JPS647542A - Formation of bump - Google Patents
Formation of bumpInfo
- Publication number
- JPS647542A JPS647542A JP62160922A JP16092287A JPS647542A JP S647542 A JPS647542 A JP S647542A JP 62160922 A JP62160922 A JP 62160922A JP 16092287 A JP16092287 A JP 16092287A JP S647542 A JPS647542 A JP S647542A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- bump
- film
- annealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160922A JPS647542A (en) | 1987-06-30 | 1987-06-30 | Formation of bump |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160922A JPS647542A (en) | 1987-06-30 | 1987-06-30 | Formation of bump |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647542A true JPS647542A (en) | 1989-01-11 |
Family
ID=15725189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62160922A Pending JPS647542A (en) | 1987-06-30 | 1987-06-30 | Formation of bump |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647542A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209725A (ja) * | 1990-01-11 | 1991-09-12 | Matsushita Electric Ind Co Ltd | 半導体装置の突起電極形成方法 |
US6103551A (en) * | 1996-03-06 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit and method for manufacturing the same |
JP2002151537A (ja) * | 2000-11-10 | 2002-05-24 | Nippon Steel Corp | 半導体素子のアンダーバンプメタルまたはバンプおよびその形成方法 |
DE10063914A1 (de) * | 2000-12-20 | 2002-07-25 | Pac Tech Gmbh | Kontakthöckeraufbau zur Herstellung eines Verbindungsaufbaus zwischen Substratanschlussflächen |
US6452280B1 (en) | 1996-03-06 | 2002-09-17 | Matsushita Electric Industrial Co., Ltd. | Flip chip semiconductor apparatus with projecting electrodes and method for producing same |
US6457233B1 (en) * | 1999-01-22 | 2002-10-01 | Fujitsu Limited | Solder bonding method, and process of making electronic device |
-
1987
- 1987-06-30 JP JP62160922A patent/JPS647542A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03209725A (ja) * | 1990-01-11 | 1991-09-12 | Matsushita Electric Ind Co Ltd | 半導体装置の突起電極形成方法 |
US6103551A (en) * | 1996-03-06 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit and method for manufacturing the same |
US6452280B1 (en) | 1996-03-06 | 2002-09-17 | Matsushita Electric Industrial Co., Ltd. | Flip chip semiconductor apparatus with projecting electrodes and method for producing same |
US6457233B1 (en) * | 1999-01-22 | 2002-10-01 | Fujitsu Limited | Solder bonding method, and process of making electronic device |
US6740823B2 (en) | 1999-01-22 | 2004-05-25 | Fujitsu Limited | Solder bonding method, and electronic device and process for fabricating the same |
JP2002151537A (ja) * | 2000-11-10 | 2002-05-24 | Nippon Steel Corp | 半導体素子のアンダーバンプメタルまたはバンプおよびその形成方法 |
DE10063914A1 (de) * | 2000-12-20 | 2002-07-25 | Pac Tech Gmbh | Kontakthöckeraufbau zur Herstellung eines Verbindungsaufbaus zwischen Substratanschlussflächen |
US7007834B2 (en) | 2000-12-20 | 2006-03-07 | PAC Tech—Packaging Technologies GmbH | Contact bump construction for the production of a connector construction for substrate connecting surfaces |
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