JPH0163140U - - Google Patents
Info
- Publication number
- JPH0163140U JPH0163140U JP1987157980U JP15798087U JPH0163140U JP H0163140 U JPH0163140 U JP H0163140U JP 1987157980 U JP1987157980 U JP 1987157980U JP 15798087 U JP15798087 U JP 15798087U JP H0163140 U JPH0163140 U JP H0163140U
- Authority
- JP
- Japan
- Prior art keywords
- envelope
- optical semiconductor
- semiconductor device
- lens
- concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157980U JPH0163140U (enExample) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157980U JPH0163140U (enExample) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163140U true JPH0163140U (enExample) | 1989-04-24 |
Family
ID=31437898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987157980U Pending JPH0163140U (enExample) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163140U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (ja) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | 発光装置および照明装置 |
| JP2018190861A (ja) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | 光学装置 |
-
1987
- 1987-10-15 JP JP1987157980U patent/JPH0163140U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (ja) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | 発光装置および照明装置 |
| JP2018190861A (ja) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | 光学装置 |