JPS5534650A - Forming method for conductive plated film - Google Patents
Forming method for conductive plated filmInfo
- Publication number
- JPS5534650A JPS5534650A JP10683178A JP10683178A JPS5534650A JP S5534650 A JPS5534650 A JP S5534650A JP 10683178 A JP10683178 A JP 10683178A JP 10683178 A JP10683178 A JP 10683178A JP S5534650 A JPS5534650 A JP S5534650A
- Authority
- JP
- Japan
- Prior art keywords
- film
- plated
- conductive
- stepped part
- specific resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To make sound the coat for the stepped part through improvement of the shape of this stepped part to be plated with the conductive plated film, by making the base layer of the plated film to be the multilayer structure consisting of two or more layers, and by specifying the specific resistance of each layer to different values.
CONSTITUTION: The first conductive film 7, the film of Fe, Mn, etc., for example, possessing higher specific resistance ρ than Cu, Au, etc., are formed on the substrate 1 by means of the vacuum evaporation method. Next, on this first film 7, the second conductive film 8 of low specific resistance being made of Cu, Au, etc. is formed by the vacuum evaporation method. An etching solution, which develops the etching speed higher for the film 8 and lower for the film 7, is employed in the chemical etching method, etc., in order to selectively etch the film 7, 8, unnecessary to be plated, and the films 7, 8, are formed into a stepped shape. Then, the conductive plated film 3 is formed on these films 7, 8, by the plating method. As a result, the angle of inclination at the end of the film 3 becomes gentle. Accordingly, the insulation film 4 for coating the stepped part of the film 3 is scarcely broken, so that the stepped part can be satisfactorily coated with so thin insulation film 4 as quarter or so of thickness of the film 3.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10683178A JPS5856760B2 (en) | 1978-08-30 | 1978-08-30 | Method for producing conductive plating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10683178A JPS5856760B2 (en) | 1978-08-30 | 1978-08-30 | Method for producing conductive plating film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5534650A true JPS5534650A (en) | 1980-03-11 |
JPS5856760B2 JPS5856760B2 (en) | 1983-12-16 |
Family
ID=14443683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10683178A Expired JPS5856760B2 (en) | 1978-08-30 | 1978-08-30 | Method for producing conductive plating film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5856760B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768749A (en) * | 1980-10-17 | 1982-04-27 | Niku No Mansei:Kk | Drawing method of dough for chinese noodle, buckwheat vermicelli and wheat vermicelli under low applied pressure |
-
1978
- 1978-08-30 JP JP10683178A patent/JPS5856760B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768749A (en) * | 1980-10-17 | 1982-04-27 | Niku No Mansei:Kk | Drawing method of dough for chinese noodle, buckwheat vermicelli and wheat vermicelli under low applied pressure |
Also Published As
Publication number | Publication date |
---|---|
JPS5856760B2 (en) | 1983-12-16 |
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