JPS6448691A - Depth-control laser boring method and device - Google Patents

Depth-control laser boring method and device

Info

Publication number
JPS6448691A
JPS6448691A JP63176878A JP17687888A JPS6448691A JP S6448691 A JPS6448691 A JP S6448691A JP 63176878 A JP63176878 A JP 63176878A JP 17687888 A JP17687888 A JP 17687888A JP S6448691 A JPS6448691 A JP S6448691A
Authority
JP
Japan
Prior art keywords
laser beam
work piece
piercing
monitor
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63176878A
Other languages
English (en)
Other versions
JP2686470B2 (ja
Inventor
Henrii Kazunaa Uiriamu
Furankurin Roochi Jieemusu
Andoriyuu Tosu Binsento
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of JPS6448691A publication Critical patent/JPS6448691A/ja
Application granted granted Critical
Publication of JP2686470B2 publication Critical patent/JP2686470B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
JP63176878A 1987-07-15 1988-07-15 深さ制御レーザ穿孔方法及び装置 Expired - Lifetime JP2686470B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/073,610 US4789770A (en) 1987-07-15 1987-07-15 Controlled depth laser drilling system
US73.610 1987-07-15

Publications (2)

Publication Number Publication Date
JPS6448691A true JPS6448691A (en) 1989-02-23
JP2686470B2 JP2686470B2 (ja) 1997-12-08

Family

ID=22114730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63176878A Expired - Lifetime JP2686470B2 (ja) 1987-07-15 1988-07-15 深さ制御レーザ穿孔方法及び装置

Country Status (5)

Country Link
US (1) US4789770A (ja)
EP (1) EP0299702A1 (ja)
JP (1) JP2686470B2 (ja)
KR (1) KR0121792B1 (ja)
CA (1) CA1306019C (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284286A (ja) * 1988-09-21 1990-03-26 Inoue Japax Res Inc レーザー形成装置
JPH02182389A (ja) * 1988-10-28 1990-07-17 Internatl Business Mach Corp <Ibm> レーザによる切除方法
JPH0738374A (ja) * 1993-07-23 1995-02-07 Toko Inc セラミックフィルタとその製造方法
JPH0738364A (ja) * 1993-07-23 1995-02-07 Toko Inc セラミックフィルタの製造方法
JPH0711030U (ja) * 1993-07-23 1995-02-14 東光株式会社 セラミックフィルタ

