物及びプリプレグ及び金属箔張り積層板 | |
JP2007294487A (ja) | プリプレグ、プリント配線板の製造方法 | |
JP2005048036A (ja) | プリプレグ、およびこれを用いた金属箔張積層板 | |
JP2000072969A (ja) | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 | |
KR101174698B1 (ko) | 프린트 배선판용 프리프레그 및 동장 적층판 | |
JP2001040069A (ja) | エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、接着シート、積層板及び多層板 | |
JP2002088175A (ja) | プリプレグ及び積層板 | |
JP3514146B2 (ja) | プリプレグ及び積層板 | |
JPH10182946A (ja) | プリント配線板用エポキシ樹脂組成物、及びそれを用いたプリプレグ | |
JP5410804B2 (ja) | エポキシ樹脂組成物、プリプレグ、積層板、および多層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121101 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20121101 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131015 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140527 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140529 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5554500 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |