JPS6484698A - Manufacture of multilayer circuit board - Google Patents

Manufacture of multilayer circuit board

Info

Publication number
JPS6484698A
JPS6484698A JP62242047A JP24204787A JPS6484698A JP S6484698 A JPS6484698 A JP S6484698A JP 62242047 A JP62242047 A JP 62242047A JP 24204787 A JP24204787 A JP 24204787A JP S6484698 A JPS6484698 A JP S6484698A
Authority
JP
Japan
Prior art keywords
piece construction
lamination
formation surface
circuit board
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62242047A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565078B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Muneisa Yamada
Toru Higuchi
Takeshi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62242047A priority Critical patent/JPS6484698A/ja
Publication of JPS6484698A publication Critical patent/JPS6484698A/ja
Publication of JPH0565078B2 publication Critical patent/JPH0565078B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP62242047A 1987-09-26 1987-09-26 Manufacture of multilayer circuit board Granted JPS6484698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242047A JPS6484698A (en) 1987-09-26 1987-09-26 Manufacture of multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242047A JPS6484698A (en) 1987-09-26 1987-09-26 Manufacture of multilayer circuit board

Publications (2)

Publication Number Publication Date
JPS6484698A true JPS6484698A (en) 1989-03-29
JPH0565078B2 JPH0565078B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-16

Family

ID=17083480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242047A Granted JPS6484698A (en) 1987-09-26 1987-09-26 Manufacture of multilayer circuit board

Country Status (1)

Country Link
JP (1) JPS6484698A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250641A (ja) * 1990-06-22 1992-09-07 Digital Equip Corp <Dec> 金属被膜による半導体パッケージ
CN114080146A (zh) * 2021-11-02 2022-02-22 中国电子科技集团公司第三十八研究所 一种低温无压的传感器金属外壳密封方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS6167289A (ja) * 1984-09-10 1986-04-07 エルナ−株式会社 プリント配線板の製造方法
JPS6175596A (ja) * 1984-09-20 1986-04-17 イビデン株式会社 スルホール多層回路基板の製造方法
JPS61154096A (ja) * 1984-12-26 1986-07-12 住友ベークライト株式会社 多層印刷配線板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS6167289A (ja) * 1984-09-10 1986-04-07 エルナ−株式会社 プリント配線板の製造方法
JPS6175596A (ja) * 1984-09-20 1986-04-17 イビデン株式会社 スルホール多層回路基板の製造方法
JPS61154096A (ja) * 1984-12-26 1986-07-12 住友ベークライト株式会社 多層印刷配線板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250641A (ja) * 1990-06-22 1992-09-07 Digital Equip Corp <Dec> 金属被膜による半導体パッケージ
CN114080146A (zh) * 2021-11-02 2022-02-22 中国电子科技集团公司第三十八研究所 一种低温无压的传感器金属外壳密封方法
CN114080146B (zh) * 2021-11-02 2023-12-05 中国电子科技集团公司第三十八研究所 一种低温无压的传感器金属外壳密封方法

Also Published As

Publication number Publication date
JPH0565078B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-16

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