JPS6423543A - Soldering by use of laser - Google Patents

Soldering by use of laser

Info

Publication number
JPS6423543A
JPS6423543A JP62179084A JP17908487A JPS6423543A JP S6423543 A JPS6423543 A JP S6423543A JP 62179084 A JP62179084 A JP 62179084A JP 17908487 A JP17908487 A JP 17908487A JP S6423543 A JPS6423543 A JP S6423543A
Authority
JP
Japan
Prior art keywords
fpc
bumps
pressure
soldering
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62179084A
Other languages
English (en)
Other versions
JPH0468778B2 (ja
Inventor
Katsumichi Kamiyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP62179084A priority Critical patent/JPS6423543A/ja
Publication of JPS6423543A publication Critical patent/JPS6423543A/ja
Publication of JPH0468778B2 publication Critical patent/JPH0468778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP62179084A 1987-07-20 1987-07-20 Soldering by use of laser Granted JPS6423543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62179084A JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62179084A JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Publications (2)

Publication Number Publication Date
JPS6423543A true JPS6423543A (en) 1989-01-26
JPH0468778B2 JPH0468778B2 (ja) 1992-11-04

Family

ID=16059801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62179084A Granted JPS6423543A (en) 1987-07-20 1987-07-20 Soldering by use of laser

Country Status (1)

Country Link
JP (1) JPS6423543A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247076A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd レーザはんだ付け装置
JPH05315391A (ja) * 1992-05-08 1993-11-26 Matsushita Electric Ind Co Ltd Ｉｃ部品のリード接合方法
FR2860945A1 (fr) * 2003-10-14 2005-04-15 Conti Temic Microelectronic Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes
JP2007243005A (ja) * 2006-03-10 2007-09-20 Ricoh Microelectronics Co Ltd 電極接合方法及びその装置
WO2015053108A1 (ja) * 2013-10-07 2015-04-16 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2021102217A (ja) * 2019-12-25 2021-07-15 株式会社ディスコ レーザーリフロー装置、及び、レーザーリフロー方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247076A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd レーザはんだ付け装置
JPH05315391A (ja) * 1992-05-08 1993-11-26 Matsushita Electric Ind Co Ltd Ｉｃ部品のリード接合方法
FR2860945A1 (fr) * 2003-10-14 2005-04-15 Conti Temic Microelectronic Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes
JP2007243005A (ja) * 2006-03-10 2007-09-20 Ricoh Microelectronics Co Ltd 電極接合方法及びその装置
WO2015053108A1 (ja) * 2013-10-07 2015-04-16 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2015075146A (ja) * 2013-10-07 2015-04-20 株式会社ミマキエンジニアリング 圧力緩衝器の製造方法
JP2021102217A (ja) * 2019-12-25 2021-07-15 株式会社ディスコ レーザーリフロー装置、及び、レーザーリフロー方法

Also Published As

Publication number Publication date
JPH0468778B2 (ja) 1992-11-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term