JPS644417A - Laser processing method and its apparatus - Google Patents

Laser processing method and its apparatus

Info

Publication number
JPS644417A
JPS644417A JP62157899A JP15789987A JPS644417A JP S644417 A JPS644417 A JP S644417A JP 62157899 A JP62157899 A JP 62157899A JP 15789987 A JP15789987 A JP 15789987A JP S644417 A JPS644417 A JP S644417A
Authority
JP
Japan
Prior art keywords
laser beam
machined
slippage
detector
aligning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62157899A
Other languages
Japanese (ja)
Inventor
Mitsuo Sasaki
Suguru Nakamura
Hideyuki Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Shibaura Machine Co Ltd
Original Assignee
Toshiba Corp
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Machine Co Ltd filed Critical Toshiba Corp
Priority to JP62157899A priority Critical patent/JPS644417A/en
Publication of JPS644417A publication Critical patent/JPS644417A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To quench and cut off even corner part of a material to be machined having little thermal capacity while holding the shape, by beforehand executing test machining with laser beam at the time of quenching and cutting the material to be machined with laser beam and adjusting the relative position between the laser beam and the material to be machined based on slippage of the position after aligning the above position and the position of the material to be machined. CONSTITUTION:The material 7 to be machined is put on an XY table 9 and a nozzle 4 of the laser beam Q is descended with a Z axial shifting mechanism 8 and also the irradiating position of the laser beam Q is set to the corner part 21 of the material 7 to be machined by shifting the XY table to execute the test working. This is detected with a detector 12 of TV camera and by receiving the detected signal from a center position alignment part aligning visual field center of the detector and beam axis of the laser beam system 1 and at the time of forming of radiated part outputted from the detector, the center position of the radiated part is found. The slippage between the above position and the center position aligning with the position alignment part is calculated in a slippage calculating part 18 and the relative position between the laser beam system 1 and the material 7 to be machined is adjusted in accordance with the obtd. slippage and the center position of the quenched part is cut with the laser beam.
JP62157899A 1987-06-26 1987-06-26 Laser processing method and its apparatus Pending JPS644417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157899A JPS644417A (en) 1987-06-26 1987-06-26 Laser processing method and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157899A JPS644417A (en) 1987-06-26 1987-06-26 Laser processing method and its apparatus

Publications (1)

Publication Number Publication Date
JPS644417A true JPS644417A (en) 1989-01-09

Family

ID=15659857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157899A Pending JPS644417A (en) 1987-06-26 1987-06-26 Laser processing method and its apparatus

Country Status (1)

Country Link
JP (1) JPS644417A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04190990A (en) * 1990-11-27 1992-07-09 Toyota Motor Corp Device for correcting position in laser beam welding
KR100514095B1 (en) * 1998-12-04 2005-11-25 삼성전자주식회사 Laser cutting equipment and cutting path correction method using the same
KR100693945B1 (en) * 2006-01-23 2007-03-12 케이 이엔지(주) Infinity loop type laser beam cutting apparatus and cutting method using the same
JP2007152434A (en) * 2005-11-30 2007-06-21 General Electric Co <Ge> Laser shock peening system with time-of-flight monitoring
KR100788438B1 (en) * 2006-10-18 2007-12-24 박재현 Laser beam machining method and laserbeam machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04190990A (en) * 1990-11-27 1992-07-09 Toyota Motor Corp Device for correcting position in laser beam welding
KR100514095B1 (en) * 1998-12-04 2005-11-25 삼성전자주식회사 Laser cutting equipment and cutting path correction method using the same
JP2007152434A (en) * 2005-11-30 2007-06-21 General Electric Co <Ge> Laser shock peening system with time-of-flight monitoring
KR100693945B1 (en) * 2006-01-23 2007-03-12 케이 이엔지(주) Infinity loop type laser beam cutting apparatus and cutting method using the same
KR100788438B1 (en) * 2006-10-18 2007-12-24 박재현 Laser beam machining method and laserbeam machine

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