JPH0144018B2 - - Google Patents

Info

Publication number
JPH0144018B2
JPH0144018B2 JP58217581A JP21758183A JPH0144018B2 JP H0144018 B2 JPH0144018 B2 JP H0144018B2 JP 58217581 A JP58217581 A JP 58217581A JP 21758183 A JP21758183 A JP 21758183A JP H0144018 B2 JPH0144018 B2 JP H0144018B2
Authority
JP
Japan
Prior art keywords
wafer sheet
wafer
pellet
sheet
annular portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58217581A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60110135A (ja
Inventor
Yoshimitsu Kushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58217581A priority Critical patent/JPS60110135A/ja
Publication of JPS60110135A publication Critical patent/JPS60110135A/ja
Publication of JPH0144018B2 publication Critical patent/JPH0144018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Dicing (AREA)
JP58217581A 1983-11-18 1983-11-18 ペレットピックアップ装置 Granted JPS60110135A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Publications (2)

Publication Number Publication Date
JPS60110135A JPS60110135A (ja) 1985-06-15
JPH0144018B2 true JPH0144018B2 (enFirst) 1989-09-25

Family

ID=16706519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58217581A Granted JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Country Status (1)

Country Link
JP (1) JPS60110135A (enFirst)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179751U (enFirst) * 1985-04-26 1986-11-10
JPS63102237U (enFirst) * 1986-12-23 1988-07-02
JPH069219B2 (ja) * 1987-12-28 1994-02-02 株式会社新川 ウエハー供給装置
JP4515041B2 (ja) * 2003-04-24 2010-07-28 キヤノンマシナリー株式会社 ウェーハシートのエキスパンド装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504543A (enFirst) * 1973-05-16 1975-01-17
JPS544062A (en) * 1977-06-13 1979-01-12 Hitachi Ltd Wafer extender
JPS5728949A (en) * 1980-07-30 1982-02-16 Saburo Kano Finishing hot water or shower apparatus annexed to external furnace type bathtub

Also Published As

Publication number Publication date
JPS60110135A (ja) 1985-06-15

Similar Documents

Publication Publication Date Title
US4556362A (en) Methods of and apparatus for handling semiconductor devices
WO2004038779A1 (ja) エキスパンド方法及びエキスパンド装置
JP6844992B2 (ja) ウェーハの加工方法
JP4739900B2 (ja) 転着装置及び転着方法
JP2004193493A (ja) ダイピックアップ方法および装置
JPH09219383A (ja) 半導体装置の製造方法及び製造装置
JPS621242A (ja) 半導体ウエハにテ−プ又はシ−トを接着する方法及び装置
JPH0144018B2 (enFirst)
JP2001196443A (ja) 半導体チップのピックアップ装置およびピックアップ方法
JPH09181150A (ja) 半導体チップのピックアップ装置及びこれを用いたピックアップ方法
JP2002353296A (ja) ウェハの保護テープ剥離装置およびウェハのマウント装置
JPH07122583A (ja) 半導体装置の製造方法及び半導体製造装置
JPH0376139A (ja) 半導体素子突上げ方法
JP2652983B2 (ja) ペレット突上げ機構
JPS6329412B2 (enFirst)
JPH03177051A (ja) 半導体ウエハの切断方法およびその装置
KR20100005864A (ko) 접착 필름이 장착된 디바이스의 픽업 방법
JPH0878366A (ja) 半導体ウエハへのテープ貼付装置
JPS6242379B2 (enFirst)
US4936944A (en) Wafer supplying apparatus
KR20210076472A (ko) 다이 픽업 장치 및 다이 픽업 장치의 동작방법
JPH09147786A (ja) 基板保持方法および該方法に用いる基板保持機構
JPH04192348A (ja) テープチップの剥離方法および装置
CN222168347U (zh) 光器件载体芯片引线键合固定治具
CN217394211U (zh) 一种取件螺母组装集成

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees