JPS641954B2 - - Google Patents

Info

Publication number
JPS641954B2
JPS641954B2 JP59213304A JP21330484A JPS641954B2 JP S641954 B2 JPS641954 B2 JP S641954B2 JP 59213304 A JP59213304 A JP 59213304A JP 21330484 A JP21330484 A JP 21330484A JP S641954 B2 JPS641954 B2 JP S641954B2
Authority
JP
Japan
Prior art keywords
copper
resist
clad laminate
etching
negative pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59213304A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6190492A (ja
Inventor
Minoru Tsukagoshi
Akio Nakayama
Masahiko Minagawa
Shuji Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Priority to JP59213304A priority Critical patent/JPS6190492A/ja
Priority to US06/784,751 priority patent/US4622097A/en
Priority to CA000492678A priority patent/CA1238559A/en
Priority to KR1019850007484A priority patent/KR900001089B1/ko
Priority to EP85307304A priority patent/EP0178864B1/en
Priority to DE8585307304T priority patent/DE3582390D1/de
Publication of JPS6190492A publication Critical patent/JPS6190492A/ja
Publication of JPS641954B2 publication Critical patent/JPS641954B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59213304A 1984-10-11 1984-10-11 銅スル−ホ−ルプリント配線板の製造方法 Granted JPS6190492A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP59213304A JPS6190492A (ja) 1984-10-11 1984-10-11 銅スル−ホ−ルプリント配線板の製造方法
US06/784,751 US4622097A (en) 1984-10-11 1985-10-07 Process for producing copper through-hole printed circuit board
CA000492678A CA1238559A (en) 1984-10-11 1985-10-10 Process for producing copper through-hole printed circuit board
KR1019850007484A KR900001089B1 (ko) 1984-10-11 1985-10-11 동스로우호올프린트 배선판의 제조방법
EP85307304A EP0178864B1 (en) 1984-10-11 1985-10-11 Process for producing copper through-hole printed circuit board
DE8585307304T DE3582390D1 (de) 1984-10-11 1985-10-11 Verfahren zur herstellung von leiterplatten mit verkupferten durchgangsloechern.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59213304A JPS6190492A (ja) 1984-10-11 1984-10-11 銅スル−ホ−ルプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS6190492A JPS6190492A (ja) 1986-05-08
JPS641954B2 true JPS641954B2 (Direct) 1989-01-13

Family

ID=16636908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59213304A Granted JPS6190492A (ja) 1984-10-11 1984-10-11 銅スル−ホ−ルプリント配線板の製造方法

Country Status (6)

Country Link
US (1) US4622097A (Direct)
EP (1) EP0178864B1 (Direct)
JP (1) JPS6190492A (Direct)
KR (1) KR900001089B1 (Direct)
CA (1) CA1238559A (Direct)
DE (1) DE3582390D1 (Direct)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327091A (ja) * 1986-07-18 1988-02-04 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法
DE3885457D1 (de) * 1988-08-25 1993-12-09 Siemens Nixdorf Inf Syst Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Löträndern um die Durchkontaktierungslöcher.
DE4039271A1 (de) * 1990-12-08 1992-06-11 Basf Ag Verfahren zum schutz von kupfer- und kupferlegierungsoberlfaechen vor korrosion
US5275694A (en) * 1992-03-24 1994-01-04 Sanwa Laboratory Ltd. Process for production of copper through-hole printed wiring boards
DE59300676D1 (de) * 1992-11-23 1995-11-02 Siemens Nixdorf Inf Syst Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Lötaugen.
DE4239328C2 (de) * 1992-11-23 1994-09-08 Siemens Nixdorf Inf Syst Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Lötaugen
DE4311807C2 (de) * 1993-04-03 1998-03-19 Atotech Deutschland Gmbh Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik
JPH06287774A (ja) * 1993-04-05 1994-10-11 Metsuku Kk 銅および銅合金の表面処理剤
EP0639043A1 (de) * 1993-08-10 1995-02-15 Siemens Nixdorf Informationssysteme AG Verfahren zur Herstellung von durchkontaktierten Leiterplatten mit sehr kleinen Lötaugen
US5376189A (en) * 1993-11-08 1994-12-27 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
US5362334A (en) * 1993-12-23 1994-11-08 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
AU6268198A (en) * 1997-01-31 1998-08-25 James M. Taylor Composition and method for priming substrate materials
US6174561B1 (en) 1998-01-30 2001-01-16 James M. Taylor Composition and method for priming substrate materials
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
DE19944908A1 (de) * 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten
JP3736607B2 (ja) * 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP4309602B2 (ja) 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
AT412094B (de) * 2003-05-13 2004-09-27 Austria Tech & System Tech Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
JP5615227B2 (ja) * 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) * 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
CN102595795A (zh) * 2012-03-05 2012-07-18 同扬光电（江苏）有限公司 以纯铜板为基材制作双面柔性印刷线路板的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
JPS5932915B2 (ja) * 1981-07-25 1984-08-11 「弐」夫 甲斐 スル−ホ−ルを有する配線基板製造方法
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
US4529477A (en) * 1983-05-02 1985-07-16 Kollmorgen Technologies Corporation Process for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
EP0178864A2 (en) 1986-04-23
US4622097A (en) 1986-11-11
DE3582390D1 (de) 1991-05-08
EP0178864A3 (en) 1987-09-30
KR860003753A (ko) 1986-05-28
KR900001089B1 (ko) 1990-02-26
EP0178864B1 (en) 1991-04-03
CA1238559A (en) 1988-06-28
JPS6190492A (ja) 1986-05-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term