JPS6441297A - Manufacture of wiring board - Google Patents

Manufacture of wiring board

Info

Publication number
JPS6441297A
JPS6441297A JP62196161A JP19616187A JPS6441297A JP S6441297 A JPS6441297 A JP S6441297A JP 62196161 A JP62196161 A JP 62196161A JP 19616187 A JP19616187 A JP 19616187A JP S6441297 A JPS6441297 A JP S6441297A
Authority
JP
Japan
Prior art keywords
conductor patterns
insulation substrate
conductive layer
etching
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62196161A
Other languages
Japanese (ja)
Inventor
Satoru Ishihara
Toshito Nishiyama
Hiroshi Watanabe
Masato Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP62196161A priority Critical patent/JPS6441297A/en
Publication of JPS6441297A publication Critical patent/JPS6441297A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PURPOSE:To increase a surface insulation resistance between wiring patterns, by etching a conductive layer piled on an insulation substrate to form conductor patterns and next etching a surface phase of the insulation substrate exposed between the conductor patterns. CONSTITUTION:A conductive layer piled on an insulation substrate by vacuum evaporation, sputtering, plating, or the like is etched to form conductor patterns, and next a surface phase of the insulation substrate between the conductor patterns is etched by a wet type etching liquid or by gas plasma. Since various conductive impurities formed between the conductor patterns upon the piling of said conductive layer can be removed in this way, surface insulation resistance between the conductor patterns can be increased.
JP62196161A 1987-08-07 1987-08-07 Manufacture of wiring board Pending JPS6441297A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196161A JPS6441297A (en) 1987-08-07 1987-08-07 Manufacture of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196161A JPS6441297A (en) 1987-08-07 1987-08-07 Manufacture of wiring board

Publications (1)

Publication Number Publication Date
JPS6441297A true JPS6441297A (en) 1989-02-13

Family

ID=16353222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196161A Pending JPS6441297A (en) 1987-08-07 1987-08-07 Manufacture of wiring board

Country Status (1)

Country Link
JP (1) JPS6441297A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board
EP1670297A2 (en) * 2004-11-26 2006-06-14 Nitto Denko Corporation Printed circuit board and manufacturing method thereof
JP2015130230A (en) * 2015-03-27 2015-07-16 大日本印刷株式会社 Substrate for suspension, suspension, suspension with element, and hard disk drive
WO2021005864A1 (en) * 2019-07-09 2021-01-14 日東電工株式会社 Wiring circuit board and method for manufacturing wiring circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09181423A (en) * 1990-04-16 1997-07-11 Denki Kagaku Kogyo Kk Ceramic circuit board
EP1670297A2 (en) * 2004-11-26 2006-06-14 Nitto Denko Corporation Printed circuit board and manufacturing method thereof
JP2015130230A (en) * 2015-03-27 2015-07-16 大日本印刷株式会社 Substrate for suspension, suspension, suspension with element, and hard disk drive
WO2021005864A1 (en) * 2019-07-09 2021-01-14 日東電工株式会社 Wiring circuit board and method for manufacturing wiring circuit board
JP2021012984A (en) * 2019-07-09 2021-02-04 日東電工株式会社 Wiring circuit board and manufacturing method of wiring circuit board

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