JPS646266Y2 - - Google Patents
Info
- Publication number
- JPS646266Y2 JPS646266Y2 JP1983159057U JP15905783U JPS646266Y2 JP S646266 Y2 JPS646266 Y2 JP S646266Y2 JP 1983159057 U JP1983159057 U JP 1983159057U JP 15905783 U JP15905783 U JP 15905783U JP S646266 Y2 JPS646266 Y2 JP S646266Y2
- Authority
- JP
- Japan
- Prior art keywords
- pot
- plunger
- resin material
- resin
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 29
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15905783U JPS6064818U (ja) | 1983-10-13 | 1983-10-13 | トランスフア−モ−ルド金型装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15905783U JPS6064818U (ja) | 1983-10-13 | 1983-10-13 | トランスフア−モ−ルド金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6064818U JPS6064818U (ja) | 1985-05-08 |
| JPS646266Y2 true JPS646266Y2 (US07655688-20100202-C00086.png) | 1989-02-17 |
Family
ID=30350244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15905783U Granted JPS6064818U (ja) | 1983-10-13 | 1983-10-13 | トランスフア−モ−ルド金型装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6064818U (US07655688-20100202-C00086.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0644581B2 (ja) * | 1986-06-27 | 1994-06-08 | 三菱電機株式会社 | 樹脂封止形半導体の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
-
1983
- 1983-10-13 JP JP15905783U patent/JPS6064818U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6064818U (ja) | 1985-05-08 |
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