JPS6471151A - Anti-oxididation of copper wiring - Google Patents

Anti-oxididation of copper wiring

Info

Publication number
JPS6471151A
JPS6471151A JP22642287A JP22642287A JPS6471151A JP S6471151 A JPS6471151 A JP S6471151A JP 22642287 A JP22642287 A JP 22642287A JP 22642287 A JP22642287 A JP 22642287A JP S6471151 A JPS6471151 A JP S6471151A
Authority
JP
Japan
Prior art keywords
laminated structure
layer laminated
copper
titanium
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22642287A
Other languages
Japanese (ja)
Inventor
Kazuhiro Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22642287A priority Critical patent/JPS6471151A/en
Publication of JPS6471151A publication Critical patent/JPS6471151A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent the oxidation of a Cu surface by coating the upper section of three layer laminated structure, to which etching is completed, with a copper anti-oxidizing film without exposing three layer laminated structure. CONSTITUTION:Titanium 12/titanium nitride 13 as the foundation of copper 14 in the three layer laminated structure of titanium 12/titanium nitride 13/copper 14 deposited onto a foundation 11 are etched through reactive ion etching, and a copper wiring is formed. The upper section of three layer laminated structure 12, 13, 14 is coated with a copper anti-oxidizing film 17 without exposing the three layer laminated structure, to which etching is completed, in atmospheric air at that time. Accordingly, even when the three layer laminated structure 12, 13, 14 is returned in atmospheric air, the oxidation of the surface of the Cu 14 is prevented.
JP22642287A 1987-09-11 1987-09-11 Anti-oxididation of copper wiring Pending JPS6471151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22642287A JPS6471151A (en) 1987-09-11 1987-09-11 Anti-oxididation of copper wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22642287A JPS6471151A (en) 1987-09-11 1987-09-11 Anti-oxididation of copper wiring

Publications (1)

Publication Number Publication Date
JPS6471151A true JPS6471151A (en) 1989-03-16

Family

ID=16844875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22642287A Pending JPS6471151A (en) 1987-09-11 1987-09-11 Anti-oxididation of copper wiring

Country Status (1)

Country Link
JP (1) JPS6471151A (en)

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