JPS5554290A - Surface treating device using pulse laser - Google Patents

Surface treating device using pulse laser

Info

Publication number
JPS5554290A
JPS5554290A JP12595578A JP12595578A JPS5554290A JP S5554290 A JPS5554290 A JP S5554290A JP 12595578 A JP12595578 A JP 12595578A JP 12595578 A JP12595578 A JP 12595578A JP S5554290 A JPS5554290 A JP S5554290A
Authority
JP
Japan
Prior art keywords
laser beam
laser
radiated
spot
light deflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12595578A
Other languages
Japanese (ja)
Other versions
JPS6139377B2 (en
Inventor
Kunihiko Washio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12595578A priority Critical patent/JPS5554290A/en
Publication of JPS5554290A publication Critical patent/JPS5554290A/en
Publication of JPS6139377B2 publication Critical patent/JPS6139377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing

Abstract

PURPOSE:To prevent trace cut of surface treatment by deflecting a laser beam through the use of a light deflector during single pulse laser oscillation sustaining time and linearly scanning sample surface while allowing the same to melt. CONSTITUTION:When laser pulses of the waveform close to a square from are oscillated from an oscillator 1 by a power source 2 provided with a pulse shaping circuit, they are radiated to the surface 5 on a fine-adjusting state 6 by a condenser optical device 4 to instantaneously heat the surface layer to a high temperature in the spot part where the laser beam is condensed. During the oscillation sustaining time of a single pulse, a light deflector 3 scans the laser beam in the determined direction. At this time, the scanning speed is adjusted to the extent that the spot region having been radiated begins to solidify when the laser beam has finished moving by about the spot diameter. This method enables the strain and impurities on the sample surface to be moved efficiently in one direction.
JP12595578A 1978-10-12 1978-10-12 Surface treating device using pulse laser Granted JPS5554290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12595578A JPS5554290A (en) 1978-10-12 1978-10-12 Surface treating device using pulse laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12595578A JPS5554290A (en) 1978-10-12 1978-10-12 Surface treating device using pulse laser

Publications (2)

Publication Number Publication Date
JPS5554290A true JPS5554290A (en) 1980-04-21
JPS6139377B2 JPS6139377B2 (en) 1986-09-03

Family

ID=14923101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12595578A Granted JPS5554290A (en) 1978-10-12 1978-10-12 Surface treating device using pulse laser

Country Status (1)

Country Link
JP (1) JPS5554290A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916923A (en) * 1982-02-22 1984-01-28 Toyota Motor Corp Method for hardening surface of metal member by remelting
JPS62142716A (en) * 1985-12-17 1987-06-26 Sanyo Electric Co Ltd Laser beam processing machine
WO2006057856A2 (en) 2004-11-17 2006-06-01 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
WO2012167999A1 (en) * 2011-06-09 2012-12-13 Cero Gmbh Method and device for machining a workpiece by means of scanned pulsed laser

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01228742A (en) * 1988-03-09 1989-09-12 Honda Lock Mfg Co Ltd Assembly line composed of combined working benches and working bench therefor
JPH0231683U (en) * 1988-08-22 1990-02-28

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916923A (en) * 1982-02-22 1984-01-28 Toyota Motor Corp Method for hardening surface of metal member by remelting
JPH032923B2 (en) * 1982-02-22 1991-01-17 Toyota Motor Co Ltd
JPS62142716A (en) * 1985-12-17 1987-06-26 Sanyo Electric Co Ltd Laser beam processing machine
WO2006057856A2 (en) 2004-11-17 2006-06-01 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
EP1812195A2 (en) * 2004-11-17 2007-08-01 Metal Improvement Company, LLC. Active beam delivery system for laser peening and laser peening method
EP1812195A4 (en) * 2004-11-17 2011-10-19 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
WO2012167999A1 (en) * 2011-06-09 2012-12-13 Cero Gmbh Method and device for machining a workpiece by means of scanned pulsed laser

Also Published As

Publication number Publication date
JPS6139377B2 (en) 1986-09-03

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