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870244A (en) * 1988-10-07 1989-09-26 Copley John A Method and device for stand-off laser drilling and cutting
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5166493A (en) * 1989-01-10 1992-11-24 Canon Kabushiki Kaisha Apparatus and method of boring using laser
DE3908187A1 (de) * 1989-03-14 1990-09-20 Jurca Marius Christian Verfahren zur qualitaetssicherung beim laserstrahlschweissen und -schneiden
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
US4998005A (en) * 1989-05-15 1991-03-05 General Electric Company Machine vision system
US4995087A (en) * 1989-05-15 1991-02-19 General Electric Company Machine vision system
US5744776A (en) * 1989-07-14 1998-04-28 Tip Engineering Group, Inc. Apparatus and for laser preweakening an automotive trim cover for an air bag deployment opening
JP2761776B2 (ja) * 1989-10-25 1998-06-04 Ii Ai Deyuhon De Nimoasu Ando Co 多層回路板の製造方法
US5168454A (en) * 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
DE4024084A1 (de) * 1989-11-29 1991-06-06 Daimler Benz Ag Verfahren zum herstellen von hohlen gaswechselventilen fuer hubkolbenmaschinen
CA2031716C (en) * 1989-12-07 1996-06-18 Hiroaki Misawa Laser microprocessing and the device therefor
US5013886A (en) * 1990-07-23 1991-05-07 General Electric Company Real-time magnetic-flux breakthrough detection method and system for laser drilling
JPH04213867A (ja) * 1990-11-27 1992-08-04 Ibiden Co Ltd 電子部品搭載用基板フレーム
US5246576A (en) * 1990-12-10 1993-09-21 Ppg Industries, Inc. Cathode in a layered circuit and electrochemical cell for a measurement of oxygen in fluids
US5059761A (en) * 1990-12-21 1991-10-22 General Electric Company Inductive depth sensing and controlling method and system for laser drilling
AT399117B (de) * 1991-05-27 1995-03-27 Schuoecker Dieter Dipl Ing Dr Verfahren zur automatisierten qualitätskontrolle für die lasermaterialbearbeitung
GB9122010D0 (en) * 1991-10-15 1991-12-04 British Aerospace An apparatus for laser processing of composite structures
US5227606A (en) * 1992-02-26 1993-07-13 U.S. Amada Ltd. Method and apparatus for laser cutting of multiple stacked metal worksheets
US5367143A (en) * 1992-12-30 1994-11-22 International Business Machines Corporation Apparatus and method for multi-beam drilling
FR2708877B1 (fr) * 1993-08-12 1995-11-03 Onet Procédé et dispositif de décontamination autocontrôlé de surfaces par laser.
DE4333501C2 (de) * 1993-10-01 1998-04-09 Univ Stuttgart Strahlwerkzeuge Verfahren zur Bestimmung der momentanen und Herbeiführung einer gewünschten Eindringtiefe eines Bearbeitungslaserstrahles in ein Werkstück sowie Vorrichtung zur Durchführung dieses Verfahrens
GB9406605D0 (en) * 1994-04-05 1994-06-08 British Nuclear Fuels Plc Radiation beam position sensor
JP3179963B2 (ja) * 1994-04-26 2001-06-25 松下電器産業株式会社 レーザ加工装置とレーザ加工方法
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5562842A (en) * 1994-10-17 1996-10-08 Panasonic Technologies, Inc. Material treatment apparatus combining a laser diode and an illumination light with a video imaging system
US5541731A (en) * 1995-04-28 1996-07-30 International Business Machines Corporation Interferometric measurement and alignment technique for laser scanners
US5751588A (en) * 1995-04-28 1998-05-12 International Business Machines Corporation Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection
US5620618A (en) * 1995-04-28 1997-04-15 International Business Machines Corporation Multi-wavelength programmable laser processing mechanisms and apparatus
US5609778A (en) * 1995-06-02 1997-03-11 International Business Machines Corporation Process for high contrast marking on surfaces using lasers
US5806155A (en) * 1995-06-07 1998-09-15 International Paper Company Apparatus and method for hydraulic finishing of continuous filament fabrics
US6373026B1 (en) * 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
EP0861341A1 (en) * 1995-11-17 1998-09-02 International Paper Company Uniformity and product improvement in lyocell fabrics with hydraulic fluid treatment
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
US6631558B2 (en) * 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
AU3301197A (en) * 1996-06-05 1998-01-05 Larry W. Burgess Blind via laser drilling system
US5808268A (en) * 1996-07-23 1998-09-15 International Business Machines Corporation Method for marking substrates
DE19636429C1 (de) * 1996-09-07 1997-11-20 Jenoptik Jena Gmbh Verfahren zur Herstellung einer Schwächelinie mittels Laser
US6023041A (en) * 1996-11-08 2000-02-08 W.L. Gore & Associates, Inc. Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance
