JPS5534651A - Structure of primary layer of plated film - Google Patents

Structure of primary layer of plated film

Info

Publication number
JPS5534651A
JPS5534651A JP10683278A JP10683278A JPS5534651A JP S5534651 A JPS5534651 A JP S5534651A JP 10683278 A JP10683278 A JP 10683278A JP 10683278 A JP10683278 A JP 10683278A JP S5534651 A JPS5534651 A JP S5534651A
Authority
JP
Japan
Prior art keywords
film
plated
specific resistance
stepped part
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10683278A
Other languages
Japanese (ja)
Other versions
JPS6056237B2 (en
Inventor
Koji Otsuka
Toru Kira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10683278A priority Critical patent/JPS6056237B2/en
Publication of JPS5534651A publication Critical patent/JPS5534651A/en
Publication of JPS6056237B2 publication Critical patent/JPS6056237B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To make sound the coated film on the stepped part through improvement of the shape of the stepped part of the conductive plated film, by forming the primary layer of the plated film into a multilayer structure consisting of two or more layers, and by specifying the specific resistance of each layer different from other layers.
CONSTITUTION: The first conductive film 7 of specific resistance ρ higher than that of Cu, Au, etc., for exampld Fe, Ni, film, etc., is formed on the substrate 1 by the vacuum evaporation method. The second conductive film 8 of low specific resistance like as Cu, Au, etc., is vacuum evaporated on this film 7. Furthermore, by chemical etching method, etc., the films 7, 8, being unnecessary to be plated, are seletively etched and removed using the etching solution which may develop the higher etching velocity for the film 8 than for the film 7. Next, the conductive plated film 3 is formed on these films 7, 8, being shaped into a step. As a result, the film 8 of specific resistance ρ lower than that of the film 7 is plated thicker, and the plated layer at the exposed end face of the film 7 is formed thin. Accordingly, the inclination of end of the film 3 is made gentle, and the insulation film 4 for coating the stepped part of the film 3 is scarcely broken, and the stepped part can be satisfactorily coated with the layer as thin as a quarter or so of thickness of the film 3.
COPYRIGHT: (C)1980,JPO&Japio
JP10683278A 1978-08-30 1978-08-30 Base layer structure of plating film Expired JPS6056237B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10683278A JPS6056237B2 (en) 1978-08-30 1978-08-30 Base layer structure of plating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10683278A JPS6056237B2 (en) 1978-08-30 1978-08-30 Base layer structure of plating film

Publications (2)

Publication Number Publication Date
JPS5534651A true JPS5534651A (en) 1980-03-11
JPS6056237B2 JPS6056237B2 (en) 1985-12-09

Family

ID=14443705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10683278A Expired JPS6056237B2 (en) 1978-08-30 1978-08-30 Base layer structure of plating film

Country Status (1)

Country Link
JP (1) JPS6056237B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6257137U (en) * 1985-09-28 1987-04-09
JPS62192225U (en) * 1986-05-28 1987-12-07
JPS63228032A (en) * 1987-03-16 1988-09-22 Shimadzu Corp Electronic balance

Also Published As

Publication number Publication date
JPS6056237B2 (en) 1985-12-09

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