JPWO2007114474A1 - 液体材料気化装置 - Google Patents
液体材料気化装置 Download PDFInfo
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- JPWO2007114474A1 JPWO2007114474A1 JP2008508715A JP2008508715A JPWO2007114474A1 JP WO2007114474 A1 JPWO2007114474 A1 JP WO2007114474A1 JP 2008508715 A JP2008508715 A JP 2008508715A JP 2008508715 A JP2008508715 A JP 2008508715A JP WO2007114474 A1 JPWO2007114474 A1 JP WO2007114474A1
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- gas
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- 239000011344 liquid material Substances 0.000 title claims abstract description 76
- 239000006200 vaporizer Substances 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 96
- 238000001816 cooling Methods 0.000 claims abstract description 92
- 238000002156 mixing Methods 0.000 claims abstract description 56
- 230000008016 vaporization Effects 0.000 claims abstract description 53
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 239000007789 gas Substances 0.000 claims abstract description 37
- 239000012159 carrier gas Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 238000009834 vaporization Methods 0.000 claims description 40
- 239000000112 cooling gas Substances 0.000 claims description 34
- 230000020169 heat generation Effects 0.000 claims description 5
- 238000009835 boiling Methods 0.000 abstract description 29
- 239000000463 material Substances 0.000 abstract description 21
- 239000002904 solvent Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Abstract
Description
Claims (8)
- 液体材料とキャリアガスとを混合して気液混合体を生成をする気液混合部と、
前記気液混合部からの気液混合体を気化しこの気化によって生じたガスを前記キャリアガスによって外部へ導出する加熱型の気化部と、
前記気液混合部と前記気化部とを接続し内部に前記気液混合体の流路を有する接続部と、
前記接続部を冷却する接続部冷却部と、を具備して成ることを特徴とする液体材料気化装置。 - 前記接続部冷却部が、前記接続部の略全体に亘って冷却するものであることを特徴とする請求項1記載の液体材料気化装置。
- 前記気化部が、約300度程度に加熱保温されるものであることを特徴とする請求項1記載の液体材料気化装置。
- 前記接続部冷却部が、クーリングガスの供給を受け且つ前記接続部に取り付けられる1または複数の接続部冷却フィンを備えて成るものであることを特徴とする請求項1記載の液体材料気化装置。
- 前記接続部冷却フィンを、前記クーリングガスを内部に導入する導入口および冷却に用いたクーリングガスを外部へ導出する導出口を有する冷却ケース内に配していることを特徴とする請求項4記載の液体材料気化装置。
- 前記クーリングガスを予め冷却するクーリングガス冷却部を具備することを特徴とする請求項4記載の液体材料気化装置。
- 前記クーリングガス冷却部が、1または複数のクーリングガス冷却フィンと、冷却側をクーリングガスの流路に対して取り付けられる一方発熱側を前記クーリングガス冷却フィンに取り付けられて成るクーリングガス冷却用ペルチェ素子とを備えることを特徴とする請求項6記載の液体材料気化装置。
- 前記接続部冷却部が、冷却側を前記接続部に取り付けた接続部冷却用ペルチェ素子と、この接続部冷却用ペルチェ素子の発熱側に取り付けた1または複数のペルチェ素子冷却フィンとを備えて成ることを特徴とする請求項1記載の液体材料気化装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008508715A JP5090341B2 (ja) | 2006-04-05 | 2007-04-04 | 液体材料気化装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006103803 | 2006-04-05 | ||
JP2006103803 | 2006-04-05 | ||
PCT/JP2007/057593 WO2007114474A1 (ja) | 2006-04-05 | 2007-04-04 | 液体材料気化装置 |
JP2008508715A JP5090341B2 (ja) | 2006-04-05 | 2007-04-04 | 液体材料気化装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012054917A Division JP5475817B2 (ja) | 2006-04-05 | 2012-03-12 | 液体材料気化装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007114474A1 true JPWO2007114474A1 (ja) | 2009-08-20 |
JP5090341B2 JP5090341B2 (ja) | 2012-12-05 |
Family
ID=38563735
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008508715A Active JP5090341B2 (ja) | 2006-04-05 | 2007-04-04 | 液体材料気化装置 |
JP2012054917A Active JP5475817B2 (ja) | 2006-04-05 | 2012-03-12 | 液体材料気化装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012054917A Active JP5475817B2 (ja) | 2006-04-05 | 2012-03-12 | 液体材料気化装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8280235B2 (ja) |
EP (1) | EP2009137A4 (ja) |
JP (2) | JP5090341B2 (ja) |
KR (1) | KR101058976B1 (ja) |
CN (3) | CN102912319B (ja) |
WO (1) | WO2007114474A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8755679B2 (en) | 2006-04-05 | 2014-06-17 | Horiba Stec, Co., Ltd. | Liquid material vaporizer |
JP5004890B2 (ja) * | 2008-07-24 | 2012-08-22 | 株式会社日立国際電気 | 気化器、基板処理装置及び半導体装置の製造方法 |
US9454158B2 (en) | 2013-03-15 | 2016-09-27 | Bhushan Somani | Real time diagnostics for flow controller systems and methods |
