JPS6410935B2 - - Google Patents

Info

Publication number
JPS6410935B2
JPS6410935B2 JP15835880A JP15835880A JPS6410935B2 JP S6410935 B2 JPS6410935 B2 JP S6410935B2 JP 15835880 A JP15835880 A JP 15835880A JP 15835880 A JP15835880 A JP 15835880A JP S6410935 B2 JPS6410935 B2 JP S6410935B2
Authority
JP
Japan
Prior art keywords
die
adhesive sheet
needle
supply ring
dies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15835880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5783038A (en
Inventor
Masayuki Shimura
Yoshimitsu Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP15835880A priority Critical patent/JPS5783038A/ja
Publication of JPS5783038A publication Critical patent/JPS5783038A/ja
Publication of JPS6410935B2 publication Critical patent/JPS6410935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Dicing (AREA)
  • Die Bonding (AREA)
JP15835880A 1980-11-11 1980-11-11 Method for die pick-up Granted JPS5783038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15835880A JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Publications (2)

Publication Number Publication Date
JPS5783038A JPS5783038A (en) 1982-05-24
JPS6410935B2 true JPS6410935B2 (enFirst) 1989-02-22

Family

ID=15669918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15835880A Granted JPS5783038A (en) 1980-11-11 1980-11-11 Method for die pick-up

Country Status (1)

Country Link
JP (1) JPS5783038A (enFirst)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974733U (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 チツプ分離機構
JPH0642341Y2 (ja) * 1984-07-20 1994-11-02 日本電気株式会社 マウント装置
JP2619443B2 (ja) * 1987-12-14 1997-06-11 ローム株式会社 ペレットのピックアップ方法
KR100346482B1 (ko) * 1994-12-03 2002-11-23 앰코 테크놀로지 코리아 주식회사 다이본딩의이젝팅장치

Also Published As

Publication number Publication date
JPS5783038A (en) 1982-05-24

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