JPS6436069A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6436069A JPS6436069A JP62190095A JP19009587A JPS6436069A JP S6436069 A JPS6436069 A JP S6436069A JP 62190095 A JP62190095 A JP 62190095A JP 19009587 A JP19009587 A JP 19009587A JP S6436069 A JPS6436069 A JP S6436069A
- Authority
- JP
- Japan
- Prior art keywords
- type
- epitaxial layer
- layer
- sih4
- resistivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To realize the growth of an epitaxial layer preventive of an increase in resistivity, by forming a first epitaxial layer of an opposite conductivity type on a semiconductor substrate and next forming a second epitaxial layer thereon, which is of the opposite conductivity type and higher in its resistivity than the first epitaxial layer. CONSTITUTION:P(phosphorus) ions are implanted on a T-PNP transistor formation part from a surface of a P<-> type substrate 1 to form an N type first buried layer 2. Next, Sb(antimony) or As(arsenic) is diffused into an NPN transistor part to form an N<+> type second buried layer 3. Further, BCl3(boron chloride) is diffused into a T-PNP transistor part and an isolation region part to form a P<+> type third burial layer 4. Next an SiH4 heat decomposition reaction is used to make an N<-> type first epitaxial layer 5A grow. In succession the SiH4 heat decomposition reaction of 1050 deg.C or so is also used to make an N<-> type second epitaxial layer 5B of 3OMEGAcm or more grow in an appropriate thickness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62190095A JPH0695522B2 (en) | 1987-07-31 | 1987-07-31 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62190095A JPH0695522B2 (en) | 1987-07-31 | 1987-07-31 | Method for manufacturing semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6436069A true JPS6436069A (en) | 1989-02-07 |
JPH0695522B2 JPH0695522B2 (en) | 1994-11-24 |
Family
ID=16252286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62190095A Expired - Lifetime JPH0695522B2 (en) | 1987-07-31 | 1987-07-31 | Method for manufacturing semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0695522B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04297062A (en) * | 1991-03-13 | 1992-10-21 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
US6593629B2 (en) * | 2000-12-28 | 2003-07-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JP2007180472A (en) * | 2005-11-30 | 2007-07-12 | Sanyo Electric Co Ltd | Semiconductor device and its fabrication process |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102263A (en) * | 1980-01-21 | 1980-08-05 | Nec Corp | Semiconductor integrated circuit |
JPS5698857A (en) * | 1980-01-10 | 1981-08-08 | Mitsubishi Electric Corp | Complex integrated circuit device |
-
1987
- 1987-07-31 JP JP62190095A patent/JPH0695522B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698857A (en) * | 1980-01-10 | 1981-08-08 | Mitsubishi Electric Corp | Complex integrated circuit device |
JPS55102263A (en) * | 1980-01-21 | 1980-08-05 | Nec Corp | Semiconductor integrated circuit |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04297062A (en) * | 1991-03-13 | 1992-10-21 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
US6593629B2 (en) * | 2000-12-28 | 2003-07-15 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JP2007180472A (en) * | 2005-11-30 | 2007-07-12 | Sanyo Electric Co Ltd | Semiconductor device and its fabrication process |
Also Published As
Publication number | Publication date |
---|---|
JPH0695522B2 (en) | 1994-11-24 |
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