JPS641753A - Epoxy resin composition for glass-epoxy laminate - Google Patents
Epoxy resin composition for glass-epoxy laminateInfo
- Publication number
- JPS641753A JPS641753A JP15709487A JP15709487A JPS641753A JP S641753 A JPS641753 A JP S641753A JP 15709487 A JP15709487 A JP 15709487A JP 15709487 A JP15709487 A JP 15709487A JP S641753 A JPS641753 A JP S641753A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- bisphenol
- epoxy
- type
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000004593 Epoxy Substances 0.000 title 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 10
- 229920003986 novolac Polymers 0.000 abstract 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract 1
- -1 imidazole compound Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709487A JPS641753A (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for glass-epoxy laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15709487A JPS641753A (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for glass-epoxy laminate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH011753A JPH011753A (ja) | 1989-01-06 |
| JPS641753A true JPS641753A (en) | 1989-01-06 |
| JPH0466890B2 JPH0466890B2 (enExample) | 1992-10-26 |
Family
ID=15642116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15709487A Granted JPS641753A (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for glass-epoxy laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS641753A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158338A (ja) * | 1988-12-12 | 1990-06-18 | Toshiba Chem Corp | 耐熱性銅張積層板 |
| JPH03126550A (ja) * | 1989-10-12 | 1991-05-29 | Nippon Steel Corp | ポリオレフィン被覆鋼材 |
| JPH04202319A (ja) * | 1990-11-29 | 1992-07-23 | Mitsubishi Electric Corp | エポキシ樹脂組成物および銅張積層板 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194916A (ja) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS598719A (ja) * | 1982-07-08 | 1984-01-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS60219223A (ja) * | 1984-04-16 | 1985-11-01 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 組成物 |
| JPS60260627A (ja) * | 1984-06-07 | 1985-12-23 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
| JPS6183233A (ja) * | 1984-09-29 | 1986-04-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS6198745A (ja) * | 1984-10-22 | 1986-05-17 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
| JPS61138621A (ja) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS621720A (ja) * | 1985-06-28 | 1987-01-07 | Nippon Oil Co Ltd | エポキシ樹脂組成物 |
| JPS6215221A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6253342A (ja) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | エポキシ樹脂積層板の製造法 |
-
1987
- 1987-06-24 JP JP15709487A patent/JPS641753A/ja active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194916A (ja) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS598719A (ja) * | 1982-07-08 | 1984-01-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS60219223A (ja) * | 1984-04-16 | 1985-11-01 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 組成物 |
| JPS60260627A (ja) * | 1984-06-07 | 1985-12-23 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
| JPS6183233A (ja) * | 1984-09-29 | 1986-04-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS6198745A (ja) * | 1984-10-22 | 1986-05-17 | Hitachi Chem Co Ltd | 印刷配線板用プリプレグの製造方法 |
| JPS61138621A (ja) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
| JPS621720A (ja) * | 1985-06-28 | 1987-01-07 | Nippon Oil Co Ltd | エポキシ樹脂組成物 |
| JPS6215221A (ja) * | 1985-07-12 | 1987-01-23 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6253342A (ja) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | エポキシ樹脂積層板の製造法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158338A (ja) * | 1988-12-12 | 1990-06-18 | Toshiba Chem Corp | 耐熱性銅張積層板 |
| JPH03126550A (ja) * | 1989-10-12 | 1991-05-29 | Nippon Steel Corp | ポリオレフィン被覆鋼材 |
| JPH04202319A (ja) * | 1990-11-29 | 1992-07-23 | Mitsubishi Electric Corp | エポキシ樹脂組成物および銅張積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0466890B2 (enExample) | 1992-10-26 |
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