JPH0385669U - - Google Patents

Info

Publication number
JPH0385669U
JPH0385669U JP1989147630U JP14763089U JPH0385669U JP H0385669 U JPH0385669 U JP H0385669U JP 1989147630 U JP1989147630 U JP 1989147630U JP 14763089 U JP14763089 U JP 14763089U JP H0385669 U JPH0385669 U JP H0385669U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
view
sectional
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989147630U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989147630U priority Critical patent/JPH0385669U/ja
Publication of JPH0385669U publication Critical patent/JPH0385669U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1989147630U 1989-12-21 1989-12-21 Pending JPH0385669U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989147630U JPH0385669U (enExample) 1989-12-21 1989-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989147630U JPH0385669U (enExample) 1989-12-21 1989-12-21

Publications (1)

Publication Number Publication Date
JPH0385669U true JPH0385669U (enExample) 1991-08-29

Family

ID=31694135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989147630U Pending JPH0385669U (enExample) 1989-12-21 1989-12-21

Country Status (1)

Country Link
JP (1) JPH0385669U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225583A (ja) * 1983-06-06 1984-12-18 Mitsubishi Electric Corp 半導体発光装置
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPS6482681A (en) * 1987-09-25 1989-03-28 Stanley Electric Co Ltd Compound lens type photodetector/light emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09116194A (ja) * 1995-10-17 1997-05-02 Alps Electric Co Ltd 発光ダイオード装置
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード

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