JPS6490544A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS6490544A JPS6490544A JP24864387A JP24864387A JPS6490544A JP S6490544 A JPS6490544 A JP S6490544A JP 24864387 A JP24864387 A JP 24864387A JP 24864387 A JP24864387 A JP 24864387A JP S6490544 A JPS6490544 A JP S6490544A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- integrated circuit
- semiconductor integrated
- etching
- conditions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To control the conditions of etching of contact holes, and to improve yield by equalizing the shape and size of the contact holes on a semiconductor substrate. CONSTITUTION:An integrated circuit is composed of a metallic wiring layer 1, a polycrystalline silicon wiring layer 2, a contact hole 3 and a diffusion layer 4. The shape and size of the holes 3 are all equalized at that time. A large number of the holes 3 are formed where currents are concentrated such as a power wiring section. Accordingly, the conditions of etching of the holes 3 are controlled easily, thus improving yield.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24864387A JPS6490544A (en) | 1987-10-01 | 1987-10-01 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24864387A JPS6490544A (en) | 1987-10-01 | 1987-10-01 | Semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6490544A true JPS6490544A (en) | 1989-04-07 |
Family
ID=17181168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24864387A Pending JPS6490544A (en) | 1987-10-01 | 1987-10-01 | Semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6490544A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319307A (en) * | 2005-05-11 | 2006-11-24 | Samsung Sdi Co Ltd | Semiconductor device and method for manufacturing same |
US7411301B2 (en) | 2002-06-21 | 2008-08-12 | Renesas Technology Corp. | Semiconductor integrated circuit device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59126652A (en) * | 1983-01-10 | 1984-07-21 | Nec Corp | Semiconductor device |
-
1987
- 1987-10-01 JP JP24864387A patent/JPS6490544A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59126652A (en) * | 1983-01-10 | 1984-07-21 | Nec Corp | Semiconductor device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7411301B2 (en) | 2002-06-21 | 2008-08-12 | Renesas Technology Corp. | Semiconductor integrated circuit device |
US7786585B2 (en) | 2002-06-21 | 2010-08-31 | Renesas Electronics Corp. | Semiconductor integrated circuit device |
US7977238B2 (en) | 2002-06-21 | 2011-07-12 | Renesas Electronics Corporation | Method of manufacturing a semiconductor integrated circuit device |
US8093723B2 (en) | 2002-06-21 | 2012-01-10 | Renesas Electronics Corporation | Method of manufacturing a semiconductor integrated circuit device |
JP2006319307A (en) * | 2005-05-11 | 2006-11-24 | Samsung Sdi Co Ltd | Semiconductor device and method for manufacturing same |
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