JP6151943B2 (ja) * | 2013-03-26 | 2017-06-21 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
JP6186179B2 (ja) * | 2013-05-31 | 2017-08-23 | 株式会社堀場エステック | 攪拌器及び攪拌器の製造方法 |
KR102108802B1 (ko) | 2014-05-07 | 2020-05-11 | 현대자동차주식회사 | 연소실로 유입되는 흡기의 온도를 제어하기 위한 에어히터 및 그 작동방법 |
CN105716225B (zh) * | 2014-12-22 | 2020-08-11 | 株式会社堀场Stec | 流体加热器、加热块和汽化系统 |
KR102584113B1 (ko) * | 2015-11-10 | 2023-10-04 | 도쿄엘렉트론가부시키가이샤 | 기화기, 성막 장치 및 온도 제어 방법 |
JP6675865B2 (ja) * | 2015-12-11 | 2020-04-08 | 株式会社堀場エステック | 液体材料気化装置 |
KR102483924B1 (ko) * | 2016-02-18 | 2023-01-02 | 삼성전자주식회사 | 기화기 및 이를 구비하는 박막 증착 장치 |
US10983537B2 (en) | 2017-02-27 | 2021-04-20 | Flow Devices And Systems Inc. | Systems and methods for flow sensor back pressure adjustment for mass flow controller |
WO2019082674A1 (ja) * | 2017-10-23 | 2019-05-02 | 株式会社堀場エステック | 気化装置及び気化装置用分離器 |
JP7223496B2 (ja) | 2017-12-14 | 2023-02-16 | 株式会社堀場エステック | 混合器及び気化装置 |
KR102250139B1 (ko) | 2018-01-23 | 2021-05-10 | (주)티티에스 | 액체 소스 기화 장치 및 기화 방법 |
CN110643975B (zh) * | 2018-06-27 | 2021-09-28 | 东北大学 | 一种金属有机化学源液体的蒸发输运装置 |
WO2020039886A1 (ja) * | 2018-08-24 | 2020-02-27 | 株式会社堀場エステック | 気化器、液体材料気化装置、及び気化方法 |
WO2024080180A1 (ja) * | 2022-10-12 | 2024-04-18 | 株式会社堀場エステック | 液体材料気化装置および液体材料気化方法 |
Family Cites Families (14)
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EP0602595B1 (en) * | 1992-12-15 | 1997-07-23 | Applied Materials, Inc. | Vaporizing reactant liquids for CVD |
US5630878A (en) * | 1994-02-20 | 1997-05-20 | Stec Inc. | Liquid material-vaporizing and supplying apparatus |
US5520001A (en) * | 1994-02-20 | 1996-05-28 | Stec, Inc. | Vapor controller |
JP3893177B2 (ja) * | 1996-11-12 | 2007-03-14 | 松下電器産業株式会社 | 気化装置、cvd装置及び薄膜製造方法 |
US6409839B1 (en) * | 1997-06-02 | 2002-06-25 | Msp Corporation | Method and apparatus for vapor generation and film deposition |
US6258170B1 (en) * | 1997-09-11 | 2001-07-10 | Applied Materials, Inc. | Vaporization and deposition apparatus |
CN1091170C (zh) * | 1998-02-18 | 2002-09-18 | 佛山市扬戈热处理有限公司 | 一种热处理工艺及设备 |
JP2000345345A (ja) * | 1999-06-04 | 2000-12-12 | Mitsubishi Electric Corp | Cvd装置およびcvd装置用気化装置 |
JP2001004095A (ja) * | 1999-06-18 | 2001-01-09 | Nippon M K S Kk | 気化器 |
KR100360494B1 (ko) * | 1999-09-21 | 2002-11-13 | 삼성전자 주식회사 | 기화장치 |
JP4251429B2 (ja) | 2001-11-28 | 2009-04-08 | 株式会社堀場エステック | 液体材料気化装置 |
JP3881569B2 (ja) * | 2002-03-13 | 2007-02-14 | 株式会社堀場エステック | 液体材料気化装置 |
JP4276409B2 (ja) | 2002-06-21 | 2009-06-10 | 株式会社堀場エステック | 液体材料気化装置 |
JP4607474B2 (ja) * | 2004-02-12 | 2011-01-05 | 東京エレクトロン株式会社 | 成膜装置 |
-
2007
- 2007-04-04 EP EP07741029A patent/EP2009137A4/en not_active Withdrawn
- 2007-04-04 CN CN201210352861.7A patent/CN102912319B/zh active Active
- 2007-04-04 WO PCT/JP2007/057593 patent/WO2007114474A1/ja active Application Filing
- 2007-04-04 KR KR1020087024259A patent/KR101058976B1/ko active IP Right Grant
- 2007-04-04 CN CNA2007800109411A patent/CN101410548A/zh active Pending
- 2007-04-04 US US12/295,862 patent/US8280235B2/en active Active
- 2007-04-04 CN CN201510413970.9A patent/CN105256288A/zh active Pending
- 2007-04-04 JP JP2008508715A patent/JP5090341B2/ja active Active
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2012
- 2012-03-12 JP JP2012054917A patent/JP5475817B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN102912319A (zh) | 2013-02-06 |
JP5475817B2 (ja) | 2014-04-16 |
CN105256288A (zh) | 2016-01-20 |
CN102912319B (zh) | 2014-12-10 |
EP2009137A1 (en) | 2008-12-31 |
US20090097831A1 (en) | 2009-04-16 |
JP5090341B2 (ja) | 2012-12-05 |
JP2012177193A (ja) | 2012-09-13 |
WO2007114474A1 (ja) | 2007-10-11 |
KR20080110603A (ko) | 2008-12-18 |
EP2009137A4 (en) | 2010-03-24 |
KR101058976B1 (ko) | 2011-08-23 |
CN101410548A (zh) | 2009-04-15 |
US8280235B2 (en) | 2012-10-02 |
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