US5841102A (en) * 1996-11-08 1998-11-24 W. L. Gore & Associates, Inc. Multiple pulse space processing to enhance via entrance formation at 355 nm
US5879787A (en) * 1996-11-08 1999-03-09 W. L. Gore & Associates, Inc. Method and apparatus for improving wireability in chip modules
US5731047A (en) * 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
US6624382B2 (en) * 1997-01-30 2003-09-23 Anvik Corporation Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure
DE19719700A1 (de) * 1997-05-09 1998-11-12 Siemens Ag Verfahren zur Herstellung von Sacklöchern in einer Leiterplatte
US6054673A (en) * 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
GB9811328D0 (en) * 1998-05-27 1998-07-22 Exitech Ltd The use of mid-infrared lasers for drilling microvia holes in printed circuit (wiring) boards and other electrical circuit interconnection packages
DE19852302A1 (de) * 1998-11-12 2000-05-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mit Hochenergiestrahlung
JP2002542043A (ja) 1999-04-27 2002-12-10 ジーエスアイ ルモニクス インコーポレイテッド 多重レーザビームを使用する材料処理システム及び方法
US6791060B2 (en) * 1999-05-28 2004-09-14 Electro Scientific Industries, Inc. Beam shaping and projection imaging with solid state UV gaussian beam to form vias
TW482705B (en) * 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP3756723B2 (ja) * 1999-07-27 2006-03-15 松下電工株式会社 プリント配線板の加工方法
WO2001019146A1 (de) * 1999-09-06 2001-03-15 Siemens Aktiengesellschaft Verfahren zum bearbeiten von mehrschichtsubstraten
JP2003517931A (ja) * 1999-11-29 2003-06-03 シーメンス アクチエンゲゼルシヤフト サブストレートを加工する装置および当該装置を用いてサブストレートを加工する方法
CN100437407C (zh) 2000-01-11 2008-11-26 电子科学工业公司 阿贝误差校正系统及方法
US6541731B2 (en) * 2000-01-25 2003-04-01 Aculight Corporation Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates
AU2001250208A1 (en) 2000-04-11 2001-10-23 Gsi Lumonics Inc. A method and system for laser drilling
JP3522654B2 (ja) * 2000-06-09 2004-04-26 住友重機械工業株式会社 レーザ加工装置及び加工方法
DE10048636B4 (de) * 2000-09-27 2004-03-04 Jenoptik Aktiengesellschaft Fahrzeuginnenverkleidungsteil mit integrierter Airbagabdeckung und Verfahren zu dessen Herstellung
TW503143B (en) * 2000-10-06 2002-09-21 Hitachi Via Mechanics Ltd Method and apparatus for drilling printed wiring boards
DE10060407C2 (de) * 2000-12-05 2003-04-30 Lpkf Laser & Electronics Ag Vorrichtung zum Laserstrahlbohren
US6720567B2 (en) 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
KR100349885B1 (ko) * 2001-02-26 2002-08-24 티씨제이이십일세기종합상사 주식회사 장신구 외주면의 라운드 성형장치
WO2002074480A1 (en) 2001-03-16 2002-09-26 Laser Machining, Inc. Laser ablation technique
WO2002090037A1 (en) * 2001-05-09 2002-11-14 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity q-switched co2 laser pulses
KR100530818B1 (ko) * 2001-05-11 2005-11-25 미쓰비시덴키 가부시키가이샤 적층 재료의 레이저 가공 방법 및 장치
CN1308113C (zh) * 2001-07-02 2007-04-04 维蒂克激光系统公司 在坚硬的非金属基底内烧蚀开口的方法和装置
DE10201476B4 (de) * 2002-01-16 2005-02-24 Siemens Ag Laserbearbeitungsvorrichtung
EP1386690B1 (de) * 2002-08-01 2008-05-28 Trumpf Werkzeugmaschinen GmbH + Co. KG Laserbearbeitungsmaschine
US7060932B2 (en) 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7057134B2 (en) 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7286223B2 (en) * 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
WO2004105110A1 (ja) * 2003-05-22 2004-12-02 Tokyo Seimitsu Co., Ltd. レーザーダイシング装置
WO2005029928A2 (en) * 2003-09-19 2005-03-31 Viasystems Group, Inc. Closed loop backdrilling system
JPWO2005034595A1 (ja) * 2003-10-06 2006-12-21 新光電気工業株式会社 樹脂層へのビアホールの形成方法
DE10352402B4 (de) * 2003-11-10 2015-12-17 Lasertec Gmbh Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
GB0401441D0 (en) * 2004-01-21 2004-02-25 Hartley Richard Video signal processor
US20050169717A1 (en) * 2004-02-03 2005-08-04 Field Grant A. Electronic drill depth indicator
CA2479986A1 (fr) * 2004-09-14 2006-03-14 Vincent F. Treanton Fabrication de guides d`onde optique par ablation laser
US7501586B2 (en) * 2004-10-29 2009-03-10 Intel Corporation Apparatus and method for improving printed circuit board signal layer transitions
US20060096964A1 (en) * 2004-11-08 2006-05-11 Fordahl Craig A Method and apparatus for breakthrough detection for laser workpiece processing operations
CA2580102A1 (en) * 2006-03-06 2007-09-06 General Electric Company System and method for monitoring drilling process parameters and controlling drilling operation
US7970487B2 (en) * 2006-11-30 2011-06-28 National Optronics, Inc. Method of calibrating an ophthalmic processing device, machine programmed therefor, and computer program
US8212177B2 (en) * 2007-08-15 2012-07-03 Caterpillar Inc. Variable focus laser machining system
JP5193677B2 (ja) * 2008-05-15 2013-05-08 株式会社ミツトヨ レーザ加工装置
