JPH0315342B2 - - Google Patents

Info

Publication number
JPH0315342B2
JPH0315342B2 JP56052023A JP5202381A JPH0315342B2 JP H0315342 B2 JPH0315342 B2 JP H0315342B2 JP 56052023 A JP56052023 A JP 56052023A JP 5202381 A JP5202381 A JP 5202381A JP H0315342 B2 JPH0315342 B2 JP H0315342B2
Authority
JP
Japan
Prior art keywords
package
polymer film
film
lead wire
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56052023A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57167664A (en
Inventor
Narikazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP56052023A priority Critical patent/JPS57167664A/ja
Publication of JPS57167664A publication Critical patent/JPS57167664A/ja
Publication of JPH0315342B2 publication Critical patent/JPH0315342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Liquid Crystal (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56052023A 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package Granted JPS57167664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052023A JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052023A JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Publications (2)

Publication Number Publication Date
JPS57167664A JPS57167664A (en) 1982-10-15
JPH0315342B2 true JPH0315342B2 (enExample) 1991-02-28

Family

ID=12903210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052023A Granted JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Country Status (1)

Country Link
JP (1) JPS57167664A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222224A (ja) * 1988-03-01 1989-09-05 Matsushita Electron Corp 液晶表示装置

Also Published As

Publication number Publication date
JPS57167664A (en) 1982-10-15

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