JPS6481106A - Composition for forming conductive film - Google Patents

Composition for forming conductive film

Info

Publication number
JPS6481106A
JPS6481106A JP23847987A JP23847987A JPS6481106A JP S6481106 A JPS6481106 A JP S6481106A JP 23847987 A JP23847987 A JP 23847987A JP 23847987 A JP23847987 A JP 23847987A JP S6481106 A JPS6481106 A JP S6481106A
Authority
JP
Japan
Prior art keywords
composition
powder
metal
conductive film
3pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23847987A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0574166B2 (enrdf_load_stackoverflow
Inventor
Yasuto Kudo
Shiyouji Inomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP23847987A priority Critical patent/JPS6481106A/ja
Publication of JPS6481106A publication Critical patent/JPS6481106A/ja
Publication of JPH0574166B2 publication Critical patent/JPH0574166B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
JP23847987A 1987-09-22 1987-09-22 Composition for forming conductive film Granted JPS6481106A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23847987A JPS6481106A (en) 1987-09-22 1987-09-22 Composition for forming conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23847987A JPS6481106A (en) 1987-09-22 1987-09-22 Composition for forming conductive film

Publications (2)

Publication Number Publication Date
JPS6481106A true JPS6481106A (en) 1989-03-27
JPH0574166B2 JPH0574166B2 (enrdf_load_stackoverflow) 1993-10-15

Family

ID=17030852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23847987A Granted JPS6481106A (en) 1987-09-22 1987-09-22 Composition for forming conductive film

Country Status (1)

Country Link
JP (1) JPS6481106A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236512A (ja) * 1988-03-16 1989-09-21 Matsushita Electric Ind Co Ltd 積層セラミック体用内部電極ペースト
JPH01236513A (ja) * 1988-03-16 1989-09-21 Matsushita Electric Ind Co Ltd 積層セラミック体用内部電極ペースト
WO1991004650A1 (fr) * 1989-09-19 1991-04-04 Fujitsu Limited Composition ceramique de formation d'interconnexions
JPH0669651A (ja) * 1992-08-21 1994-03-11 Sumitomo Kinzoku Ceramics:Kk セラミックス回路基板の製造方法
JPH06290634A (ja) * 1993-03-31 1994-10-18 Miyoshi Denshi Kk 低温焼成銅組成物
JPH06349316A (ja) * 1993-06-11 1994-12-22 Tdk Corp 導電ペースト
JPH07192526A (ja) * 1993-12-27 1995-07-28 Nec Corp 導電体形成用ペースト
US6174462B1 (en) 1998-01-20 2001-01-16 Denso Corporation Conductive paste composition including conductive metallic powder
US6689296B2 (en) 2001-10-23 2004-02-10 Murata Manufacturing Co. Ltd Conductive paste
US6762369B2 (en) 2001-10-29 2004-07-13 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic substrate and method for manufacturing the same
JP2008106449A (ja) * 2006-10-23 2008-05-08 Mitsuba Corp 換気機能付きパワーウインドウシステム
US7817402B2 (en) 2005-03-31 2010-10-19 Tdk Corporation Multilayer ceramic electronic device and method of production of the same
US20170342528A1 (en) * 2011-06-30 2017-11-30 E I Du Pont De Nemours And Company Thick film paste and use thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268864A (ja) * 1985-09-19 1987-03-28 Matsushita Electric Ind Co Ltd 導電性塗料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6268864A (ja) * 1985-09-19 1987-03-28 Matsushita Electric Ind Co Ltd 導電性塗料

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236513A (ja) * 1988-03-16 1989-09-21 Matsushita Electric Ind Co Ltd 積層セラミック体用内部電極ペースト
JPH01236512A (ja) * 1988-03-16 1989-09-21 Matsushita Electric Ind Co Ltd 積層セラミック体用内部電極ペースト
US5443786A (en) * 1989-09-19 1995-08-22 Fujitsu Limited Composition for the formation of ceramic vias
WO1991004650A1 (fr) * 1989-09-19 1991-04-04 Fujitsu Limited Composition ceramique de formation d'interconnexions
JPH0669651A (ja) * 1992-08-21 1994-03-11 Sumitomo Kinzoku Ceramics:Kk セラミックス回路基板の製造方法
JPH06290634A (ja) * 1993-03-31 1994-10-18 Miyoshi Denshi Kk 低温焼成銅組成物
JPH06349316A (ja) * 1993-06-11 1994-12-22 Tdk Corp 導電ペースト
JPH07192526A (ja) * 1993-12-27 1995-07-28 Nec Corp 導電体形成用ペースト
US6174462B1 (en) 1998-01-20 2001-01-16 Denso Corporation Conductive paste composition including conductive metallic powder
US6689296B2 (en) 2001-10-23 2004-02-10 Murata Manufacturing Co. Ltd Conductive paste
US6762369B2 (en) 2001-10-29 2004-07-13 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic substrate and method for manufacturing the same
US7817402B2 (en) 2005-03-31 2010-10-19 Tdk Corporation Multilayer ceramic electronic device and method of production of the same
JP2008106449A (ja) * 2006-10-23 2008-05-08 Mitsuba Corp 換気機能付きパワーウインドウシステム
US20170342528A1 (en) * 2011-06-30 2017-11-30 E I Du Pont De Nemours And Company Thick film paste and use thereof
US10190198B2 (en) * 2011-06-30 2019-01-29 E I Du Pont De Nemours And Company Thick film paste and use thereof

Also Published As

Publication number Publication date
JPH0574166B2 (enrdf_load_stackoverflow) 1993-10-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees