JPS5534651A - Structure of primary layer of plated film - Google Patents
Structure of primary layer of plated filmInfo
- Publication number
- JPS5534651A JPS5534651A JP10683278A JP10683278A JPS5534651A JP S5534651 A JPS5534651 A JP S5534651A JP 10683278 A JP10683278 A JP 10683278A JP 10683278 A JP10683278 A JP 10683278A JP S5534651 A JPS5534651 A JP S5534651A
- Authority
- JP
- Japan
- Prior art keywords
- film
- plated
- specific resistance
- stepped part
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To make sound the coated film on the stepped part through improvement of the shape of the stepped part of the conductive plated film, by forming the primary layer of the plated film into a multilayer structure consisting of two or more layers, and by specifying the specific resistance of each layer different from other layers.
CONSTITUTION: The first conductive film 7 of specific resistance ρ higher than that of Cu, Au, etc., for exampld Fe, Ni, film, etc., is formed on the substrate 1 by the vacuum evaporation method. The second conductive film 8 of low specific resistance like as Cu, Au, etc., is vacuum evaporated on this film 7. Furthermore, by chemical etching method, etc., the films 7, 8, being unnecessary to be plated, are seletively etched and removed using the etching solution which may develop the higher etching velocity for the film 8 than for the film 7. Next, the conductive plated film 3 is formed on these films 7, 8, being shaped into a step. As a result, the film 8 of specific resistance ρ lower than that of the film 7 is plated thicker, and the plated layer at the exposed end face of the film 7 is formed thin. Accordingly, the inclination of end of the film 3 is made gentle, and the insulation film 4 for coating the stepped part of the film 3 is scarcely broken, and the stepped part can be satisfactorily coated with the layer as thin as a quarter or so of thickness of the film 3.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10683278A JPS6056237B2 (en) | 1978-08-30 | 1978-08-30 | Base layer structure of plating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10683278A JPS6056237B2 (en) | 1978-08-30 | 1978-08-30 | Base layer structure of plating film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5534651A true JPS5534651A (en) | 1980-03-11 |
JPS6056237B2 JPS6056237B2 (en) | 1985-12-09 |
Family
ID=14443705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10683278A Expired JPS6056237B2 (en) | 1978-08-30 | 1978-08-30 | Base layer structure of plating film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6056237B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6257137U (en) * | 1985-09-28 | 1987-04-09 | ||
JPS62192225U (en) * | 1986-05-28 | 1987-12-07 | ||
JPS63228032A (en) * | 1987-03-16 | 1988-09-22 | Shimadzu Corp | Electronic balance |
-
1978
- 1978-08-30 JP JP10683278A patent/JPS6056237B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6056237B2 (en) | 1985-12-09 |
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