EP2681345B1 (fr) * 2011-03-01 2019-01-16 Safran Aircraft Engines Procede de realisation d'une piece metallique telle qu'un renfort d'aube de turbomachine
WO2012149379A2 (en) 2011-04-28 2012-11-01 Zin Technologies, Inc. Bonded and stitched composite structure
US20130288425A1 (en) * 2011-08-05 2013-10-31 Solexel, Inc. End point detection for back contact solar cell laser via drilling
US10239160B2 (en) * 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
CN102489876B (zh) * 2011-11-11 2014-06-25 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
US10149390B2 (en) 2012-08-27 2018-12-04 Mycronic AB Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
CN103731972B (zh) * 2012-10-15 2016-12-21 重庆方正高密电子有限公司 Pcb的钻孔深度的检测方法和pcb在制板
DE102012219196B3 (de) 2012-10-22 2014-02-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Bearbeitungsmaschine zum Einstechen, Bohren oder Schneiden metallischer Werkstücke
US9458728B2 (en) 2013-09-04 2016-10-04 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface by propagating energy through a multi-core fiber
US10589385B2 (en) * 2015-01-08 2020-03-17 General Electric Company Method and system for confined laser drilling
CN204913053U (zh) * 2015-08-28 2015-12-30 李俊豪 双向加工的激光机台
US10933490B2 (en) 2015-12-22 2021-03-02 Drilliant Ltd. Metal sublayer sensing in multi-layer workpiece hole drilling
DE102017107935B4 (de) * 2017-04-12 2020-10-01 Eissmann Automotive Deutschland Gmbh Verfahren zum Einbringen einer definierten Schwächungslinie durch Materialabtrag an einem Überzugsmaterial mit einem gepulsten Laserstrahl
CN107470786A (zh) * 2017-09-14 2017-12-15 深圳市牧激科技有限公司 多激光头装置
US10932370B2 (en) 2018-06-28 2021-02-23 Drilliant Ltd Metal sublayer sensing in multi-layer workpiece hole drilling
US11690177B2 (en) 2020-04-07 2023-06-27 Nextgin Technology Bv Methods and systems for back-drilling a multi-layer circuit board
DE102020113134A1 (de) * 2020-05-14 2021-11-18 Skybrain Vermögensverwaltungs Gmbh Bearbeitungsstation und Verfahren zur Bearbeitung von Werkstücken
CN114745871B (zh) * 2022-03-21 2024-01-26 江西福昌发电路科技有限公司 一种hdi线路板生产用激光钻孔除灰工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58205689A (ja) * 1982-05-24 1983-11-30 Hitachi Ltd レ−ザビ−ムの反射光量検出方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3485996A (en) * 1967-01-11 1969-12-23 Ibm Laser welding
US3689159A (en) * 1970-06-11 1972-09-05 Mitsubishi Electric Corp Laser processing apparatus
US4044222A (en) * 1976-01-16 1977-08-23 Western Electric Company, Inc. Method of forming tapered apertures in thin films with an energy beam
US4238741A (en) * 1977-12-22 1980-12-09 Westinghouse Electric Corp. Technique for generating 14 and 16 micron CO2 laser radiation
US4240094A (en) * 1978-03-20 1980-12-16 Harris Corporation Laser-configured logic array
US4544442A (en) * 1981-04-14 1985-10-01 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
GB2113592B (en) * 1982-01-21 1986-01-29 Preci Spark Ltd Laser machining apparatus
US4466739A (en) * 1982-02-26 1984-08-21 Kasner William H Laser beam alignment system
JPS5954488A (ja) * 1982-09-21 1984-03-29 Nippon Sekigaisen Kogyo Kk レ−ザ照射装置
US4532400A (en) * 1982-10-01 1985-07-30 Nippon Infrared Industries Co., Ltd. Laser irradiating apparatus
US4504727A (en) * 1982-12-30 1985-03-12 International Business Machines Corporation Laser drilling system utilizing photoacoustic feedback
US4501787A (en) * 1983-04-29 1985-02-26 Westinghouse Electric Corp. Flame retardant B-staged epoxy resin prepregs and laminates made therefrom
US4536108A (en) * 1983-05-23 1985-08-20 Federal-Mogul Corporation Flexible microdrill
US4695698A (en) * 1984-07-10 1987-09-22 Larassay Holding Ag Method of, and apparatus for, generating a predetermined pattern using laser radiation
US4695697A (en) * 1985-12-13 1987-09-22 Gv Medical, Inc. Fiber tip monitoring and protection assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58205689A (ja) * 1982-05-24 1983-11-30 Hitachi Ltd レ−ザビ−ムの反射光量検出方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284286A (ja) * 1988-09-21 1990-03-26 Inoue Japax Res Inc レーザー形成装置
JPH02182389A (ja) * 1988-10-28 1990-07-17 Internatl Business Mach Corp <Ibm> レーザによる切除方法
JPH0738374A (ja) * 1993-07-23 1995-02-07 Toko Inc セラミックフィルタとその製造方法
JPH0738364A (ja) * 1993-07-23 1995-02-07 Toko Inc セラミックフィルタの製造方法
JPH0711030U (ja) * 1993-07-23 1995-02-14 東光株式会社 セラミックフィルタ

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EP0299702A1 (en) 1989-01-18
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JP2686470B2 (ja) 1997-12-08
US4789770A (en) 1988-12-06
CA1306019C (en) 1992-08-04

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