JPS5534650A - Forming method for conductive plated film - Google Patents

Forming method for conductive plated film

Info

Publication number
JPS5534650A
JPS5534650A JP10683178A JP10683178A JPS5534650A JP S5534650 A JPS5534650 A JP S5534650A JP 10683178 A JP10683178 A JP 10683178A JP 10683178 A JP10683178 A JP 10683178A JP S5534650 A JPS5534650 A JP S5534650A
Authority
JP
Japan
Prior art keywords
film
plated
conductive
stepped part
specific resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10683178A
Other languages
Japanese (ja)
Other versions
JPS5856760B2 (en
Inventor
Koji Otsuka
Toru Kira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10683178A priority Critical patent/JPS5856760B2/en
Publication of JPS5534650A publication Critical patent/JPS5534650A/en
Publication of JPS5856760B2 publication Critical patent/JPS5856760B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To make sound the coat for the stepped part through improvement of the shape of this stepped part to be plated with the conductive plated film, by making the base layer of the plated film to be the multilayer structure consisting of two or more layers, and by specifying the specific resistance of each layer to different values.
CONSTITUTION: The first conductive film 7, the film of Fe, Mn, etc., for example, possessing higher specific resistance ρ than Cu, Au, etc., are formed on the substrate 1 by means of the vacuum evaporation method. Next, on this first film 7, the second conductive film 8 of low specific resistance being made of Cu, Au, etc. is formed by the vacuum evaporation method. An etching solution, which develops the etching speed higher for the film 8 and lower for the film 7, is employed in the chemical etching method, etc., in order to selectively etch the film 7, 8, unnecessary to be plated, and the films 7, 8, are formed into a stepped shape. Then, the conductive plated film 3 is formed on these films 7, 8, by the plating method. As a result, the angle of inclination at the end of the film 3 becomes gentle. Accordingly, the insulation film 4 for coating the stepped part of the film 3 is scarcely broken, so that the stepped part can be satisfactorily coated with so thin insulation film 4 as quarter or so of thickness of the film 3.
COPYRIGHT: (C)1980,JPO&Japio
JP10683178A 1978-08-30 1978-08-30 Method for producing conductive plating film Expired JPS5856760B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10683178A JPS5856760B2 (en) 1978-08-30 1978-08-30 Method for producing conductive plating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10683178A JPS5856760B2 (en) 1978-08-30 1978-08-30 Method for producing conductive plating film

Publications (2)

Publication Number Publication Date
JPS5534650A true JPS5534650A (en) 1980-03-11
JPS5856760B2 JPS5856760B2 (en) 1983-12-16

Family

ID=14443683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10683178A Expired JPS5856760B2 (en) 1978-08-30 1978-08-30 Method for producing conductive plating film

Country Status (1)

Country Link
JP (1) JPS5856760B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768749A (en) * 1980-10-17 1982-04-27 Niku No Mansei:Kk Drawing method of dough for chinese noodle, buckwheat vermicelli and wheat vermicelli under low applied pressure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768749A (en) * 1980-10-17 1982-04-27 Niku No Mansei:Kk Drawing method of dough for chinese noodle, buckwheat vermicelli and wheat vermicelli under low applied pressure

Also Published As

Publication number Publication date
JPS5856760B2 (en) 1983-12-16

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