JPH01146545U - - Google Patents
Info
- Publication number
- JPH01146545U JPH01146545U JP1988043040U JP4304088U JPH01146545U JP H01146545 U JPH01146545 U JP H01146545U JP 1988043040 U JP1988043040 U JP 1988043040U JP 4304088 U JP4304088 U JP 4304088U JP H01146545 U JPH01146545 U JP H01146545U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- element chip
- conductive resin
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/753—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043040U JPH01146545U (enExample) | 1988-03-30 | 1988-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988043040U JPH01146545U (enExample) | 1988-03-30 | 1988-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146545U true JPH01146545U (enExample) | 1989-10-09 |
Family
ID=31269441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988043040U Pending JPH01146545U (enExample) | 1988-03-30 | 1988-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146545U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291811B1 (en) | 1997-04-09 | 2001-09-18 | Nec Corporation | Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same |
| JP2002246613A (ja) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | 光機能モジュールとその製造方法 |
| JP2004363238A (ja) * | 2003-06-03 | 2004-12-24 | Kingpak Technology Inc | 整合型のイメージセンサモジュール |
| JP2012009611A (ja) * | 2010-06-24 | 2012-01-12 | Murata Mfg Co Ltd | 回路モジュール |
-
1988
- 1988-03-30 JP JP1988043040U patent/JPH01146545U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6291811B1 (en) | 1997-04-09 | 2001-09-18 | Nec Corporation | Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same |
| JP2002246613A (ja) * | 2001-02-14 | 2002-08-30 | Seiko Instruments Inc | 光機能モジュールとその製造方法 |
| JP2004363238A (ja) * | 2003-06-03 | 2004-12-24 | Kingpak Technology Inc | 整合型のイメージセンサモジュール |
| JP2012009611A (ja) * | 2010-06-24 | 2012-01-12 | Murata Mfg Co Ltd | 回路モジュール |