JPS6423543A - Soldering by use of laser - Google Patents

Soldering by use of laser

Info

Publication number
JPS6423543A
JPS6423543A JP62179084A JP17908487A JPS6423543A JP S6423543 A JPS6423543 A JP S6423543A JP 62179084 A JP62179084 A JP 62179084A JP 17908487 A JP17908487 A JP 17908487A JP S6423543 A JPS6423543 A JP S6423543A
Authority
JP
Japan
Prior art keywords
fpc
bumps
pressure
soldering
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62179084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468778B2 (cg-RX-API-DMAC10.html
Inventor
Katsumichi Kamiyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP62179084A priority Critical patent/JPS6423543A/ja
Publication of JPS6423543A publication Critical patent/JPS6423543A/ja
Publication of JPH0468778B2 publication Critical patent/JPH0468778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP62179084A 1987-07-20 1987-07-20 Soldering by use of laser Granted JPS6423543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62179084A JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62179084A JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Publications (2)

Publication Number Publication Date
JPS6423543A true JPS6423543A (en) 1989-01-26
JPH0468778B2 JPH0468778B2 (cg-RX-API-DMAC10.html) 1992-11-04

Family

ID=16059801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179084A Granted JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Country Status (1)

Country Link
JP (1) JPS6423543A (cg-RX-API-DMAC10.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247076A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd レーザはんだ付け装置
JPH05315391A (ja) * 1992-05-08 1993-11-26 Matsushita Electric Ind Co Ltd Ｉｃ部品のリード接合方法
FR2860945A1 (fr) * 2003-10-14 2005-04-15 Conti Temic Microelectronic Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes
JP2007243005A (ja) * 2006-03-10 2007-09-20 Ricoh Microelectronics Co Ltd 電極接合方法及びその装置
WO2015053108A1 (ja) * 2013-10-07 2015-04-16 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2021102217A (ja) * 2019-12-25 2021-07-15 株式会社ディスコ レーザーリフロー装置、及び、レーザーリフロー方法
JP2025111666A (ja) * 2019-11-21 2025-07-30 レーザーセル カンパニー リミテッド レーザリフロー方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247076A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd レーザはんだ付け装置
JPH05315391A (ja) * 1992-05-08 1993-11-26 Matsushita Electric Ind Co Ltd Ｉｃ部品のリード接合方法
FR2860945A1 (fr) * 2003-10-14 2005-04-15 Conti Temic Microelectronic Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes
JP2007243005A (ja) * 2006-03-10 2007-09-20 Ricoh Microelectronics Co Ltd 電極接合方法及びその装置
WO2015053108A1 (ja) * 2013-10-07 2015-04-16 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2015075146A (ja) * 2013-10-07 2015-04-20 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2025111666A (ja) * 2019-11-21 2025-07-30 レーザーセル カンパニー リミテッド レーザリフロー方法
JP2021102217A (ja) * 2019-12-25 2021-07-15 株式会社ディスコ レーザーリフロー装置、及び、レーザーリフロー方法

Also Published As

Publication number Publication date
JPH0468778B2 (cg-RX-API-DMAC10.html) 1992-11-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term