JPS6419765A - Manufacture of semiconductor integrated circuit device - Google Patents

Manufacture of semiconductor integrated circuit device

Info

Publication number
JPS6419765A
JPS6419765A JP17462187A JP17462187A JPS6419765A JP S6419765 A JPS6419765 A JP S6419765A JP 17462187 A JP17462187 A JP 17462187A JP 17462187 A JP17462187 A JP 17462187A JP S6419765 A JPS6419765 A JP S6419765A
Authority
JP
Japan
Prior art keywords
sidewalls
insulating film
film
high dimensional
dimensional controllability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17462187A
Other languages
Japanese (ja)
Inventor
Nobuo Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17462187A priority Critical patent/JPS6419765A/en
Publication of JPS6419765A publication Critical patent/JPS6419765A/en
Pending legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To form an emitter region and graft base regions in a manner of self- alignment and high dimensional controllability, by a method wherein sidewalls are formed on the side surfaces of a prescribed step pattern and an thermal oxidation is performed using this step pattern and these sidewalls as oxide masks to form an insulating film. CONSTITUTION:An insulating film (anti-oxidation film) 8 is, formed on the whole surface and after an insulating film 9 is formed, this film 9 is anisotropically etched and an insulating film 9 (a step pattern) of a prescribed form having side surfaces vertical to the surface of a p<+> semiconductor substrate 1 is formed. Then, an insulating film is formed on the whole surface and this insulating film is subjected to anisotropic etching to form sidewalls 11 consisting of an insulator. The width of these sidewalls 11 can be decided in a high dimensional controllability by selecting the thickness of the insulating film. Then, the insulating films 10 and 8 and an insulating film 6 are etched using the sidewalls 11, the film 9 and so on as masks to expose partially an epitaxial layer 3, insulating films are formed in order on the whole surface and an anisotropic etching is performed to form sidewalls 13 consisting of an insulator. As the width of these sidewalls 13 can be also decided in a manner of high dimensional controllability like that of the sidewalls 11, p<+> graft base regions 15 can be formed in a manner of high dimensional controllability.
JP17462187A 1987-07-15 1987-07-15 Manufacture of semiconductor integrated circuit device Pending JPS6419765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17462187A JPS6419765A (en) 1987-07-15 1987-07-15 Manufacture of semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17462187A JPS6419765A (en) 1987-07-15 1987-07-15 Manufacture of semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6419765A true JPS6419765A (en) 1989-01-23

Family

ID=15981794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17462187A Pending JPS6419765A (en) 1987-07-15 1987-07-15 Manufacture of semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6419765A (en)

Similar Documents

Publication Publication Date Title
MY124777A (en) Process for producing semiconductor device and semiconductor device produced thereby
WO1996004674A3 (en) A self-aligned gate field emitter device and methods for producing the same
EP0029552A3 (en) Method for producing a semiconductor device
JPS6419765A (en) Manufacture of semiconductor integrated circuit device
JPS57154855A (en) Manufacture of semiconductor device
EP0239384A3 (en) Process for isolating semiconductor devices on a substrate
JPS57204144A (en) Insulating and isolating method for semiconductor integrated circuit
JPS5515230A (en) Semiconductor device and its manufacturing method
JPS5550636A (en) Preparation of semiconductor device
JPS649639A (en) Manufacture of insulating film for element isolation of semiconductor device
JPS6421940A (en) Manufacture of semiconductor device
JPS56130942A (en) Manufacture of semiconductor device
JPS6419764A (en) Manufacture of semiconductor integrated circuit device
JPS5512775A (en) Manufacturing method of semiconductor
JPS5676534A (en) Manufacture of semiconductor device
JPS6417443A (en) Manufacture of semiconductor device
JPS56115566A (en) Manufacture of mos semiconductor device
JPS644048A (en) Manufacture of semiconductor integrated circuit
JPS5710246A (en) Manufacture of semiconductor device
JPS57184232A (en) Manufacture of semiconductor device
JPS5643744A (en) Manufacture of semiconductor device
JPS57173956A (en) Manufacture of semiconductor device
EP0276571A3 (en) Method of manufacturing a semiconductive device comprising a buried region
JPS57202756A (en) Manufacture of semiconductor device
JPS5548950A (en) Manufacturing of semiconductor device