JPS60110135A - ペレットピックアップ装置 - Google Patents

ペレットピックアップ装置

Info

Publication number
JPS60110135A
JPS60110135A JP58217581A JP21758183A JPS60110135A JP S60110135 A JPS60110135 A JP S60110135A JP 58217581 A JP58217581 A JP 58217581A JP 21758183 A JP21758183 A JP 21758183A JP S60110135 A JPS60110135 A JP S60110135A
Authority
JP
Japan
Prior art keywords
wafer sheet
wafer
pellets
sheet
ring portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58217581A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144018B2 (enFirst
Inventor
Yoshimitsu Kushima
久島　義光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58217581A priority Critical patent/JPS60110135A/ja
Publication of JPS60110135A publication Critical patent/JPS60110135A/ja
Publication of JPH0144018B2 publication Critical patent/JPH0144018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Dicing (AREA)
JP58217581A 1983-11-18 1983-11-18 ペレットピックアップ装置 Granted JPS60110135A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58217581A JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Publications (2)

Publication Number Publication Date
JPS60110135A true JPS60110135A (ja) 1985-06-15
JPH0144018B2 JPH0144018B2 (enFirst) 1989-09-25

Family

ID=16706519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58217581A Granted JPS60110135A (ja) 1983-11-18 1983-11-18 ペレットピックアップ装置

Country Status (1)

Country Link
JP (1) JPS60110135A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179751U (enFirst) * 1985-04-26 1986-11-10
JPS63102237U (enFirst) * 1986-12-23 1988-07-02
JPH01173737A (ja) * 1987-12-28 1989-07-10 Shinkawa Ltd ウエハー供給装置
JP2004327714A (ja) * 2003-04-24 2004-11-18 Nec Machinery Corp ウェーハシートのエキスパンド装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504543A (enFirst) * 1973-05-16 1975-01-17
JPS544062A (en) * 1977-06-13 1979-01-12 Hitachi Ltd Wafer extender
JPS5728949A (en) * 1980-07-30 1982-02-16 Saburo Kano Finishing hot water or shower apparatus annexed to external furnace type bathtub

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504543A (enFirst) * 1973-05-16 1975-01-17
JPS544062A (en) * 1977-06-13 1979-01-12 Hitachi Ltd Wafer extender
JPS5728949A (en) * 1980-07-30 1982-02-16 Saburo Kano Finishing hot water or shower apparatus annexed to external furnace type bathtub

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179751U (enFirst) * 1985-04-26 1986-11-10
JPS63102237U (enFirst) * 1986-12-23 1988-07-02
JPH01173737A (ja) * 1987-12-28 1989-07-10 Shinkawa Ltd ウエハー供給装置
JP2004327714A (ja) * 2003-04-24 2004-11-18 Nec Machinery Corp ウェーハシートのエキスパンド装置

Also Published As

Publication number Publication date
JPH0144018B2 (enFirst) 1989-09-25

Similar Documents

Publication Publication Date Title
EP1523029A3 (en) Method for separating semiconductor wafer from supporting member, and apparatus using the same
DE10139092A1 (de) Halbleiterchip-Aufnahmeverfahren
JP2004193493A (ja) ダイピックアップ方法および装置
JP4238669B2 (ja) エキスパンド方法及びエキスパンド装置
JPS60110135A (ja) ペレットピックアップ装置
JPH09181150A (ja) 半導体チップのピックアップ装置及びこれを用いたピックアップ方法
JPH0541451A (ja) 半導体ウエハのペレタイズ方法と装置
CN113192851B (zh) 一种晶圆的封装方法
JPH0697212A (ja) ダイボンディング装置および前記装置を使用した半導体装置の製造方法
KR100817068B1 (ko) 박형의 반도체 칩 픽업 장치 및 방법
JP4093297B2 (ja) 半導体製造装置
JP2002353296A (ja) ウェハの保護テープ剥離装置およびウェハのマウント装置
JPH07122583A (ja) 半導体装置の製造方法及び半導体製造装置
JPH0376139A (ja) 半導体素子突上げ方法
DE102016110503B4 (de) Wafer-Expander und Verfahren zum Expandieren von Chips eines Wafers
JPS6329412B2 (enFirst)
JPH1092907A (ja) 半導体チップのピックアップユニット及びそのピックア ップ方法
JPH04192348A (ja) テープチップの剥離方法および装置
CN117672898A (zh) 磁性电子元件的巨量转移方法及装置
JPS6329948A (ja) 半導体装置の製造方法
JPS62152814A (ja) 半導体ウエハのダイシング方法
JPH01268147A (ja) チップ突上げ用コマ
JP3075654U (ja) ダイサ
KR200363934Y1 (ko) 다이 본더의 백업 홀더 구조
JPH01205441A (ja) 半導体素子ウェハーの切削分割装置用ステージ

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees