JPS6413737U - - Google Patents
Info
- Publication number
- JPS6413737U JPS6413737U JP1987109269U JP10926987U JPS6413737U JP S6413737 U JPS6413737 U JP S6413737U JP 1987109269 U JP1987109269 U JP 1987109269U JP 10926987 U JP10926987 U JP 10926987U JP S6413737 U JPS6413737 U JP S6413737U
- Authority
- JP
- Japan
- Prior art keywords
- electronic element
- electronic
- metal cap
- module
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109269U JPS6413737U (enExample) | 1987-07-16 | 1987-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987109269U JPS6413737U (enExample) | 1987-07-16 | 1987-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413737U true JPS6413737U (enExample) | 1989-01-24 |
Family
ID=31345358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987109269U Pending JPS6413737U (enExample) | 1987-07-16 | 1987-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413737U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113272U (ja) * | 1991-03-22 | 1992-10-02 | アルナ工機株式会社 | 車両用固定窓取付装置 |
-
1987
- 1987-07-16 JP JP1987109269U patent/JPS6413737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113272U (ja) * | 1991-03-22 | 1992-10-02 | アルナ工機株式会社 | 車両用固定窓取付装置 |
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