JPWO2006134673A1 - セラミック板の製造方法 - Google Patents
セラミック板の製造方法 Download PDFInfo
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Abstract
Description
(1)セラミック層と金属層との界面に介在する酸素の存在
(2)金属層を貫通してセラミック層同士を連通する架橋の存在
(3)焼成時における金属成分のセラミック層への拡散
(4)セラミック層の表層面におけるガラス成分の存在
が考えられる。
2 金属ペースト作製工程
3 金属膜形成工程
4、23 積層体作製工程
5、24 焼成工程
6、25 分離工程
7 セラミックグリーンシート
8、31、33 金属膜
9 セラミック層
10、28 金属層
11 焼結体
12 酸素除去処理液
21 電極ペースト作製工程
22 電極膜形成工程
27 電極層
30 第1のセラミックグリーンシート
32 第2のセラミックグリーンシート
(1)セラミック層と金属層との間に介在する酸素の存在
(2)金属層を貫通するセラミック層の存在
(3)焼成時における金属成分のセラミック層への拡散
(4)セラミック層の表層面におけるガラス成分の存在
を全て除去することができ、したがって、超音波等の外力を加えなくとも、セラミック層9と金属層10とを容易に分離することができ、クラック等の破損が生じない良質のセラミック板を高効率に得ることができる。
Claims (10)
- セラミック層と金属層とが交互に積層されてなる焼結体から前記セラミック層を分離させてセラミック板を得るセラミック板の製造方法であって、
セラミック素原料からセラミックグリーンシートを作製するセラミックグリーンシート作製工程と、
焼成時にセラミックに拡散しない金属成分を固形分とした金属ペーストを作製する金属ペースト作製工程と、
焼成後に形成されるセラミック層同士が積層方向に連通しないような膜厚となるように、前記セラミックグリーンシートの表面に前記金属ペーストを塗布して金属膜を形成する金属膜形成工程と、
前記金属膜の形成されたセラミックグリーンシートを積層して積層体を作製する積層体作製工程と、
焼成後におけるセラミック層の表層面にガラス成分が残存しない高温であって且つ前記セラミック層を構成するセラミック材料の分解温度以下に焼成温度を設定し、該焼成温度で前記積層体に焼成処理を施し、セラミック層と金属層とが交互に積層された焼結体を得る焼成工程と、
前記セラミック層と前記金属層との間に介在する酸素を除去する酸素除去処理液に、前記焼結体を浸漬し、前記セラミック層と前記金属層とを分離する分離工程とを含むことを特徴とするセラミック板の製造方法。 - 前記焼成時に前記セラミックに拡散する導電性成分を含有した電極ペーストを作製する電極ペースト作製工程と、前記セラミックグリーンシートの表面に前記電極ペーストを塗布して電極膜を形成する電極膜形成工程とを有し、
前記積層体作製工程により形成される積層体には、前記電極膜が形成されたセラミックグリーンシートを含むことを特徴とする請求項1記載のセラミック板の製造方法。 - 前記金属成分は、パラジウムであることを特徴とする請求項1又は請求項2記載のセラミック板の製造方法。
- 前記酸素除去処理液は、水酸基、アルデヒド基、及びカルボン酸基のうちの少なくとも1種以上を含有した有機化合物から選択された還元剤溶液であることを特徴とする請求項1乃至請求項3のいずれかに記載のセラミック板の製造方法。
- 前記酸素除去処理液は、液体アルコールであることを特徴とする請求項4記載のセラミック板の製造方法。
- 前記液体アルコールは、脂肪族アルコール、脂環式アルコール、芳香族アルコール、複素環式アルコール、及びこれらの混合物の中から選択することを特徴とする請求項5記載のセラミック板の製造方法。
- 前記脂肪族アルコールは、n−ブチルアルコールであることを特徴とする請求項6記載のセラミック板の製造方法。
- 前記セラミックグリーンシートを構成するセラミック材料は、鉛成分を含有した鉛系圧電セラミック材料であることを特徴とする請求項1乃至請求項7のいずれかに記載のセラミック板の製造方法。
- 前記金属膜の膜厚は、1.9〜10μmであることを特徴とする請求項1乃至請求項8のいずれかに記載のセラミック板の製造方法。
- 前記セラミックグリーンシート作製工程は、膜厚の異なる複数種のセラミックグリーンシートを作製することを特徴とする請求項1乃至請求項9のいずれかに記載のセラミック板の製造方法。
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JPH08267438A (ja) * | 1995-04-03 | 1996-10-15 | Murata Mfg Co Ltd | セラミックシートの製造方法 |
JP2005015254A (ja) * | 2003-06-24 | 2005-01-20 | Murata Mfg Co Ltd | 薄層セラミック板の製造方法 |
JP2005019538A (ja) * | 2003-06-24 | 2005-01-20 | Murata Mfg Co Ltd | 薄層セラミック板の製造方法 |
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TW434600B (en) * | 1998-02-17 | 2001-05-16 | Murata Manufacturing Co | Dielectric ceramic composition, laminated ceramic capacitor, and method for producing the laminate ceramic capacitor |
US20010035253A1 (en) * | 1998-06-16 | 2001-11-01 | Kouji Kawakita | Ceramic sintered body and production method thereof |
US6441459B1 (en) * | 2000-01-28 | 2002-08-27 | Tdk Corporation | Multilayer electronic device and method for producing same |
JP2005015255A (ja) * | 2003-06-24 | 2005-01-20 | Murata Mfg Co Ltd | 薄層セラミック板の製造方法 |
JP4639801B2 (ja) * | 2004-04-14 | 2011-02-23 | 株式会社デンソー | セラミック板及びその製造方法 |
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JPS6156188B2 (ja) * | 1982-09-10 | 1986-12-01 | Murata Manufacturing Co | |
JPH0543352A (ja) * | 1991-08-13 | 1993-02-23 | Murata Mfg Co Ltd | 焼成セラミツク板の剥離方法 |
JPH08267438A (ja) * | 1995-04-03 | 1996-10-15 | Murata Mfg Co Ltd | セラミックシートの製造方法 |
JP2005015254A (ja) * | 2003-06-24 | 2005-01-20 | Murata Mfg Co Ltd | 薄層セラミック板の製造方法 |
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TW200642989A (en) | 2006-12-16 |
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