JPS6489322A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To form metal electrodes or metal wirings at positions where electrodes or wirings are removed and to prevent an active region from damaging, contaminating by forming simulated electrodes or wirings made of photoresist at predetermined positions on a semiconductor substrate, forming an insulating film on a whole surface, and exposing by etching the electrodes or the wirings. CONSTITUTION:After a resist film 14 is formed on a semiconductor substrate 11, a plurality of types of simulated electrodes 12A, 12B are formed at predetermined positions. Then, an insulating film 13 is formed on a whole surface to flatten the resist film 14, the films 13, 14 are etched to expose the surfaces of the electrodes 12A, 12B. After the electrodes 12A, 12B are removed, a part except that from which the electrode 12A is removed is covered with a resist film 16A, and a Schottky electrode 15 is formed at the position from which the electrode 12A is removed. The film 16A is then removed, the electrode 15 is covered with a resist film 16B, and an ohmic electrode 17 is formed at the position of the electrode 12B.